Thermal module assembling structure

Patent metadata

Field	Value
Publication number	US-10859320-B2
Application number	US-201816199213-A
Country	US
Kind code	B2
Filing date	Nov 25, 2018
Priority date	Feb 19, 2014
Publication date	Dec 8, 2020
Grant date	Dec 8, 2020

Abstract

A thermal module assembling structure includes a heat dissipation board and at least one heat pipe. The heat dissipation board has a receiving channel for fitting the heat pipe therethrough. Two sides of upper side of the receiving channel are respectively formed with two ribs. The ribs horizontally protrude and extend toward the middle of the receiving channel to face the heat pipe fitted in the receiving channel. At least one deformed recess is formed on an upper surface of each of the ribs, whereby the lower surfaces of the ribs and a surface of the heat pipe are deformed to form at least one deformed connection section between the lower surfaces of the ribs and the surface of the heat pipe. By means of the restriction of the deformed connection section, the heat pipe is prevented from being extracted out of the receiving channel.

First claim

What is claimed is:

1. A thermal module assembling structure comprising:
a heat dissipation board having a receiving channel formed in the heat dissipation board and a heat pipe inserted through the receiving channel, opposed sides of an upper surface of the receiving channel being respectively formed with ribs, each rib having an upper surface and a lower surface, the lower surface of each rib having a pattern of alternating elevated and sunken areas, the lower surface of the ribs being bent under a force to engage the heat pipe, the force being sufficient to create dented areas on a surface of the heat pipe in contact with the alternating elevated and sunken areas on the ribs, to firmly engage the pattern of alternating elevated and sunken areas;
wherein the pattern of the alternating elevated and sunken areas have multiple raised sections and at least one recessed section being rounded, square or a rectangle, the multiple raised sections and at least one recessed section alternating along a length of the heat pipe and dented into the heat pipe to restrict a movement of the heat pipe.

2. The thermal module assembling structure as claimed in claim 1 , wherein the multiple raised sections and at least one recessed section arranged alternately, multiple raised sections are firmly engaged with multiple dented recessed portions.

3. The thermal module assembling structure as claimed in claim 2 , wherein multiple raised sections and at least one recessed section of the pattern of alternating elevated and sunken areas are substantially normal to an axis of the heat pipe.

4. The thermal module assembling structure as claimed in claim 1 , wherein the pattern of alternating elevated and sunken areas have multiple recessed sections and at least one raised section arranged alternately, the at least one raised section being firmly engaged with multiple indented recessed portions.

5. The thermal module assembling structure as claimed in claim 4 , wherein multiple raised sections and at least one recessed section of the pattern of alternating elevated and sunken areas are substantially normal to an axis of the heat pipe.

6. The thermal module assembling structure as claimed in claim 1 , wherein the receiving channel has a coarse surface.

Assignees

• Asia Vital Components Co Ltd

Inventors

• Lin Sheng-Huang
• Lin Kuo-Sheng

Classifications

• F28D15/0233 Primary

  the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence) · CPC title

• F28D15/0275 Primary

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• F28F2275/122

  by crimping, caulking or clinching · CPC title

• F28F3/12

  Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} · CPC title