Film for applying compressive stress to ceramic materials

US10868899B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10868899-B2
Application numberUS-201816015428-A
CountryUS
Kind codeB2
Filing dateJun 22, 2018
Priority dateJun 23, 2017
Publication dateDec 15, 2020
Grant dateDec 15, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method to provide compressive stress to substrates includes depositing a film on a ceramic substrate at a deposition temperature (Td) to form an article, the film having a difference relative to the ceramic substrate at Td in a coefficient thermal expansion (CTE) of at least 1.0×10−6/K and a difference in a refractive index >0.10. At least a portion of the thickness the film is converted in at least one of composition, phase and microstructure by lowering or raising the temperature from Td to reach a changed temperature (Tc) that is at least 100° C. different from Td. The film converting conditions result in the converted film portion providing a difference in refractive index at the Tc between the converted film and the ceramic substrate of ≤|0.10|. The temperature of the article is then lowered to room temperature.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method to provide compressive stress to substrates, comprising: depositing a nitride film on a ceramic substrate at a deposition temperature (Td) to form an article, said nitride film having a difference in a coefficient thermal expansion (CTE) relative to said ceramic substrate at said Td of at least 1.0×10−6/K and a difference in a refractive index of greater than (>) 0.10; converting said nitride film comprising lowering or raising a temperature from said Td to reach a changed temperature (Tc) that is at least 100° C. different from said Td, wherein conditions for said converting result in said nitride film becoming in at least a portion of its thickness a converted film through a composition change such that there is an increase in oxygen content by at least (≥) 10 mole percent, a decrease in nitrogen content by at least (≥) 10 mole percent, or a decrease in carbon content by at least (≥) 10 mole percent, so that a difference in said refractive index at said Tc of said converted film and said ceramic substrate is ≤|0.10|, and lowering a temperature of said article from said Tc to room temperature, wherein said nitride film is an AlO a N b film, wherein a+b<1.5, a SiCON film, or a SiAlCON film. 2. The method of claim 1 , wherein said substrate comprises sapphire. 3. The method of claim 1 , wherein said converting comprises flowing one or more of carbon, oxygen or nitrogen containing gases. 4. The method of claim 1 , wherein said article is optically transparent. 5. The method of claim 1 , wherein said substrate comprises a silica-based glass, sapphire, alumina, or a spinel. 6. The method of claim 1 , wherein said portion of said converted film is under a compressive stress, and wherein said substrate is under a tensile stress. 7. The method of claim 1 , wherein said article comprises a display screen of a cellular phone. 8. The method of claim 1 , wherein said portion of said converted film is from 10% to 80%. 9. The method of claim 1 , wherein after said converting said difference in said refractive index of said nitride film and said ceramic substrate is <10.051. 10. The method of claim 1 , wherein, after said converting of said nitride film, a compressive stress in said film is 1 MPa to 10 GPa. 11. The method of claim 1 , wherein said nitride film is an AlO a N b film, wherein a+b<1.5 and wherein said converted film is an AlO x N y film wherein x+y<1.5 and wherein x>a and y<b. 12. The method of claim 11 , wherein a is from 0 to 0.5. 13. The method of claim 11 , wherein a=0. 14. The method of claim 11 , wherein x is from 0.5 to 1.5. 15. The method of claim 11 , wherein x=1.5 and y=0. 16. The method of claim 1 , wherein said nitride film is a SiCON film and wherein said converted film is SiO x N y film, wherein x+y<2.

Assignees

Inventors

Classifications

  • H04M1/0266Primary

    for a display module assembly · CPC title

  • Details related to the display arrangement, including those related to the mounting of the display in the housing · CPC title

  • After-treatment of single crystals or homogeneous polycrystalline material with defined structure (C30B31/00 takes precedence) · CPC title

  • Aluminium oxides · CPC title

  • Oxynitrides · CPC title

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What does patent US10868899B2 cover?
A method to provide compressive stress to substrates includes depositing a film on a ceramic substrate at a deposition temperature (Td) to form an article, the film having a difference relative to the ceramic substrate at Td in a coefficient thermal expansion (CTE) of at least 1.0×10−6/K and a difference in a refractive index >0.10. At least a portion of the thickness the film is converted in a…
Who is the assignee on this patent?
Sinmat Inc, Univ Florida, Entegris Inc
What technology area does this patent fall under?
Primary CPC classification H04M1/0266. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 15 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).