Line card chassis, multi-chassis cluster router, routing selecting, and packet processing

Patent metadata

Field	Value
Publication number	US-10868774-B2
Application number	US-201615778396-A
Country	US
Kind code	B2
Filing date	Nov 24, 2016
Priority date	Nov 24, 2015
Publication date	Dec 15, 2020
Grant date	Dec 15, 2020

Abstract

Disclosed is a line card frame. The line card frame internally comprises a line card unit, a switching unit, and an optical fiber interface unit. The switching unit internally comprises a switching chip module and an onboard optical component module, the onboard optical component module being used for realizing mutual conversion of an optical signal and an electrical signal; an electrical signal interface of the onboard optical component module is connected to the switching chip module having an exchange routing function, and the switching chip module is connected to the line card unit by means of an electric connector; an optical signal interface of the onboard optical component module is connected to the optical fiber interface unit by means of an optical connector; and the optical fiber interface unit connects the optical signal to a cluster interface on a router panel by means of an optical fiber, and the cluster interface is used for realizing the cascading between different frames of a router. Also disclosed are a router applying the line card frame, a routing method, and a message processing method.

First claim

The invention claimed is:

1. A line card chassis, wherein the line card chassis comprising line card units, switch fabric units, and optical fiber interface units;
the switch fabric unit comprises a switch fabric chip module and an onboard optical assembly module, wherein the onboard optical assembly module is used for mutual conversion between an optical signal and an electrical signal; an electrical signal interface of the onboard optical assembly module is connected to the switch fabric chip module which has a switching and route-selecting function, and the switch fabric chip module is connected to the line card unit through an electrical connector; and an optical signal interface of the onboard optical assembly module is connected to the optical fiber interface unit through an optical connector; and the optical fiber interface unit is to couple the optical signal to a cluster interface on a panel of a router through an optical fiber; and the cluster interface is to concatenate different chassis of the router;
wherein the line card units comprise packet processing modules; a respective cluster interface in the line card chassis has signal transmission channels with all the packet processing modules in the line card chassis;
wherein the respective cluster interface has signal transmission channels with all the switch fabric chip modules in the line card chassis; and/or the respective packet processing module in the line card chassis has signal transmission channels with all the switch fabric chip modules in the line card chassis.

2. The line card chassis of claim 1 , wherein the line card chassis further comprises fan units; the line card chassis adopts a 3-level slot structure, where the line card unit or optical fiber interface unit occupies one first-level slot, the switch fabric unit occupies one second-level slot, and the fan unit occupies a third-level slot; the line card unit and the switch fabric unit are connected using an orthogonal electrical connection without a back board, and the optical fiber interface unit and the switch fabric unit are connected through an optical connection.

3. The line card chassis of claim 1 , wherein bandwidths of links in an ingress direction and in an egress direction of a respective switch fabric chip module are equal.

4. The line card chassis of claim 1 , wherein on an electrical signal transmission path between the onboard optical assembly module and the switch fabric chip module, a signal conditioning circuit is comprised; and/or on an electrical signal transmission path between the switch fabric chip module and the packet processing module, a signal conditioning circuit is comprised.

5. The line card chassis of claim 1 , wherein the onboard optical assembly module and the optical connector are crossly connected through a multi-cord breakout optical fiber.

6. A multi-chassis cluster router, comprising multiple chassis which are concatenated to each other, wherein each chassis of the multi-chassis cluster router comprises a line card chassis,
wherein the line card chassis comprises line card units, switch fabric units, and optical fiber interface units;
wherein the switch fabric unit comprises a switch fabric chip module and an onboard optical assembly module, wherein the onboard optical assembly module is used for mutual conversion between an optical signal and an electrical signal; an electrical signal interface of the onboard optical assembly module is connected to the switch fabric chip module which has a switching and route-selecting function, and the switch fabric chip module is connected to the line card unit through an electrical connector; and an optical signal interface of the onboard optical assembly module is connected to the optical fiber interface unit through an optical connector; and the optical fiber interface unit is to couple the optical signal to a cluster interface on a panel of the multi-chassis cluster router through an optical fiber; and the cluster interface is to concatenate different chassis of the multi-chassis cluster router;
wherein the line card units comprise packet processing modules; a respective cluster interface in the line card chassis has signal transmission channels with all the packet processing modules in the line card chassis;
wherein the respective cluster interface has signal transmission channels with all the switch fabric chip modules in the line card chassis; and/or the respective packet processing module in the line card chassis has signal transmission channels with all the switch fabric chip modules in the line card chassis.

7. The multi-chassis cluster router of claim 6 , wherein the line card chassis further comprises fan units; the line card chassis adopts a 3-level slot structure, wherein the line card unit or the optical fiber interface unit occupies one first-level slot, the switch fabric unit occupies one second-level slot, and the fan unit occupies a third-level slot; the line card unit and the switch fabric unit are connected using an orthogonal electrical connection without a back board, and the optical fiber interface unit and the switch fabric unit are connected through an optical connection.

8. The multi-chassis cluster router of claim 6 , wherein bandwidths of links in an ingress direction and in an egress direction of a respective switch fabric chip module are equal.

9. The multi-chassis cluster router of claim 6 , wherein on an electrical signal transmission path between the onboard optical assembly module and the switch fabric chip module, a signal conditioning circuit is comprised; and/or on an electrical signal transmission path between the switch fabric chip module and the packet processing module, a signal conditioning circuit is comprised.

10. The multi-chassis cluster router of claim 6 , wherein the onboard optical assembly module and the optical connector are crossly connected through a multi-cord breakout optical fiber.

11. A line card chassis route-selecting method for different route selections of an egress line card chassis and an ingress line card chassis,
wherein each of the egress line card chassis and the ingress line card chassis is configured to have line card units, switch fabric units, and optical fiber interface units;
wherein the switch fabric unit comprises a switch fabric chip module and an onboard optical assembly module, wherein the onboard optical assembly module is used for mutual conversion between an optical signal and an electrical signal; an electrical signal interface of the onboard optical assembly module is connected to the switch fabric chip module which has a switching and route-selecting function, and the switch fabric chip module is connected to the line card unit through an electrical connector; and an optical signal interface of the onboard optical assembly module is connected to the optical fiber interface unit through an optical connector; and the optical fiber interface unit is to couple the optical signal to a cluster interface on a panel of a router through an optical fiber; and the cluster interface is to concatenate different chassis of the router;
wherein the line card units comprise packet processing modules; a respective cluster interface in the line card chassis has signal transmission channels with all the packet processing modules in the line card chassis;
wherein the respective cluster interface has signal transmission channels with all the switch fabric chip modules in the line card chassis; and/or the respective packet processing module in the line card chassis has signal transmission channels with all the switch fabric chip modules in the line card chassis,
the method comprising the following steps:
on a packet transmission direction, after

Assignees

• New H3C Tech Co Ltd

Inventors

• Yang Wu

Classifications

• H04L49/10 Primary

  characterised by the switching fabric construction · CPC title

• H04L49/40 Primary

  Constructional details, e.g. power supply, mechanical construction or backplane · CPC title

• H04Q2011/0052

  Interconnection of switches · CPC title

• H04B10/801

  using optical interconnects, e.g. light coupled isolators, circuit board interconnections · CPC title

• H04Q11/0066

  Provisions for optical burst or packet networks · CPC title