Apparatus and methods for accommodating manufacturing variance in optical photonic integrated circuits

US10866359B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10866359-B2
Application numberUS-201815883418-A
CountryUS
Kind codeB2
Filing dateJan 30, 2018
Priority dateJan 30, 2018
Publication dateDec 15, 2020
Grant dateDec 15, 2020

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  1. Title

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A photonic integrated circuit is provided that is adapted to compensate for an unintentional manufactured refractive index profile, such as a gradient, that arises due to manufacturing variance. The photonic integrated circuit including at least a thermal source and a spaced thermal sink to induce a thermal gradient in the photonic integrated circuit between the thermal source and the spaced thermal sink, the thermal gradient imparts an opposing thermal refractive index profile to correct for the manufactured refractive index profile. In some embodiments the photonic integrated circuit may be constructed with features that have an intentional structured refractive index profile that ensures any unintentional manufactured refractive index profile is correctable by the opposing thermal refractive index profile induced by the thermal source.

First claim

Opening claim text (preview).

We claim: 1. A photonic integrated circuit comprising: a substrate; at least one series of antennas extending across a coupling surface of the substrate; a thermal source in thermal contact with the substrate at a thermal source end of the at least one series of antennas; and, a thermal sink in thermal contact with the substrate at an opposed thermal sink end of the at least one series of antennas; wherein the at least one series of antennas comprises a plurality of parallel waveguides, with each waveguide comprising a series of antennas; and activating the thermal source imparts a thermal refractive index profile in the direction of the at least one series of antennas between the thermal source and the thermal sink. 2. The photonic integrated circuit of claim 1 , wherein the plurality of parallel waveguides comprise an optical phased array. 3. The photonic integrated circuit of claim 1 , further comprising: an active component, for controlling the relative optical phase of light directed into the at least one series of antennas. 4. The photonic integrated circuit of claim 3 , wherein the active component is located on the substrate and is in thermal contact with the thermal sink. 5. The photonic integrated circuit of claim 1 , wherein the at least one series of antennas is structured to impart a structured refractive index profile that changes between the thermal source end and the opposed thermal sink end. 6. The photonic integrated circuit of claim 5 , wherein the structured refractive index profile comprises a structured refractive index gradient between the thermal source end and the thermal sink end, wherein the structured refractive index gradient is of opposite sign to the thermal refractive index profile imparted by the thermal source when activated. 7. The photonic integrated circuit of claim 5 , wherein the at least one series of antennas comprises a plurality of parallel waveguides, with each waveguide having a decreasing cross-section from the opposed thermal sink end to the thermal source end to create a decreasing refractive index profile from the opposed thermal sink end to the thermal source end. 8. The photonic integrated circuit of claim 5 , wherein the at least one series of antennas comprises a plurality of parallel waveguides with each waveguide having a mark-to-space ratio which varies between the thermal source end and the opposed thermal sink end to impart the structured refractive index profile. 9. The photonic integrated circuit of claim 5 , wherein the at least one series of antennas comprises a plurality of parallel waveguides, with each waveguide having a pitch which varies between the thermal source end and the opposed thermal sink end to impart the structured refractive index profile. 10. The photonic integrated circuit of claim 1 , wherein the at least one series of antennas is structured to provide emission angle variation or reception angle variation along the length of the at least one series of antennas, the variation in emission angle or reception angle of opposite sign from thermal emission angle or reception angle variation caused by the thermal refractive index profile. 11. The photonic integrated circuit of claim 1 , wherein the thermal source is located below the coupling surface of the substrate. 12. The photonic integrated circuit of claim 1 , further comprising: an insulating layer under the at least one series of antennas and between the thermal sink and the thermal source. 13. The photonic integrated circuit of claim 1 , wherein the thermal source comprises a heater. 14. The photonic integrated circuit of claim 1 , wherein the plurality of parallel waveguides are arranged in parallel and located in cooperating proximity with one another to provide an optical phase array. 15. A photonic integrated circuit comprising: a substrate; at least one series of antennas extending across a coupling surface of the substrate; a thermal source in thermal contact with the substrate at a thermal source end of the at least one series of antennas; and, a thermal sink in thermal contact with the substrate at an opposed thermal sink end of the at least one series of antennas; wherein activating the thermal source imparts a thermal refractive index profile in the direction of the at least one series of antennas between the thermal source and the thermal sink: and further comprising: at least one other thermal source between the thermal source end and the opposed thermal sink end. 16. The photonic integrated circuit of claim 15 , wherein the at least one other thermal source extends along one side of the at least one series of antennas. 17. The photonic integrated circuit of claim 15 , wherein the at least one other thermal source extends across the at least one series of antennas.

Assignees

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Classifications

  • Temperature control · CPC title

  • G02B6/125Primary

    Bends, branchings or intersections · CPC title

  • Combinations of two or more optical elements · CPC title

  • beam steering · CPC title

  • by controlled diffraction or phased-array beam steering (controlled diffraction for optical waveguide switching G02F1/313) · CPC title

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What does patent US10866359B2 cover?
A photonic integrated circuit is provided that is adapted to compensate for an unintentional manufactured refractive index profile, such as a gradient, that arises due to manufacturing variance. The photonic integrated circuit including at least a thermal source and a spaced thermal sink to induce a thermal gradient in the photonic integrated circuit between the thermal source and the spaced th…
Who is the assignee on this patent?
Goodwill Dominic John, Celo Dritan, Dumais Patrick, and 1 more
What technology area does this patent fall under?
Primary CPC classification G02B6/125. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Dec 15 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).