Coating liquid for forming piezoelectric thin film, method of producing coating liquid for forming piezoelectric thin film, piezoelectric thin film, method of manufacturing piezoelectric thin film, and liquid ejection head

Patent metadata

Field	Value
Publication number	US-10865311-B2
Application number	US-201715493426-A
Country	US
Kind code	B2
Filing date	Apr 21, 2017
Priority date	May 18, 2016
Publication date	Dec 15, 2020
Grant date	Dec 15, 2020

Abstract

Provided is a coating liquid for forming a piezoelectric thin film containing lead zirconate titanate, the coating liquid including a complex precursor containing at least three kinds of metal elements of Pb, Ti, and Zr, the coating liquid being free from an exothermic peak at a temperature of 450° C. or more, or having a heat generation amount at a temperature of from 400° C. to 450° C., which is larger than a heat generation amount at a temperature of from 450° C. to 500° C., in differential thermal analysis of the coating liquid.

First claim

What is claimed is:

1. A coating liquid for forming a piezoelectric thin film containing lead zirconate titanate, the coating liquid comprising a complex precursor containing Pb, Ti, and Zr, and at least one selected from the group consisting of 1,8-diazabicyclo[5.4.0]-7-undecene, 1,5-diazabicyclo[4.3.0]non-5-ene, and 1,4-diazabicyclo[2.2.2]octane,
wherein an exothermic peak of the coating liquid is at a temperature of 400° C. to 450° C. in differential thermal analysis of the coating liquid.

2. The coating liquid according to claim 1 , wherein the coating liquid has a peak position of particle size distribution of 100 nm or less.

3. The coating liquid according to claim 1 , wherein the coating liquid is free from a liquid having a boiling point of 100° C. or less.

4. A method of producing a coating liquid for forming a piezoelectric thin film, comprising:
heating at least three raw material compounds containing each of Pb, Ti, and Zr, or at least two raw material compounds including a complex raw material compound containing any two of Pb, Ti, and Zr and a raw material compound containing the remaining one of Pb Ti, and Zr, at a temperature of 120° C. or more in an organic solvent, to thereby form a complex metal compound containing Pb, Ti, and Zr; and
hydrolyzing the complex metal compound by adding water to a system after the heating, to thereby form a complex precursor containing Pb, Ti, and Zr;
wherein the heating is performed in the presence of at least one selected from the group consisting of 1,8-diazabicyclo[5.4.0]-7-undecene, 1,5-diazabicyclo[4.3.0]non-5-ene, and 1,4-diazabicyclo[2.2.2]octane, and
wherein an exothermic peak of the coating liquid formed after the hydrolyzing is at a temperature of 400° C. to 450° C. in differential thermal analysis of the coating liquid.

5. The method according to claim 4 , further comprising, after the hydrolyzing:
removing a liquid containing the water, the liquid having a boiling point of 100° C. or less; and
adding an organic solvent having a boiling point of more than 100° C. to the complex precursor, to thereby adjust a concentration of the complex precursor.

6. A method of manufacturing a piezoelectric thin film, comprising:
applying a coating liquid for forming a piezoelectric thin film containing lead zirconate titanate onto a substrate, the coating liquid comprising a complex precursor containing Pb, Ti, and Zr, and at least one selected from the group consisting of 1,8-diazabicyclo[5.4.0]-7-undecene, 1,5-diazabicyclo[4.3.0]non-5-ene, and 1,4-diazabicyclo[2.2.2]octane; and
forming the piezoelectric thin film containing lead zirconate titanate by a sol-gel method,
wherein an exothermic peak of the coating liquid is at a temperature of 400° C. to 450° C. in differential thermal analysis of the coating liquid.

Assignees

• Canon Kk
• Fuji Chemical Kk

Inventors

• Kobayashi Motokazu
• Nakasu Minako
• Koketsu Naoyuki
• Shimizu Chiemi
• Uchida Fumio

Classifications

• B41J2/164

  thin film formation · CPC title

• B41J2202/03

  Specific materials used · CPC title

• C23C18/1241

  Metallic substrates · CPC title

• C23C18/1291

  by heating of the substrate · CPC title

• C23C18/1216

  Metal oxides (C23C18/1212 takes precedence) · CPC title