Feedthrough of an implantable medical electronic device

Patent metadata

Field	Value
Publication number	US-10857367-B2
Application number	US-201715824473-A
Country	US
Kind code	B2
Filing date	Nov 28, 2017
Priority date	Dec 9, 2016
Publication date	Dec 8, 2020
Grant date	Dec 8, 2020

Abstract

A feedthrough for an implantable medical electronic device that has a housing and a header. The feedthrough having an insulator that has a housing-side surface and a header-side surface opposite it, a feedthrough flange surrounding the insulator, and at least one primary connection element penetrating the insulator and for connection of an electrical or electronic component of the device. This electrical or electronic component is arranged in the housing. The connection element is fastened by a hard solder connection, so that it is fluid-tight in a passage of the insulator. The primary connection element has a housing-side end that is essentially even with the housing-side surface of the insulator or is recessed into the insulator with respect to this surface.

First claim

The invention claimed is:

1. An electrical feedthrough of an implantable medical electronic device having a housing and a header, the electrical feedthrough comprising:
an insulator having a first housing-side surface and a second surface opposite said first housing-side surface, said second surface facing away from the housing, said insulator having at least one passage formed therein;
a feedthrough flange surrounding said insulator;
a hard solder connection; and
at least one primary connection element penetrating said insulator, for forming a connection to an electrical or electronic component of the implantable medical electronic device, the electrical or electronic component being disposed in the housing, said primary connection element being fastened, by means of said hard solder connection, so that said primary connection element is fluid-tight in said passage through said insulator, said primary connection element having a housing-side end, wherein said housing-side end of said primary connection element being recessed into said first housing-side surface of said insulator, and covered with a hard solder or sintered material or soft solder layer so that a covering material layer has a surface that is even with said first housing-side surface of said insulator or forms a cupola bulging up out of said first housing-side surface of said insulator.

2. The electrical feedthrough according to claim 1 , wherein:
said second surface is a header-side surface; and
said at least one primary connection element is one of a plurality of primary connection elements.

3. The feedthrough according to claim 1 , wherein said cupola of said covering material layer has a maximum height with respect to said first housing-side surface of said insulator in a range between 0.01 and 1 mm.

4. The feedthrough according to claim 1 , further comprising a secondary connection element electrically conductively joined with said primary connection element and said secondary connection element has at least one soft solderable point of contact.

5. The feedthrough according to claim 4 , wherein said secondary connection element is connected with said primary connection element through a soft solder, a low-melting hard solder, or a sintered material, or said secondary connection element consists of said soft solder, said low-melting hard solder, or said sintered material.

6. The feedthrough according to claim 4 , wherein said secondary connection element is spherical shaped, elliptical shaped, or polyhedral shaped.

7. The feedthrough according claim 4 , wherein at least one surface of said secondary connection element protruding out of said first housing-side surface of said insulator is coated with a material improving a soft-solderability or sinterability and selected from the group consisting of Cu, Ni, Ag, Sn, Au, Pt, Ir, Pd, and alloys of at least two of these or a layer system improving the soft-solderability selected from the group consisting of EPIG, ENEPIG and HAL.

8. A feedthrough of an implantable medical electronic device having a housing and a header, the feedthrough comprising:
an insulator having a first housing-side surface and a second surface opposite said first housing-side surface, said second surface facing away from the housing, said insulator having a least one passage with a widening section formed therein;
a feedthrough flange surrounding said insulator;
a hard solder connection; and
at least one primary connection element penetrating said insulator, for connection to an electrical or electronic component of the implantable medical electronic device, the electrical or electronic component being disposed in the housing, said primary connection element being fastened, by said hard solder connection, so that said primary connection element is fluid-tight in said passage of said insulator, said primary connection element having a housing-side end extending into said widening section of said passage serving as a material reservoir, wherein said housing-side end of said primary connection element being recessed into said first housing-side surface of said insulator, and covered with a hard solder or sintered material or soft solder layer so that a covering material layer has a surface that is even with said first housing-side surface of said insulator or forms a cupola bulging up out of said first housing-side surface of said insulator.

9. The feedthrough according to claim 8 , wherein said widening section is cylindrical-shaped, frustum-shaped, or bowl-shaped.

10. The feedthrough according to claim 8 , wherein said widening section of said passage is partly filled with a hard solder, which simultaneously surrounds said primary connection element in said passage, and a surface of said hard solder and of said housing-side end of said primary connection element has a soft solder or soft solderable sintered material on it.

11. The feedthrough according to claim 10 , further comprising a first, non-soft solderable sintered material and a second soft solderable sintered material disposed in said widening section along with said hard solder.

12. The feedthrough according to claim 10 , further comprising:
a first, higher-melting hard solder disposed in said widening section; and
a second lower-melting hard solder disposed on a surface of said widening section.

13. The feedthrough according to claim 8 , wherein said cupola of said covering material layer has a maximum height with respect to said first housing-side surface of said insulator in a range between 0.01 and 1 mm.

14. The feedthrough according to claim 8 , further comprising a secondary connection element electrically conductively joined with said primary connection element and said secondary connection element has at least one soft solderable point of contact.

15. The feedthrough according to claim 14 , wherein said secondary connection element is connected with said primary connection element through a soft solder, a low-melting hard solder, or a sintered material, or said secondary connection element consists of said soft solder, said low-melting hard solder, or said sintered material.

16. The feedthrough according to claim 14 , wherein said secondary connection element is spherical shaped, elliptical shaped, or polyhedral shaped.

17. The feedthrough according claim 14 , wherein at least one surface of said secondary connection element protruding out of said first housing-side surface of said insulator is coated with a material improving a soft-solderability or sinterability and selected from the group consisting of Cu, Ni, Ag, Sn, Au, Pt, Ir, Pd, and alloys of at least two of these or a layer system improving the soft-solderability selected from the group consisting of EPIG, ENEPIG and HAL.

18. The electrical feedthrough according to claim 8 , wherein:
said second surface is a header-side surface; and
said at least one primary connection element is one of a plurality of primary connection elements.

19. An implantable medical electronic device selected from the group consisting of a cardiac pacemaker, an implantable cardioverter and a cochlear implant, the implantable medical electronic device comprising:
a feedthrough according to claim 1 .

Assignees

• Biotronik Se & Co Kg

Inventors

• Kronmueller Daniel
• Arnold Michael

Classifications

• A61N1/0541

  Cochlear electrodes · CPC title

• A61N1/3754 Primary

  Feedthroughs · CPC title

• H01B17/303

  Sealing of leads to lead-through insulators · CPC title