Circuit module

Patent metadata

Field	Value
Publication number	US-10861759-B2
Application number	US-201916374022-A
Country	US
Kind code	B2
Filing date	Apr 3, 2019
Priority date	Oct 25, 2016
Publication date	Dec 8, 2020
Grant date	Dec 8, 2020

Abstract

A circuit module includes: a substrate including a wiring pattern; a first region in which a first electronic component is mounted on one major surface of the substrate; a second region in which a second electronic component, which is taller than the first electronic component, is mainly mounted on the one major surface of the substrate; a first conductor provided in the first region and electrically connected with the wiring pattern; and sealing resin that seals the first electronic component, the second electronic component, and the first conductor. Sealing resin sealing the first region is formed to be shorter than sealing resin sealing the second region, part of the first conductor is exposed on a surface of the sealing resin, wiring is formed on the surface of the sealing resin, and the first conductor the part of which is exposed is electrically connected with the wiring.

First claim

The invention claimed is:

1. A circuit module comprising:
a substrate provided with a wiring pattern;
a first region on one major surface of the substrate, wherein a first electronic component is mounted on the first region;
a second region on the one major surface of the substrate, wherein a second electronic component is mounted on the second region, and the second electronic component is taller than the first electronic component in height;
one or more first conductors provided in the first region and electrically connected with the wiring pattern; and
a sealing resin sealing the first electronic component, the second electronic component, and the first conductors; wherein
one portion of the sealing resin sealing the first region is provided to be shorter than another portion of the sealing resin sealing the second region in height,
a part of each of the first conductors is exposed on a surface of the one portion of the sealing resin sealing the first region,
a wiring is provided on the surface of the one portion of the sealing resin sealing the first region, and
the part of each of the first conductors exposed is electrically connected with the wiring on the surface of the one portion of the sealing resin.

2. The circuit module according to claim 1 , wherein
a third electronic component is mounted on the surface of the one portion of the sealing resin sealing the first region, and
the third electronic component is electrically connected with each of the first conductors having the part exposed.

3. The circuit module according to claim 1 , wherein at least one of the first conductors is provided on an electrode of the first electronic component.

4. The circuit module according to claim 2 , further comprising:
an additional sealing resin sealing the wiring on the surface of the one portion of the sealing resin and the third electronic component.

5. The circuit module according to claim 4 , wherein the additional sealing resin also seals a surface of the other portion of the sealing resin sealing the second region.

6. The circuit module according to claim 4 , wherein a conductive film electrically connected with a ground potential of the substrate is provided on side surfaces of the substrate, the sealing resin, and the additional sealing resin and a surface of the additional sealing resin or the surface of the one portion of the sealing resin and the surface of the additional sealing resin.

7. The circuit module according to claim 6 , further comprising
one or more second conductors provided on an electrode of the third electronic component or on the wiring on the surface of the one portion of the sealing resin, wherein
the second conductor is sealed with the additional sealing resin,
a part of each of the second conductors is exposed on the surface of the additional sealing resin, and
each of the second conductors having the part exposed is electrically connected with the conductive film.

8. The circuit module according to claim 1 , wherein each of the first conductors comprises a sintered metal in a columnar shape.

9. The circuit module according to claim 7 , wherein each of the first conductors or each of the second conductors comprises a sintered metal in a columnar shape.

10. The circuit module according to claim 2 , wherein at least one of the first conductors is provided on an electrode of the first electronic component.

11. The circuit module according to claim 5 , wherein a conductive film electrically connected with a ground potential of the substrate is provided on side surfaces of the substrate, the sealing resin, and the additional sealing resin and a surface of the additional sealing resin or the surface of the one portion of the sealing resin and the surface of the additional sealing resin.

12. The circuit module according to claim 2 , wherein each of the first conductors comprises a sintered metal in a columnar shape.

13. The circuit module according to claim 3 , wherein each of the first conductors comprises a sintered metal in a columnar shape.

14. The circuit module according to claim 4 , wherein each of the first conductors comprises a sintered metal in a columnar shape.

15. The circuit module according to claim 5 , wherein each of the first conductors comprises a sintered metal in a columnar shape.

16. The circuit module according to claim 6 , wherein each of the first conductors comprises a sintered metal in a columnar shape.

17. The circuit module according to claim 1 , wherein the part of each of the first conductors exposed on a top surface of the one portion of the sealing resin and the wiring are provided on the top surface of the one portion of the sealing resin sealing.

18. The circuit module according to claim 1 , further comprising a third electronic component that is mounted on the surface of the sealing resin, wherein the wiring is electrically connected to the third electronic component.

19. The circuit module according to claim 18 , wherein the wiring includes at least either of a power feeding electrode or a radiation electrode of an antenna.

Assignees

• Murata Manufacturing Co

Inventors

• Nomiyama Kaneo
• Sato Kazushige
• Eshita Yuya
• Amachi Nobumitsu

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• H10W74/114 Primary

  by a substrate and the encapsulations · CPC title

• H10W74/01

  Manufacture or treatment · CPC title