Manufacturing flexible organic electronic devices

US10862074B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10862074-B2
Application numberUS-201715459044-A
CountryUS
Kind codeB2
Filing dateMar 15, 2017
Priority dateDec 17, 2012
Publication dateDec 8, 2020
Grant dateDec 8, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the depositing the plurality of layers via a roll to roll feed and retrieval system.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of depositing a material at less than atmospheric pressure onto a moving substrate web having a removable material attached to a surface thereof, comprising: delivering the material into an interior of at least a first cylinder and a second cylinder, the first cylinder comprising a first opening pattern therein and the second cylinder comprising a second opening pattern therein, wherein the first opening pattern and the second opening pattern are different, wherein the second opening pattern has a plurality of openings, and wherein the material may pass through the first opening pattern and the second opening pattern to exit the interior of the first cylinder and the second cylinder, respectively; and rotating the first cylinder and the second cylinder so that the material passes through the first patterned opening and the second patterned opening to be deposited upon the moving substrate web in a determined pattern that comprises a two-dimensional matrix having at least a first pattern, where one or more first lines of the material are deposited parallel to a direction of the moving substrate web, and a second pattern, where one or more second lines of the material are deposited perpendicular to the direction of the moving substrate web, wherein the removable material attached to the moving substrate web forms breaks in at least one of the first pattern and the second pattern, wherein the determined pattern that the material is deposited is based on the first patterned opening, the second pattern opening, a first rotational speed and a first rotational direction of the first cylinder, and a second rotational speed and a second rotational direction of the second cylinder. 2. The method of claim 1 wherein the pressure is between 10 to 10 −8 torr. 3. The method of claim 1 wherein the pressure is between 10 −4 to 10 −7 torr. 4. The method of claim 1 wherein a source of the material is positioned within the cylinder. 5. The method of claim 1 wherein an axis of the cylinder is generally perpendicular to a direction of motion of the web. 6. The method of claim 1 wherein the speed of the web is programmable. 7. The method of claim 1 wherein the rotational speed of the cylinder is programmable. 8. The method of claim 1 wherein microelectronic systems are formed on the web. 9. The method of claim 8 wherein the material is an organic material. 10. The method of claim 8 wherein the material is a conductive material. 11. The method of claim 10 wherein the determined pattern comprises bus lines over a transparent conductor on the web. 12. The method of claim 9 wherein the material is an evaporative material.

Assignees

Inventors

Classifications

  • Thermal treatment, e.g. annealing in the presence of a solvent vapour · CPC title

  • combined with auxiliary electrodes, e.g. ITO layer combined with metal lines · CPC title

  • Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

  • H10K71/164Primary

    using vacuum deposition · CPC title

  • Organic PV cells · CPC title

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Frequently asked questions

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What does patent US10862074B2 cover?
A method of forming microelectronic systems on a flexible substrate includes depositing a plurality of layers on one side of the flexible substrate. Each of the plurality of layers is deposited from one of a plurality of sources. A vertical projection of a perimeter of each one of the plurality of sources does not intersect the flexible substrate. The flexible substrate is in motion during the …
Who is the assignee on this patent?
Universal Display Corp
What technology area does this patent fall under?
Primary CPC classification H10K71/164. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 08 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).