Integrated cantilever switch

Patent metadata

Field	Value
Publication number	US-10861984-B2
Application number	US-201916564860-A
Country	US
Kind code	B2
Filing date	Sep 9, 2019
Priority date	Mar 31, 2015
Publication date	Dec 8, 2020
Grant date	Dec 8, 2020

Abstract

An integrated transistor in the form of a nanoscale electromechanical switch eliminates CMOS current leakage and increases switching speed. The nanoscale electromechanical switch features a semiconducting cantilever that extends from a portion of the substrate into a cavity. The cantilever flexes in response to a voltage applied to the transistor gate thus forming a conducting channel underneath the gate. When the device is off, the cantilever returns to its resting position. Such motion of the cantilever breaks the circuit, restoring a void underneath the gate that blocks current flow, thus solving the problem of leakage. Fabrication of the nano-electromechanical switch is compatible with existing CMOS transistor fabrication processes. By doping the cantilever and using a back bias and a metallic cantilever tip, sensitivity of the switch can be further improved. A footprint of the nano-electromechanical switch can be as small as 0.1×0.1 μm2.

First claim

The invention claimed is:

1. A device, comprising:
a substrate;
a plurality of semiconductor layers on the substrate, the plurality of semiconductor layers defining a cavity;
a cantilever extending from one of the plurality of semiconductor layers into the cavity; and
a gate overlying the cavity, the gate spaced apart from the cantilever by a portion of the cavity.

2. The device of claim 1 , further comprising:
a source region on the plurality of semiconductor layers adjacent to a first side of the gate; and
a drain region on the plurality of semiconductor layers adjacent to a second side of the gate.

3. The device of claim 2 wherein the source and drain regions are raised source and drain regions, each of the source and drain regions having a thickness within a range of 20 nm to 35 nm.

4. The device of claim 2 , further comprising a sealant material between the first side of the gate and the source region and between the second side of the gate and the drain region.

5. The device of claim 4 wherein the sealant material includes glass.

6. The device of claim 4 wherein the sealant material includes SiO2.

7. The device of claim 1 , further comprising a buried oxide layer, the plurality of semiconductor layers disposed over the buried oxide layer.

8. The device of claim 7 wherein the buried oxide layer has a thickness within a range of 15 nm to 25 nm.

9. The device of claim 1 wherein the plurality of semiconductor layers includes a first semiconductor layer on the substrate, a second semiconductor layer on the first semiconductor layer, and a third semiconductor layer on the second semiconductor layer,
wherein the cantilever extends from the second semiconductor layer, and the second semiconductor layer comprises a first silicon layer that is doped with negative ions having a concentration within a range of 8.0×10 19 cm −3 to 3.0×10 20 cm −3 .

10. The device of claim 9 wherein the third semiconductor layer comprises a second silicon layer that is doped with negative ions having a concentration within a range of 1.0×10 20 cm −3 to 2.0×10 20 cm −3 .

11. The device of claim 1 wherein the cantilever includes a metal tip.

12. The device of claim 11 wherein the metal tip includes tungsten.

13. A device, comprising:
a substrate;
a buried oxide layer on the substrate;
a plurality of semiconductor layers on the buried oxide layer, the plurality of semiconductor layers defining a cavity that extends through each of the plurality of semiconductor layers, and a cantilever that extends into the cavity from one of the plurality of semiconductor layers; and
a gate overlying the cavity, the gate spaced apart from the cantilever by a portion of the cavity.

14. The device of claim 13 wherein the plurality of semiconductor layers includes:
a first semiconductor layer on the buried oxide layer;
a second semiconductor layer on the first semiconductor layer; and
a third semiconductor layer on the second semiconductor layer,
wherein the cantilever extends into the cavity from the second semiconductor layer.

15. The device of claim 13 , further comprising:
a raised source region on the plurality of semiconductor layers adjacent to a first side of the gate; and
a raised drain region on the plurality of semiconductor layers adjacent to a second side of the gate.

16. The device of claim 15 wherein the gate includes a gate electrode and sidewall spacers on side surfaces of the gate electrode, the raised source and raised drain regions spaced apart from respective sidewall spacers by a distance within a range of 3 nm to 8 nm.

17. The device of claim 13 , further comprising a metal tip attached to an end of the cantilever.

18. An electromechanical switch, comprising:
a substrate having a surface;
a plurality of semiconductor layers on the substrate, the plurality of semiconductor layers defining a cavity;
a cantilever that extends from one of the plurality of semiconductor layers into the cavity along a direction parallel to the surface of the substrate;
a gate suspended over the cavity, the gate spaced apart from the cantilever by a portion of the cavity;
a source region on the plurality of semiconductor layers and adjacent to a first side of the gate; and
a drain region on the plurality of semiconductor layers and adjacent to a second side of the gate opposite to the first side.

19. The electromechanical switch of claim 18 wherein the drain region extends at least partially over the cavity and the cantilever is a flexible cantilever that is operable to contact the drain region in response to a voltage applied to the gate.

20. The electromechanical switch of claim 19 wherein the cantilever contacts the drain region in response to the voltage applied to the gate exceeding a threshold voltage of about 0.8 V.

Assignees

• St Microelectronics Inc

Inventors

• Liu Qing
• Zhang John H

Classifications

• H10P50/644

  Anisotropic liquid etching (H10P50/61 takes precedence) · CPC title

• H10P14/3411

  Silicon, silicon germanium or germanium · CPC title

• H01H59/0009 Primary

  making use of micromechanics · CPC title

• H10D48/50 Primary

  Devices controlled by mechanical forces, e.g. pressure · CPC title

• H01H1/0094

  Switches making use of nanoelectromechanical systems [NEMS] · CPC title