Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus

Patent metadata

Field	Value
Publication number	US-10864597-B2
Application number	US-201614992839-A
Country	US
Kind code	B2
Filing date	Jan 11, 2016
Priority date	Jun 23, 2009
Publication date	Dec 15, 2020
Grant date	Dec 15, 2020

Abstract

An object of the present invention is to provide an ultrasonic bonding tool capable of bonding a lead wire, without any trouble, even to a surface of a thin-film base having a plate thickness of 2 mm or less such as a glass substrate. In the present invention, a surface portion of a chip portion (1c) of an ultrasonic bonding tool (1) used in an ultrasonic bonding apparatus has a plurality of planar portions (10) formed so as to be separated from one another, and a plurality of concavities (11) formed between the plurality of planar portions. Each of the plurality of planar portions (10) has a flatness of 2 μm or less.

First claim

The invention claimed is:

1. A method for manufacturing an ultrasonic bonding tool, said ultrasonic bonding tool comprising a chip portion at a distal end portion of the tool, the chip portion comprising a surface portion, the surface portion comprising a plurality of planar portions and a plurality of concavities between planar portions of the plurality of planar portions, and the tool being capable of applying ultrasonic vibration, said method for manufacturing the tool comprising:
preparing a tool original material comprising a distal planar portion with a flatness of more than 2 μm;
grinding the tool original material to enhance the flatness of the distal planar portion to a flatness of 2 μm or less;
selectively forming the plurality of concavities by wire cutting or with a cutting wheel, wherein the plurality of concavities separate the distal planar portion into the plurality of planar portions;
shot-blasting an edge of an outer peripheral portion of planar: portions in the plurality of planar portions, thereby rounding the edge; and
shot-blasting to form an uneven shape in each planar portion in the plurality of planar portions so as to maintain a flatness of 2 μm or less in the plurality of planar portions and form an uneven shape with a flatness of 0.2 μm or less in the plurality of concavities.

2. The method for manufacturing the ultrasonic bonding tool according to claim 1 , wherein
the chip portion comprises:
a first layer and
a second layer on the first layer as a most distal end portion of the chip portion, and
wherein the second layer is harder than the first layer.

3. The method for manufacturing the ultrasonic bonding tool according to claim 1 , wherein
the chip portion comprises:
a first layer and
a second layer on the first layer, as a most distal end portion of the chip portion, and
wherein an affinity between the second layer and a material to be bonded is lower than an affinity between the first layer and the material to be bonded.

4. The method for manufacturing the ultrasonic bonding tool according to claim 1 , Wherein an interval between adjacent concavities of the plurality of concavities is 1.0 mm or less.

5. The method for manufacturing the ultrasonic bonding tool according to claim 1 , wherein an average depth of concavities of the plurality of concavities is 0.15 mm or less.

6. The method for manufacturing the ultrasonic bonding tool according to claim 1 , wherein the plurality of concavities comprises a plurality of first grooves and a plurality of second grooves that cross the plurality of first grooves.

7. The method for manufacturing the ultrasonic bonding tool according to claim 1 , wherein the planar portions of the plurality of planar portions have a rectangular shape, a circular shape, or a rhombic shape.

8. The method for manufacturing the ultrasonic bonding tool according to claim 2 , wherein the first layer comprises a steel material and the second layer comprises tungsten carbide.

9. The method for manufacturing the ultrasonic bonding tool according to claim 1 , wherein the tool original material is ground to a flatness of 1 to 2 μm.

Assignees

• Toshiba Mitsubishi Electric Industrial Systems Corp

Inventors

• Yoshida Akio
• Kogura Masahisa

Classifications

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• B06B1/02

  making use of electrical energy (B06B1/18, B06B1/20 take precedence) · CPC title

• B23K20/10 Primary

  making use of vibrations, e.g. ultrasonic welding · CPC title

• B24B19/16

  for grinding sharp-pointed workpieces, e.g. needles, pens, fish hooks, tweezers or record player styli (grinding bevels on diamonds or sapphires B24B9/16; polishing of needles B24B29/08) · CPC title

• B24B19/02

  for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements · CPC title