Package structure, package-on-package structure and method of fabricating the same

Patent metadata

Field	Value
Publication number	US-10867966-B2
Application number	US-201916398138-A
Country	US
Kind code	B2
Filing date	Apr 29, 2019
Priority date	Apr 29, 2019
Publication date	Dec 15, 2020
Grant date	Dec 15, 2020

Abstract

A package structure includes a first semiconductor die, a second semiconductor die, an insulating encapsulant and a redistribution layer. The first semiconductor die has first conductive posts and a first protection layer laterally surrounding the first conductive posts. The second semiconductor die is embedded in the first protection layer and surrounded by the first conductive posts of the first semiconductor die, wherein the second semiconductor die includes second conductive posts. The insulating encapsulant is encapsulating the first semiconductor die and the second semiconductor die. The redistribution layer is disposed on the insulating encapsulant and connected with the first conductive posts and the second conductive posts, wherein the first semiconductor die is electrically connected with the second semiconductor die through the first conductive posts, the redistribution layer and the second conductive posts.

First claim

What is claimed is:

1. A package structure, comprising:
a first semiconductor die, having a plurality of first conductive posts and a first protection layer laterally surrounding the plurality of first conductive posts;
at least one second semiconductor die, embedded in the first protection layer and surrounded by the plurality of first conductive posts of the first semiconductor die, wherein the at least one second semiconductor die comprises a plurality of second conductive posts and a second protection layer laterally surrounding the plurality of second conductive posts, and the second protection layer of the at least one second semiconductor die is located between the plurality of second conductive posts and the first protection layer of the first semiconductor die;
an insulating encapsulant encapsulating the first semiconductor die and the at least one second semiconductor die; and
a redistribution layer, disposed on the insulating encapsulant and connected with the plurality of first conductive posts and the plurality of second conductive posts, wherein the first semiconductor die is electrically connected with the at least one second semiconductor die through the plurality of first conductive posts, the redistribution layer and the plurality of second conductive posts.

2. The package structure according to claim 1 , wherein the at least one second semiconductor die includes two or more second semiconductor dies embedded in the first protection layer of the first semiconductor die, and the plurality of first conductive posts surrounds the two or more second semiconductor dies.

3. The package structure according to claim 1 , further comprising a die attach film located in between a backside of the second semiconductor die and a passivation layer of the first semiconductor die, and the at least one second semiconductor die is attached to the passivation layer of the first semiconductor die through the die attach film.

4. The package structure according to claim 1 , wherein a backside of the at least one second semiconductor die is attached to a passivation layer of the first semiconductor die through fusion bonding.

5. The package structure according to claim 1 , wherein tops of the plurality of first conductive posts are levelled with tops of the plurality of second conductive posts.

6. The package structure according to claim 1 , further comprising a plurality of through insulator vias penetrating through the insulating encapsulant and a backside redistribution layer disposed on the insulating encapsulant and connected with the plurality of through insulator vias.

7. A package-on-package structure, comprising:
a first package and a second package stacked on the first package, wherein the second package comprises a plurality of conductive balls electrically connected to the first package,
wherein the first package comprises:
at least one stacked die unit, including:
a first semiconductor die, having a plurality of first conductive pads, a first passivation layer covering portions of the plurality of first conductive pads, a plurality of through vias disposed on the first passivation layer and electrically connected to the plurality of first conductive pads, and a protection layer disposed on the first passivation layer and covering the plurality of through vias; and
at least one second semiconductor die stacked on the first semiconductor die, wherein the at least one second semiconductor die comprises a plurality of second conductive pads, a second passivation layer covering portions of the plurality of second conductive pads and a plurality of conductive posts disposed on the second passivation layer and electrically connected to the plurality of second conductive pads, wherein the protection layer of the first semiconductor die covers the at least one second semiconductor die;

an insulating encapsulant having a first surface and a second surface opposite to the first surface, wherein the insulating encapsulant encapsulates the at least one stacked die unit; and
a redistribution layer disposed on the first surface of the insulating encapsulant and electrically connected to the plurality of through vias and the plurality of conductive posts.

8. The package-on-package structure according to claim 7 , wherein the first package further comprises:
a plurality of through insulator vias embedded within the insulating encapsulant; and
a backside redistribution layer disposed on the second surface of the insulating encapsulant, and the plurality of conductive balls of the second package is electrically connected to the backside redistribution layer of the first package through the plurality of through insulator vias.

9. The package-on-package structure according to claim 7 , wherein two of the second semiconductor dies are disposed on the first passivation layer, and the plurality of through vias surrounds the second semiconductor dies.

10. The package-on-package structure according to claim 7 , further comprising:
a third semiconductor die stacked on the at least one second semiconductor die, wherein the third semiconductor die comprises a plurality of third conductive pads, a third passivation layer covering portions of the plurality of third conductive pads, and the plurality of conductive posts of the at least one second semiconductor die surrounds the third semiconductor die.

11. The package-on-package structure according to claim 7 , further comprising:
a third semiconductor die disposed on the first semiconductor die adjacent to the at least one second semiconductor die, wherein the third semiconductor die comprises a plurality of third conductive pads, a third passivation layer covering portions of the plurality of third conductive pads, and wherein the plurality of through vias of the first semiconductor die surrounds the third semiconductor die.

12. The package-on-package structure according to claim 7 , further comprising a passive device disposed on the first passivation layer of the first semiconductor die and embedded within the protection layer.

13. The package-on-package structure according to claim 7 , wherein a backside of at least one second semiconductor die is attached to the first passivation layer of the first semiconductor die through fusion bonding.

14. The package-on-package structure according to claim 7 , wherein the first package comprises at least two stacked die units, and a number of stacked semiconductor dies in one of the stacked die unit is different than a number of stacked semiconductor dies in another one of the stacked die unit.

15. The package structure according to claim 1 , wherein the first semiconductor die further comprises a first semiconductor substrate and a first interconnection layer disposed on the first semiconductor substrate, wherein the plurality of first conductive posts is electrically connected to the first interconnection layer.

16. The package structure according to claim 15 , wherein the at least one second semiconductor die further comprises a second semiconductor substrate and a second interconnection layer disposed on the second semiconductor substrate, wherein the plurality of second conductive posts is electrically connected to the second interconnection layer, and the first protection layer is laterally surrounding the second semiconductor substrate and the second interconnection layer.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Hsien-Wei
• Chen Ming-Fa
• Yeh Sung-Feng
• Shih Chao-Wen

Classifications

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W90/28

  the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape · CPC title

• H10W70/099

  Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title