System and method for bi-side heating vapor chamber structure in an information handling system

Patent metadata

Field	Value
Publication number	US-10856441-B1
Application number	US-201916682448-A
Country	US
Kind code	B1
Filing date	Nov 13, 2019
Priority date	Nov 13, 2019
Publication date	Dec 1, 2020
Grant date	Dec 1, 2020

Abstract

An information handling system includes a first device including a first heat generating region, a second device including a second heat generating region, and a cooling device. The cooling device has a first hot surface on a first side of the cooling device, a first cold surface on a second side of the cooling device, a second hot surface on the second side of the cooling device, and a second cold surface on the first side of the cooling device. The first heat generating region is thermally attached to the first hot surface. First heat from the first heat generating region is transmitted to the first cold surface. The second heat generating region is thermally attached to the second hot surface. Second heat from the second heat generating region is transmitted to the second cold surface.

First claim

What is claimed is:

1. An information handling system, comprising:
a first device including a first heat generating region;
a second device including a second heat generating region; and
a cooling device having a first hot surface on a first side of the cooling device, a first cold surface on a second side of the cooling device, a second hot surface on the second side of the cooling device, and a second cold surface on the first side of the cooling device;
wherein the first heat generating region is thermally attached to the first hot surface and first heat from the first heat generating region is transmitted to the first cold surface, and wherein the second heat generating region is thermally attached to the second hot surface and second heat from the second heat generating region is transmitted to the second cold surface.

2. The information handling system of claim 1 , wherein the cooling device is a vapor chamber.

3. The information handling system of claim 2 , wherein the vapor chamber evaporates a cooling liquid at the first hot surface to remove the first heat from the first device, and evaporates the cooling liquid at the second hot surface to remove the second heat from the second device.

4. The information handling system of claim 3 , wherein the vapor chamber condenses the cooling liquid at the first cold surface to transfer the first heat to the first cold surface, and condenses the cooling liquid at the second cold surface to transfer the second heat to the second cold surface.

5. The information handling system of claim 4 , wherein the vapor chamber includes a first wick structure to transfer the condensed cooling liquid from the first cold surface to the first hot surface, and includes a second wick structure to transfer the condensed cooling liquid from the second cold surface to the second hot surface.

6. The information handling system of claim 1 , further comprising:
a first heat removing apparatus thermally attached to the first cold surface to remove the first heat from the first cold surface; and
a second heat removing apparatus thermally attached to the second cold surface to remove the second heat from the second cold surface.

7. The information handling system of claim 6 , further comprising:
a first heat sink thermally attached to the first heat removing apparatus to remove the first heat from the first heat removing apparatus; and
a second heat sink thermally attached to the second heat removing apparatus to remove the second heat from the second heat removing apparatus.

8. The information handling system of claim 7 , further comprising:
a first fan thermally configured to blow air over the first heat sink to remove the first heat from the information handling system; and
a second fan thermally configured to blow air over the second heat sink to remove the second heat from the information handling system.

9. The information handling system of claim 6 , wherein the first and second heat removing apparatuses are heat pipes.

10. The information handling system of claim 6 , wherein the first and second heat removing apparatuses are integrated with the vapor chamber.

11. A method, comprising:
thermally attaching a first heat generating region of a first device of an information handling system to a first hot surface on a first side of a cooling device;
transmitting first heat from the first heat generating region to a first cold surface on a second side of the cooling device;
thermally attaching a second heat generating region of a second device of the information handling system to a second hot surface on the second side of the cooling device; and
transmitting second heat from the second heat generating region to a second cold surface on the first side of the cooling device.

12. The method of claim 11 , wherein the cooling device is a vapor chamber.

13. The method of claim 12 , further comprising:
evaporating, in the vapor chamber, a cooling liquid at the first hot surface to remove the first heat from the first device; and
evaporating, in the vapor chamber, the cooling liquid at the second hot surface to remove the second heat from the second device.

14. The method of claim 13 , further comprising:
condensing, in the vapor chamber, the cooling liquid at the first cold surface to transfer the first heat to the first cold surface; and
condensing, in the vapor chamber, the cooling liquid at the second cold surface to transfer the second heat to the second cold surface.

15. The method of claim 14 , further comprising:
transferring, by a first wick structure of the vapor chamber, the condensed cooling liquid from the first cold surface to the first hot surface; and
transferring, by a second wick structure of the vapor chamber, the condensed cooling liquid from the second cold surface to the second hot surface.

16. The method of claim 11 , further comprising:
removing, by a first heat removing apparatus thermally attached to the first cold surface, the first heat from the first cold surface; and
removing, by a second heat removing apparatus thermally attached to the second cold surface, the second heat from the second cold surface.

17. The method of claim 16 , further comprising:
removing, by a first heat sink thermally attached to the first heat removing apparatus, the first heat from the first heat removing apparatus; and
removing, by a second heat sink thermally attached to the second heat removing apparatus, the second heat from the second heat removing apparatus.

18. The method of claim 17 , further comprising:
blowing, by a first fan, air over the first heat sink to remove the first heat from the information handling system; and
blowing, by a second fan, air over the second heat sink to remove the second heat from the information handling system.

19. The method of claim 16 , wherein the first and second heat removing apparatuses are heat pipes.

20. A vapor chamber to remove first heat from a first device and to remove second heat from a second device, the vapor chamber comprising:
a first hot surface on a first side of the vapor chamber to receive the first heat from the first device;
a first cold surface on a second side of the vapor chamber to receive the first heat from the first hot surface;
a second hot surface on the second side of the vapor chamber to receive the second heat from the second device; and
a second cold surface on the first side of the vapor chamber to receive the second heat from the second hot surface.

Assignees

• Dell Products Lp

Inventors

• Huang Iris
• Hu Sean

Classifications

• G06F1/20

  Cooling means · CPC title

• H05K7/20809 Primary

  within server blades for removing heat from heat source · CPC title

• H05K7/20727

  within server blades for removing heat from heat source · CPC title

• H05K7/20154

  Heat dissipaters coupled to components · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title