Laser processing apparatus and wafer producing method

Patent metadata

Field	Value
Publication number	US-10870169-B2
Application number	US-201715601321-A
Country	US
Kind code	B2
Filing date	May 22, 2017
Priority date	May 30, 2016
Publication date	Dec 22, 2020
Grant date	Dec 22, 2020

Abstract

A laser processing apparatus for producing a GaN wafer from a GaN ingot includes a laser beam irradiating unit configured to apply a laser beam having a wavelength capable of passing through the GaN ingot held by a chuck table. The laser beam irradiating unit includes a laser oscillator configured to oscillate the laser beam. The laser oscillator includes a seeder configured to oscillate a high-frequency pulsed laser, a thinning-out unit configured to thin out high-frequency pulses oscillated by the seeder at a predetermined repetition frequency, and generate one burst pulse with a plurality of high-frequency pulses as sub-pulses, and an amplifier configured to amplify the generated burst pulse.

First claim

What is claimed is:

1. A laser processing apparatus suitable for producing a GaN wafer from a GaN ingot, the laser processing apparatus comprising:
a chuck table configured to hold the ingot;
laser beam irradiating means for applying a laser beam having a wavelength capable of passing through the GaN ingot held by the chuck table,
the laser beam irradiating means including
a laser oscillator configured to oscillate the laser beam, and
a condenser configured to form a destruction layer in an interface at a depth corresponding to a thickness of the GaN wafer to be produced, by applying the laser beam oscillated by the laser oscillator while positioning a focusing point of the laser beam within the GaN ingot,
the laser oscillator including:
a seeder configured to oscillate a high-frequency pulsed laser,
a thinning-out unit configured to thin out high-frequency pulses oscillated by the seeder at a predetermined repetition frequency, and generate one burst pulse with a plurality of high-frequency pulses as sub-pulses, and
an amplifier configured to amplify the generated burst pulse; and

peeling means including a suction piece with vibration applying means said suction piece configured to hold the ingot and said vibration applying means applies vibration to the ingot while said suction piece moves to separate the GaN wafer from the ingot.

2. The laser processing apparatus according to claim 1 , wherein the thinning-out unit thins out the high-frequency pulses so as to generate the burst pulse in which, of two to ten as numbers of sub-pulses constituting one burst pulse, the number of sub-pulses that cause the destruction layer to extend longest at a position of the interface at which the focusing point is positioned is set.

3. The laser processing apparatus according to claim 2 , wherein the number of sub-pulses that cause the destruction layer to extend longest is three.

4. The laser processing apparatus according to claim 1 , wherein said laser beam irradiating means applies the laser beam to the ingot and rotates the chuck table to form a laser processing trace gradually inward in a spiral shape on the ingot.

5. The laser processing apparatus according to claim 1 , wherein said laser beam irradiating means applies the laser beam to a center of the ingot and rotates the chuck table to form a laser processing trace gradually outward in a spiral shape on the ingot.

6. The laser processing apparatus according to claim 1 , wherein said laser beam irradiating means applies the laser beam to the ingot while moving the chuck table in the X and Y directions.

7. A GaN wafer producing method for producing a GaN wafer from a GaN ingot, the GaN wafer producing method comprising:
a holding step of holding the GaN ingot by a chuck table;
a laser beam irradiating step of using a condenser configured for forming a destruction layer in an interface at a depth corresponding to a thickness of the GaN wafer to be produced, by applying a laser beam having a wavelength capable of passing through the GaN ingot held by the chuck table while positioning a focusing point of the laser beam within the GaN ingot; and
a wafer peeling step of holding the GaN ingot using a suction piece and applying vibration to the ingot using vibration applying means while moving said suction piece to peel off the GaN wafer from the GaN ingot;
oscillating the laser beam using a laser oscillator including a seeder configured to oscillate a high-frequency pulsed laser, a thinning-out unit configured to thin out high-frequency pulses oscillated by the seeder at a predetermined repetition frequency, and generate one burst pulse with a plurality of high-frequency pulses as sub-pulses, and an amplifier configured to amplify the generated burst pulse.

8. The GaN wafer producing method according to claim 7 , wherein the thinning-out unit thins out the high-frequency pulses so as to generate the burst pulse in which, of two to ten as numbers of sub-pulses constituting one burst pulse, the number of sub-pulses that cause the destruction layer to extend longest at a position of the interface at which the focusing point is positioned is set.

9. The GaN wafer producing method according to claim 8 , wherein the number of sub-pulses that cause the destruction layer to extend longest is three.

10. The GaN wafer producing method according to claim 8 , wherein said laser beam irradiating step includes applying the laser beam to a center of the ingot while rotating the chuck table to form a laser processing trace gradually outward in a spiral shape on the ingot.

11. The GaN wafer producing method according to claim 8 , wherein said laser beam irradiating step includes applying the laser beam to the ingot while rotating the chuck table to form a laser processing trace gradually inward in a spiral shape on the ingot.

12. The GaN wafer producing method according to claim 8 , wherein said laser beam irradiating step includes applying the laser beam to the ingot while moving the chuck table in the X and Y directions.

Assignees

• Disco Corp

Inventors

• Hirata Kazuya
• Yubira Yasuyoshi

Classifications

• H10P90/00

  Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement · CPC title

• B23K26/0622 Primary

  by shaping pulses · CPC title

• B23K26/0823

  Devices involving rotation of the workpiece · CPC title

• H01S3/1003

  tunable optical elements, e.g. acousto-optic filters, tunable gratings · CPC title

• B23K26/53

  for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks · CPC title