Aluminium-silicon carbide composite, and power-module base plate
US-2017107158-A1 · Apr 20, 2017 · US
Heat-dissipating component and method for manufacturing same
US10869413B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10869413-B2 |
| Application number | US-201515322494-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 3, 2015 |
| Priority date | Jul 4, 2014 |
| Publication date | Dec 15, 2020 |
| Grant date | Dec 15, 2020 |
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- Title
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Abstract
Official abstract text for this publication.
A heat-dissipating component, and a method for manufacturing the same, the component provided with a composited portion including a plate-shaped molded body containing silicon carbide, and hole-formation portions formed in a peripheral edge portion of the composited portion; through-holes being formed in the hole formation sections; the hole-formation portions containing inorganic fibers; the molded body and the inorganic fibers being impregnated with an aluminum-containing metal; and the hole-formation portions forming a part of the outer peripheral surface of the heat-dissipating component.
First claim
Opening claim text (preview).
The invention claimed is: 1. A manufacturing method of a heat-dissipating component, comprising forming a plate-shaped molded body having notch portions and comprising silicon carbide, disposing inorganic fibers at the notch portions of the molded body, forming a composited portion and hole-formation portions by impregnating the molded body and the inorganic fibers with an aluminum-containing metal, and cutting out the molded body in the shape of a plate-shaped heat-dissipat…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- B22D19/14Primary
Operations & Transport · mapped topic
Chemistry & Metallurgy · mapped topic
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- What does patent US10869413B2 cover?
- A heat-dissipating component, and a method for manufacturing the same, the component provided with a composited portion including a plate-shaped molded body containing silicon carbide, and hole-formation portions formed in a peripheral edge portion of the composited portion; through-holes being formed in the hole formation sections; the hole-formation portions containing inorganic fibers; the m…
- Who is the assignee on this patent?
- Denka Company Ltd
- What technology area does this patent fall under?
- Primary CPC classification B22D19/14. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Dec 15 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).