Enhanced electron amplifier structure and method of fabricating the enhanced electron amplifier structure

Patent metadata

Field	Value
Publication number	US-10867768-B2
Application number	US-201715691633-A
Country	US
Kind code	B2
Filing date	Aug 30, 2017
Priority date	Aug 30, 2017
Publication date	Dec 15, 2020
Grant date	Dec 15, 2020

Abstract

An enhanced electron amplifier structure includes a microporous substrate having a front surface and a rear surface, the microporous substrate including at least one channel extending substantially through the substrate between the front surface and the rear surface, an ion diffusion layer formed on a surface of the channel, the ion diffusion layer comprising a metal oxide, a resistive coating layer formed on the first ion diffusion layer, an emissive coating layer formed on the resistive coating layer, and an optional ion feedback layer formed on the front surface of the structure. The emissive coating produces a secondary electron emission responsive to an interaction with a particle received by the channel. The ion diffusion layer, the resistive coating layer, the emissive coating layer, and the ion feedback layer are independently deposited via chemical vapor deposition or atomic layer deposition.

First claim

What is claimed:

1. A method of fabricating an enhanced electron amplifier structure, the method comprising:
providing a microporous substrate, the microporous substrate having a front surface and a rear surface and at least one channel extending through the microporous substrate between the front surface and the rear surface;
depositing a surface of the channel within the microporous substrate with an ion diffusion layer, the ion diffusion layer comprising a metal oxide;
depositing a surface of the ion diffusion layer with a resistive coating layer;
depositing a surface of the resistive coating layer with an emissive coating layer, the emissive coating layer configured to produce a secondary electron emission responsive to an interaction with a particle received by the channel;
depositing an ion feedback layer on the front surface of the microporous substrate by:
forming the ion feedback layer on a sacrificial substrate in a predetermined thickness;
separating the ion feedback layer from the sacrificial substrate; and
transferring the separated ion feedback layer onto the front surface of the microporous substrate,

wherein:
the ion diffusion layer, the resistive coating layer, and the emissive coating layer are independently deposited via chemical vapor deposition or atomic layer deposition, and
the substrate on which the ion feedback layer is formed is a three-dimensional substrate comprising a surface having features protruding from the surface.

2. The method of claim 1 , wherein the ion feedback layer is formed on the substrate using a chemical based thin film growth method or a physical vapor deposition method.

3. The method of claim 1 ,
wherein the substrate is an etchable substrate, and
wherein separating the ion feedback layer from the etchable substrate comprises dunking the etchable substrate having the ion feedback layer formed thereon into an etching solution that selectively etches the etchable substrate to separate the ion feedback layer from the etchable substrate.

4. The method of claim 3 ,
wherein the ion feedback layer is comprised of Al 2 O 3 ;
wherein the etchable substrate is comprised of a Cu foil substrate with native CuO layer; and
wherein the etching solution is comprised of diluted hydrochloric acid solution.

5. The method of claim 1 , wherein separating the ion feedback layer from the three-dimensional substrate is carried out by exfoliation.

6. The method of claim 1 , further comprising rinsing the separated ion feedback layer with water prior to transferring the ion feedback layer onto the microporous substrate.

7. The method of claim 6 , wherein transferring the ion feedback layer onto the microporous substrate comprises:
wetting at least the upper surface of the substrate with water;
placing the ion feedback layer onto the upper surface of the water; and
heating the substrate having the ion feedback layer placed thereon to remove the water.

8. The method of claim 1 , further wherein the front surface comprises an electrode; and
the separated ion feedback layer is transferred on to the electrode of the front surface.

9. A method of fabricating an enhanced electron amplifier structure, the method comprising:
providing a microporous substrate, the microporous substrate having a front surface and a rear surface and at least one channel extending through the microporous substrate between the front surface and the rear surface;
depositing a surface of the channel within the microporous substrate with an ion diffusion layer, the ion diffusion layer comprising a metal oxide;
depositing a surface of the ion diffusion layer with a resistive coating layer; and
depositing a surface of the resistive coating layer with an emissive coating layer, the emissive coating configured to produce a secondary electron emission responsive to an interaction with a particle received by the channel;
forming an ion feedback layer on the front surface of the microporous substrate by:
forming the ion feedback layer on a sacrificial substrate in a predetermined thickness;
lifting the ion feedback layer from the sacrificial substrate; and

transferring the ion feedback layer onto an upper surface of the microporous substrate by:
wetting at least the upper surface of the substrate with water;
placing the ion feedback layer onto the upper surface of the water; and
heating the substrate having the ion feedback layer placed thereon to remove the water,

wherein the ion diffusion layer, the resistive coating layer, and the emissive coating layer are independently deposited via chemical vapor deposition or atomic layer deposition.

10. A method of fabricating an enhanced electron amplifier structure, the method comprising:
providing a microporous substrate, the microporous substrate having a front surface and a rear surface and at least one channel extending through the microporous substrate between the front surface and the rear surface;
depositing a surface of the channel within the microporous substrate with an ion diffusion layer, the ion diffusion layer comprising a metal oxide;
depositing a surface of the ion diffusion layer with a resistive coating layer;
depositing a surface of the resistive coating layer with an emissive coating layer, the emissive coating layer configured to produce a secondary electron emission responsive to an interaction with a particle received by the channel;
depositing an ion feedback layer on the front surface of the microporous substrate by:
forming the ion feedback layer on a sacrificial substrate in a predetermined thickness;
separating the ion feedback layer from the sacrificial substrate;
rinsing the separated ion feedback layer with water prior to transferring the ion feedback layer onto the microporous substrate; and
transferring the separated ion feedback layer onto the front surface of the microporous substrate by:
wetting at least the upper surface of the substrate with water;
placing the ion feedback layer onto the upper surface of the water; and
heating the substrate having the ion feedback layer placed thereon to remove the water,

wherein the ion diffusion layer, the resistive coating layer, and the emissive coating layer are independently deposited via chemical vapor deposition or atomic layer deposition.

Assignees

• Uchicago Argonne Llc

Inventors

• Mane Anil U
• Elam Jeffrey W

Classifications

• H01J43/246 Primary

  Microchannel plates [MCP] (image amplification tubes using MCP H01J31/507) · CPC title

• H01J9/125

  of secondary emission electrodes · CPC title

• H01J1/32 Primary

  Secondary-electron-emitting electrodes (H01J1/35 takes precedence) · CPC title

• H01J2209/012

  Coating · CPC title

• H01J43/04

  Electron multipliers {(if forming part of electron gun H01J3/023)} · CPC title