FET operational temperature determination by field plate resistance thermometry

Patent metadata

Field	Value
Publication number	US-10855230-B2
Application number	US-201916537831-A
Country	US
Kind code	B2
Filing date	Aug 12, 2019
Priority date	Jul 24, 2017
Publication date	Dec 1, 2020
Grant date	Dec 1, 2020

Abstract

Thermally-sensitive structures and methods for sensing the temperature in a region of a FET during device operation are described. The region may be at or near a region of highest temperature achieved in the FET. Metal resistance thermometry (MRT) can be implemented with gate or source structures to evaluate the temperature of the FET.

First claim

What is claimed is:

1. A field-effect transistor with temperature sensing comprising:
a gate;
a source contact;
a drain contact;
a source field plate coupled to the source contact;
a first pair of contact tabs connected to the source field plate and separated by a first distance for applying a probe current through the source field plate; and
a second pair of contact tabs connected to the source field plate and separated by a second distance for sensing a voltage across a region of the source field plate through which the probe current flows.

2. The field-effect transistor of claim 1 , wherein the source field plate overlays at least a portion of the gate.

3. The field-effect transistor of claim 1 , wherein the source field plate exhibits a change in resistance with a change in temperature of the source field plate that is not less than 0.001 ohms/° C.

4. The field-effect transistor of claim 1 , wherein the source field plate is AC-coupled to the source contact.

5. The field-effect transistor of claim 1 , wherein the first pair of contact tabs comprises a first thin-film resistor and a second thin-film resistor.

6. The field-effect transistor of claim 5 , wherein a resistance of the first thin-film resistor and of the second thin-film resistor is not less than 300 ohms.

7. The field-effect transistor of claim 5 , wherein the second pair of contact tabs comprises a third thin-film resistor and a fourth thin-film resistor.

8. The field-effect transistor of claim 7 , wherein a resistance of the third thin-film resistor and of the fourth thin-film resistor is not less than 300 ohms.

9. The field-effect transistor of claim 1 , further comprising a source of the probe current connected to the first pair of contact tabs.

10. The field-effect transistor of claim 9 , wherein the source of the probe current is configured to provide alternating current.

11. The field-effect transistor of claim 10 , wherein the alternating current has a frequency between 50 kilohertz and 5 megahertz.

12. The field-effect transistor of claim 1 , further comprising voltage-sensing circuitry connected to the second pair of contact tabs.

13. The field-effect transistor of claim 12 , wherein the voltage-sensing circuit provides an output signal to a feedback circuit that controls a power level of the field-effect transistor.

14. The field-effect transistor of claim 1 , wherein the field-effect transistor is incorporated in a power amplifier configured to amplify signals to a power level of not less than 0.25 Watt.

15. The field-effect transistor of claim 1 , further comprising an active area controlled by the gate, wherein the active area comprises GaN, GaAs, or InP.

16. The field-effect transistor of claim 1 , further comprising an active area controlled by the gate, wherein the active area comprises Si.

17. The field-effect transistor of claim 1 , wherein the field-effect transistor is an LDMOS FET, MOSFET, MISFET, or MODFET.

18. The field-effect transistor of claim 1 , wherein the field-effect transistor is an HEMT, HFET, or pHEMT.

19. A method of operating a field-effect transistor, the method comprising:
applying a signal to a gate of the field-effect transistor;
amplifying the signal with the field-effect transistor;
applying a probe current to a region of a source field plate of the field-effect transistor, wherein the source field plate is coupled to a source contact of the field-effect transistor; and
sensing a voltage produced by the probe current.

20. The method of claim 19 , further comprising evaluating from the sensed voltage a peak temperature of the field-effect transistor.

21. The method of claim 20 , wherein the evaluating comprises using calibration results relevant to the field-effect transistor.

22. The method of claim 19 , further comprising:
comparing the sensed voltage to a reference value; and
controlling a power level of the field-effect transistor based upon the comparison.

23. The method of claim 19 , wherein applying the probe current comprises applying the probe current along a region of the source field plate that overlays at least a portion of the gate.

24. The method of claim 19 , wherein applying the probe current comprises applying an alternating current in the region.

25. The method of claim 24 , wherein applying the alternating current comprises applying the alternating current at a first frequency that is different from a carrier wave frequency amplified by the field-effect transistor by not less than a factor of 10.

26. The method of claim 19 , wherein applying the probe current comprises intermittently applying the probe current in the region, such that the probe current is driven for intervals of time that are spaced apart by other intervals of time in which no probe current is driven in the region of the source field plate.

Assignees

• Macom Tech Solutions Holdings Inc

Inventors

• Mahon Simon John
• Hanson Allen W
• Schwitter Bryan
• Lian Chuanxin
• Baskaran Rajesh
• Gao Frank

Classifications

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• H10W20/20

  Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] · CPC title

• H10D64/519

  characterised by their top-view geometrical layouts · CPC title

• H10D64/256

  for lateral devices wherein the source or drain electrodes are recessed in semiconductor bodies (source or drain electrodes of TFTs H10D30/673) · CPC title

• H10D64/251

  Source or drain electrodes for field-effect devices · CPC title