Light-emitting element housing member, array member, and light-emitting device

Patent metadata

Field	Value
Publication number	US-10862264-B2
Application number	US-201716094343-A
Country	US
Kind code	B2
Filing date	Apr 18, 2017
Priority date	Apr 18, 2016
Publication date	Dec 8, 2020
Grant date	Dec 8, 2020

Abstract

A light-emitting element housing member includes a substrate that is made of a ceramic and internally includes a deep-bottom-type space portion having an opening in at least one position thereof, wherein an inner wall of the space portion serves as a mounting part for a light-emitting element. A light-emitting element housing member includes a mounting part meant for mounting a light-emitting element and includes a substrate that includes a bottom base material having a rectangular shape in a planar view and a wall member provided on the bottom base material to enclose the mounting part in a U-shaped manner and have an opening in at least one portion thereof, wherein the substrate is integrally formed of a ceramic.

First claim

The invention claimed is:

1. A light-emitting element housing member, comprising:
a ceramic substrate that includes a bottom base material having a rectangular shape in a planar view, wall members provided on the bottom base material to enclose a mounting part for mounting a light-emitting element; and
an opening in at least one portion of the wall members, wherein
the wall members encloses a mounting face of the mounting part in a U-shaped manner in a planar view, and
the ceramic substrate comprises a bridge member in a top portion of the opening between opposing two side wall members without involving any bonded surface therebetween.

2. The light-emitting element housing member according to claim 1 , wherein, when viewed from a side of the opening, the mounting part is centered in a height direction of the wall members.

3. The light-emitting element housing member according to claim 1 , wherein the bridge member is curved.

4. The light-emitting element housing member according to claim 1 , wherein a thickness of the wall members decreases from the bottom base material to a top face of the ceramic substrate.

5. The light-emitting element housing member according to claim 1 , wherein the mounting part comprises a first mounting part for a laser diode, and a second mounting part for a photodiode that is adjacent to the first mounting part.

6. The light-emitting element housing member according to claim 1 , comprising a positioning mark on the mounting part that determines a mounting position of the light-emitting element.

7. The light-emitting element housing member according to claim 6 , wherein the positioning mark has a concave shape or a convex shape that is formed integrally with the substrate.

8. The light-emitting element housing member according to claim 6 , wherein a shape of the positioning mark is at least one of a cylindrical shape, a conical shape, a prismatic shape, and a pyramidal shape.

9. The light-emitting element housing member according to claim 1 , wherein the mounting part has a chamfered portion at an edge that faces the opening.

10. An array member, wherein a plurality of the light-emitting element housing members according to claim 1 are joined.

11. The array member according to claim 10 , wherein the light-emitting element housing members are sintered integrally with one another.

12. A light-emitting device, comprising:
the array member according to claim 10 ; and
a light-emitting element that is mounted on the mounting part of the array member.

13. A light-emitting device, comprising a light-emitting element mounted on the mounting part of the light-emitting element housing member according to claim 1 .

Assignees

• Kyocera Corp

Inventors

• Furukubo Youji
• Yamamoto Sentaro
• Okamoto Masanori
• Masaki Katsuaki
• Nishimura Takehiro
• Shibata Kazuya

Classifications

• H01S5/0207

  Substrates having a special shape · CPC title

• H01S5/4031

  Edge-emitting structures · CPC title

• H01S5/0683

  by monitoring the optical output parameters · CPC title

• H01S5/02469

  Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC · CPC title

• H01S5/0237

  by soldering · CPC title