Power electronics module and a method of producing a power electronics module

Patent metadata

Field	Value
Publication number	US-10856403-B2
Application number	US-201916262991-A
Country	US
Kind code	B2
Filing date	Jan 31, 2019
Priority date	Jan 31, 2018
Publication date	Dec 1, 2020
Grant date	Dec 1, 2020

Abstract

A power electronics module and a method of producing a power electronics module. The power electronics module includes multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and a heat transfer structure attached to the substrate and having a bottom surface which forms an outer surface of the module and which is adapted to receive a surface of a cooling device, wherein the heat transfer structure includes a compressible base plate.

First claim

The invention claimed is:

1. A power electronics module comprising
multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and
a heat transfer structure attached to the substrate and having a bottom surface which forms an outer surface of the module and which is adapted to receive a surface of a cooling device, wherein the heat transfer structure comprises a compressible base plate,
wherein the compressible base plate comprises heat transferring additives, including synthetic or natural diamond particles, alumina particles, graphene particles, silver particles and/or lead particles.

2. The power electronics module according to claim 1 , wherein the heat transfer structure is formed of the compressible base plate which is attached to the substrate.

3. The power electronics module according to claim 1 , wherein the compressible base plate comprises a metal plate having multiple of holes filled with a compressible material and a layer of compressible material, wherein the layer of compressible material is adapted to form the outer surface of the module.

4. The power electronics module according to claim 3 , wherein the layer of compressible material is applied to the surface of the metal plate.

5. The power electronics module according to claim 3 , wherein the compressible base plate comprises a first copper sheet attached to a surface of the metal plate, wherein the layer of compressible material is applied to a surface of the copper sheet to form the outer surface of the module.

6. The power electronics module according to claim 1 , wherein the base plate comprises a second copper sheet which is attached to the substrate.

7. The power electronic module according to claim 1 , wherein the compressible base plate is adapted to be deformed when the module is attached to a cooling device.

8. The power electronics module according to claim 1 , wherein the housing of the module comprises side edges surrounding the base plate, the side edges having a bottom surface which is adapted to be attached against a cooling device,
wherein the bottom surface of the side edges defines a level which is closer to the substrate than the level defined by the bottom surface of the heat transfer structure.

9. The power electronics module according to claim 1 , wherein the substrate is a direct bonded copper structure.

10. The power electronics module according to claim 1 , wherein the compressible base plate comprises an epoxy resin matrix.

11. The power electronics module according to claim 2 , wherein the compressible base plate comprises a metal plate having multiple of holes filled with a compressible material and a layer of compressible material, wherein the layer of compressible material is adapted to form the outer surface of the module.

12. The power electronics module according to claim 11 , wherein the layer of compressible material is applied to the surface of the metal plate.

13. The power electronics module according to claim 11 , wherein the compressible base plate comprises a first copper sheet attached to a surface of the metal plate, wherein the layer of compressible material is applied to a surface of the copper sheet to form the outer surface of the module.

14. The power electronics module according to claim 2 , wherein the base plate comprises a second copper sheet which is attached to the substrate.

15. The power electronic module according to claim 2 , wherein the compressible base plate is adapted to be deformed when the module is attached to a cooling device.

16. A method of producing a power electronics module comprising
providing multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and
attaching a heat transfer structure to the substrate, the heat transfer structure having a bottom surface which forms an outer surface of the module and which is adapted to receive a surface of a cooling device, wherein the heat transfer structure comprises a compressible base plate,
wherein the compressible base plate comprises heat transferring additives, including synthetic or natural diamond particles, alumina particles, graphene particles, silver particles and/or lead particles.

Assignees

• Abb Schweiz Ag

Inventors

• Manninen Jorma
• Silvennoinen Mika
• Pakarinen Joni
• Ingman Kjell

Classifications

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W40/77

  Auxiliary members characterised by their shape · CPC title

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H10W40/25 Primary

  characterised by their materials · CPC title

• H10W70/69

  Insulating materials thereof · CPC title