Component carrier comprising at least one heat pipe and method for producing said component carrier

Patent metadata

Field	Value
Publication number	US-10867888-B2
Application number	US-202016852337-A
Country	US
Kind code	B2
Filing date	Apr 17, 2020
Priority date	Sep 30, 2016
Publication date	Dec 15, 2020
Grant date	Dec 15, 2020

Abstract

The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.

First claim

The invention claimed is:

1. A component carrier comprising:
a component carrier body having at least one inner layer and at least one outer layer;
at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter;
wherein the at least one heat pipe is associated with said component carrier body by a means chosen from the group consisting of: embedded within a recess of the at least one inner layer of said component carrier body, and surface-mounted on the at least one outer layer of said component carrier body;
at least one solid adapter that is disposed in direct contact with and is one of either positively connected to or firmly bonded with at least a portion of the largely cylindrical heat pipe section; and
wherein the at least one solid adapter thermoconductively couples at least the largely cylindrical heat pipe section of the heat pipe with the at least one inner or outer layer of the component carrier body.

2. The component carrier of claim 1 , wherein the at least one adapter at least partly encloses the perimeter of at least a portion of the at least one largely cylindrical heat pipe section of the at least one heat pipe.

3. The component carrier of claim 1 , wherein the at least one adapter completely encloses the perimeter of at least a portion of the at least one largely cylindrical heat pipe section of the at least one heat pipe.

4. The component carrier of claim 1 , wherein the at least one adapter abuts the perimeter of at least a portion of at least one planar layer of the component carrier.

5. The component carrier of claim 1 , wherein the at least one adapter is made in one piece and comprises an adapter through-hole configured to receive at least a portion of the largely cylindrical heat pipe section and to surround a perimeter thereof.

6. The component carrier of claim 1 , wherein the at least one adapter is formed of at least two parts configured to cooperatively receive at least a portion of the largely cylindrical heat pipe section and to surround the perimeter thereof.

7. The component carrier claim 1 , wherein the at least one heat pipe and the at least one solid adapter are embedded within a recess filled up with heat conductive material.

8. The component carrier of claim 1 , wherein the at least one heat pipe and the at least one solid adapter are embedded within a recess comprising at least one edge covered by at least one edge plating layer.

9. The component of claim 7 , wherein the recess of the component carrier is at least partially covered by a conducting metal layer.

10. The component carrier of claim 8 , wherein the recess of the component carrier is at least partially covered by a conducting metal layer.

11. The component carrier of claim 7 , wherein the solid adapter or the heat conductive material is connected to an outer layer by means of thermal vias.

12. The component carrier of claim 8 , wherein the solid adapter is connected to an outer layer by means of thermal vias.

13. The component carrier of claim 9 , wherein the solid adapter or the heat conductive material is connected to an outer layer by means of thermal vias.

14. The component carrier of claim 4 , wherein the at least one adapter is formed of a metal selected from the group consisting of copper, bonded copper, and insulated metal substrate.

15. A method for producing a component carrier with at least one surface-mounted heat pipe, comprising:
providing at least one heat pipe that comprises at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter;
providing an outer layer to position thereupon said at least one heat pipe;
positioning of a centering template on the outer layer;
positioning of the at least one heat pipe by means of the centering template on the outer layer; and
removing the centering template.

16. The method for producing a component carrier of claim 15 , further comprising:
embedding said at least one heat pipe by positioning at least one further inner layer flanking the at least one heat pipe and forming a recess in the shape of the outer contour of said at least one heat pipe;
attaching at least one further inner layer to cover the recess with the at least one embedded heat pipe;
laminating the at least one inner layer with the at least one embedded heat pipe, wherein an excess of epoxy resin that is abundant within only partially-cured layers made of B-stage pre-preg material is provided as a resin-like adapter means to fill up the recess with the at least one embedded heat pipe;
arranging at least one opening from an outside surface of at least one outer layer to contact the at least one adapter means; and
connecting the outer layers with the embedded heat pipe by means of thermal vias that are arranged in at least one opening.

17. The method for producing a component carrier of claim 15 , further comprising a step selected from the group consisting of:
providing at least one solid adapter that can be at least one of positively connected or firmly bonded with the at least one largely cylindrical heat pipe section in such a way to at least partly enclose the perimeter of said cylindrical heat pipe section;
providing at least one paste-like adapter means and positioning said paste-like adapter on outside surface sections of the outer layer and sideways of the centering template; and
fixing of the at least one heat pipe in place.

18. The method for producing a component carrier of claim 16 , further comprising a step selected from the group consisting of:
providing at least one paste-like adapter to fill up the recess with the at least one embedded heat pipe; and
attaching outer layers on a location selected from a group consisting of the recess and on the outsides of the already attached further inner layers covering the at least one embedded heat pipe.

19. A method for producing a component carrier with at least one embedded heat pipe, comprising:
providing at least one heat pipe that comprises at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter;
providing at least one inner layer with a recess in the shape of the outer contour of said at least one heat pipe;
embedding said at least one heat pipe within the recess;
attaching at least one further inner layer to cover the recess with the at least one embedded heat pipe;
laminating the at least one additional layer with the at least one embedded heat pipe, wherein an excess of epoxy resin that is abundant within only partially-cured layers of the component carrier is provided as resin-like adapter means to fill up the recess with the at least one embedded heat pipe, to receive a first semi-finished product;
arranging at least one opening from an outside surface of at least one outer layer to contact at least one of the at least one adapter means or the embedded heat pipe; and
connecting the outer layers with the embedded heat pipe by means of thermal vias that are arranged in at least one opening.

20. The method for producing a component carrier of claim 19 , further comprising a step selected from the group consisting of:
providing at least one solid adapter that can be at least one of positively connected or firmly bonded with the at least one largely cylindrical heat pipe section in such a way to at least partly enclose the perimeter of the at least one largely cylindrical heat pipe section, wherein the at le

Assignees

• At & S Austria Tech & Systemtechnik Ag

Inventors

• De Sousa Jonathan Silvano
• Reitmaier Bernhard
• Schlaffer Erich
• Stahr Johannes
• Schrittwieser Wolfgang
• Weidinger Gerald
• Kasper Alexander
• Grober Gernot

Classifications

• H10P72/10

  using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] · CPC title

• H10W40/73 Primary

  for cooling by change of state · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K2201/064

  Fluid cooling, e.g. by integral pipes · CPC title