Circuit configuration for controlling a power semiconductor device with two circuit carriers and a plastic molded body and arrangement having said configuration

Patent metadata

Field	Value
Publication number	US-10863623-B2
Application number	US-201916365948-A
Country	US
Kind code	B2
Filing date	Mar 27, 2019
Priority date	Apr 27, 2018
Publication date	Dec 8, 2020
Grant date	Dec 8, 2020

Abstract

A circuit configuration for controlling a power semiconductor device has a first circuit carrier and a second circuit carrier arranged parallel to and spaced apart from the first, and having a plastic molded body arranged in an intermediate space between the first and second circuit carrier, wherein the first circuit carrier has a first conductor track with a first contact point, which can be implemented in particular as a contact pad or as a contact receptacle, which is arranged on a main side of the first circuit carrier facing the plastic molded body, wherein the second circuit carrier has a second conductor track with a second contact point, which is arranged on a main side of the second circuit carrier facing the plastic molded body, wherein the plastic molded body has a first holder for a first component with a first and a second contact device, and wherein the first contact device is electrically conductively connected to the first contact point and the second contact device is electrically conductively connected to the second contact point.

First claim

What is claimed is:

1. A circuit arrangement, for controlling a power semiconductor device, comprising:
a first circuit carrier and a second circuit carrier arranged parallel to and spaced apart from the first and a plastic molded body arranged in an intermediate space between the first and second circuit carrier;
the first circuit carrier has a first conductor track with a first contact point, which is arranged on a main side of the first circuit carrier facing the plastic molded body;
the second circuit carrier has a second conductor track with a second contact point, which is arranged on a main side of the second circuit carrier facing the plastic molded body;
the plastic molded body has a first holder for holding and retaining a first component with a first and a second contact device extending in opposing directions; and
the first contact device is electrically conductively connected to the first contact point on the main side of the first circuit carrier and the second contact device is electrically conductively connected to the second contact point on the main side of the second circuit carrier;
the first contact device and the second contact device extend in different directions;
the first holder with the first component located therein, forms a continuously bounded retaining reservoir filled by means of an electrically insulating casting compound;
the first component additionally has at least one other first and one other second contact device extending in opposing directions;
the first circuit carrier has at least one other first contact point on the main side of said first circuit carrier;
the second circuit carrier has at least one other second contact point arranged on said main side of said second circuit carrier;
the at least one other first contact device and the at least one other second contact device are electrically conductively connected in a circuit-compatible manner to the at least one other first contact point and the at least one other second contact point respectively; and
the plastic molded body rests on at least two first contact surfaces upon the main side of the first circuit carrier and includes at least two opposite side second contact surfaces contacting on the main side of the second circuit carrier.

2. The circuit arrangement, according to claim 1 , wherein: the first component is designed as an electrically isolating transmission component, in particular as a transformer or as an optocoupler.

3. The circuit arrangement, according to claim 1 , wherein:
a plurality of additional components having respective additional contact devices are arranged in additional holders of the plastic molded body and said additional components are electrically conductively connected to associated additional contact points on at least one of the circuit carriers.

4. The circuit arrangement, according to claim 1 , wherein:
the plastic molded body is designed and provided to form an electrical insulation between the first and second circuit carrier.

5. An arrangement, having a circuit arrangement according to claim 1 , further comprising:
a power semiconductor device; and
wherein the second circuit carrier is electrically conductively connected to the power semiconductor device by means of control connections.

6. The arrangement according to claim 5 , wherein:
the power semiconductor device, is a power semiconductor module or a power semiconductor sub-module.

Assignees

• Semikron Elektronik Gmbh & Co Kg

Inventors

• Burani Nicola
• Bittner Roland
• Kujath Matthias
• Mauer Peter

Classifications

• H10W76/138

  having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H05K2201/1003

  Non-printed inductor · CPC title

• H05K1/145 Primary

  Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules · CPC title

• H05K2201/042

  Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other · CPC title