Assembly connection flange and brake disc
US-9523403-B2 · Dec 20, 2016 · US
US10865841B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10865841-B2 |
| Application number | US-201916262576-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 30, 2019 |
| Priority date | Oct 7, 2015 |
| Publication date | Dec 15, 2020 |
| Grant date | Dec 15, 2020 |
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Brake disks with integrated heat sink are provided. Brake disk includes a fiber-reinforced composite material and an encapsulated heat sink material impregnated into the fiber-reinforced composite material. The encapsulated heat sink material comprises a heat sink material encapsulated within a silicon-containing encapsulation layer. Methods for manufacturing the brake disk with integrated heat sink and methods for producing the encapsulated heat sink material are also provided.
Opening claim text (preview).
What is claimed is: 1. A method for producing an encapsulated heat sink material, the method comprising: dispersing particles of a heat sink material in a solvent containing a surfactant to form a dispersion; adding an organic silicon precursor to the dispersion, the organic silicon precursor comprising a polycarbosilane; and forming a silicon-containing encapsulation layer around the heat sink material from the organic silicon precursor, the silicon-containing encapsulation layer comprising SiC. 2. The method of claim 1 , wherein the surfactant comprises at least one of polyvinylpyrrolidone (PVP) polymer, polyvinylalcohol (PVA), polyethylene oxide (PEO), polypropylene oxide (PPO), or acetylenic diol based chemicals. 3. The method of claim 1 , wherein the solvent comprises at least one of ethanol, 1-propanol, 2-propanol, 1-butanol, or 2-butanol. 4. The method of claim 1 , wherein the encapsulated heat sink material comprises: the heat sink material; and the silicon-containing encapsulation layer encapsulating the heat sink material. 5. The method of claim 1 , wherein the heat sink material comprises at least one of a eutectic salt, a eutectic alloy, or a material with a melting temperature greater than about 300° C. to about 1100° C., a transition temperature greater than about 300° C. and less than about 1100° C., and a density of less than 3.5 g/cm 3 . 6. The method of claim 1 , wherein forming the silicon-containing encapsulation layer comprises decomposing the organic silicon precursor by at least one of a heat treatment or a condensation reaction. 7. A method for manufacturing a brake disk with an integrated heat sink, the method comprising: infiltrating the brake disk or preform thereof with encapsulated heat sink material in a solvent, the encapsulated heat sink material comprising a heat sink material encapsulated within a silicon-containing encapsulation layer, the silicon-containing encapsulation layer comprising silicon dioxide; converting the silicon dioxide of the silicon-containing encapsulation layer into silicon carbide by carburizing the silicon dioxide; and removing the solvent. 8. The method of claim 7 , further comprising producing the encapsulated heat sink material by: dispersing particles of the heat sink material in the solvent containing a surfactant; adding an organic silicon precursor to the solvent after the dispersing; and forming the silicon-containing encapsulation layer around the particles of the heat sink material from the organic silicon precursor. 9. The method of claim 8 , wherein forming the silicon-containing encapsulation layer is performed prior to infiltrating the brake disk or preform thereof. 10. The method of claim 8 , wherein the forming the silicon containing encapsulation layer and the carburizing the silicon dioxide are performed simultaneously. 11. The method of claim 8 , wherein converting the silicon dioxide of the silicon-containing encapsulation layer into silicon carbide is performed after removing the solvent.
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