Motor drive unit

Patent metadata

Field	Value
Publication number	US-10855146-B2
Application number	US-201715456761-A
Country	US
Kind code	B2
Filing date	Mar 13, 2017
Priority date	Mar 11, 2016
Publication date	Dec 1, 2020
Grant date	Dec 1, 2020

Abstract

A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.

First claim

We claim:

1. Apparatus comprising:
a power plane configured with a circular geometry about a central axis and configured to be mounted inside a space envelope having a substantially similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate, the power plane including electronics of a variable frequency drive and configured as a multi-layer circuit board or assembly having at least:
a power layer comprising a plurality of power modules, the plurality of power modules arranged in a circular pattern about the central axis and including circuitry configured to provide power to a motor,
a control layer comprising at least one control electronics module, the at least one control electronics module comprising circuitry configured to control the power provided to the motor, and
a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the plurality of power modules of the power layer and the at least one control electronics module of the control layer, and also that provides insulation between the power layer and the control layer, the plurality of power modules and the at least one control electronics module attached to opposite sides of the thermal barrier and printed circuit board layer.

2. Apparatus according to claim 1 , wherein the power plane is configured to do at least the following:
provide the electrical connection paths for interconnecting together the plurality of power modules and the at least one control electronics module, as well as for interconnecting input/output power connections and the plurality of power modules and the at least one control electronics module, and
direct heat emitted from one or more of the plurality of power modules, the at least one control electronics module and a shaft of the motor to an outer diameter of the power plane.

3. Apparatus according to claim 1 , wherein the power plane has a doughnut shape dimensioned to fit in the space envelope of the end-plate, to allow space for mounting the power layer and the control layer, and to allow a shaft of a rotor of the motor to pass through to drive a cooling fan.

4. Apparatus according to claim 1 , wherein
the circuitry of the plurality of power modules of the power layer generates more heat than the circuitry of the at least one control electronics module of the control layer; and
the thermal barrier and printed circuit board layer comprises a material having sufficient structural thickness and strength to mount the control layer on one side and the power layer on an opposite side, the material configured to provide insulation to reduce the transfer of heat between the power layer and the control layer.

5. Apparatus according to claim 1 , wherein the thermal barrier and printed circuit board layer comprises a laminated material, including fiberglass, that provides structural strength and acts as an insulator between power semiconductors of the power layer and control electronics and power quality capacitors of the control layer.

6. Apparatus according to claim 1 , wherein the plurality of power modules couple, via the thermal barrier and printed circuit board layer, to low inductance input and integrated output connections.

7. Apparatus according to claim 1 , wherein the power plane implements a matrix converter configured to receive AC input signaling having an AC waveform with a voltage and frequency and provide converted AC signaling having a converted AC waveform with a converted voltage and frequency to drive the motor.

8. Apparatus according to claim 7 , wherein the circuitry of the at least one control electronics module of the control layer comprises at least one power quality filter component configured to reduce electrical noise and harmonic distortions.

9. Apparatus according to claim 8 , wherein the at least one power quality filter component comprises a plurality of power quality filter components, and wherein the plurality of power quality filter components and the plurality of power modules are mounted opposite sides of the thermal barrier and printed circuit board layer.

10. Apparatus according to claim 1 , wherein
the plurality of power modules comprises power semiconductor modules;
the at least one control electronics module comprises power quality capacitors; and
the power plane comprises low inductance and resistance inputs positioned between the power semiconductor modules and the power quality capacitors and configured to reduce switching stress and electromagnetic interference.

11. Apparatus according to claim 1 , wherein the power plane comprises a compact power quality filter integrated therein.

12. Apparatus according to claim 1 , wherein the power plane comprises a built-in power quality filter.

13. Apparatus according to claim 1 , further comprising the end-plate, wherein the apparatus comprises a drive module assembly which includes the end-plate, the power plane mounted within the space envelope of the end-plate, and one or more connections configured to allow for removable mounting of the drive module assembly to a motor.

14. Apparatus according to claim 1 , wherein
the power plane comprises a combination of one or more of current sensors, at least one gate driver, a power supply, a clamp circuit, power semi-conductor modules and power quality capacitors; and
the electrical connection paths are configured to interconnect input/output power connections and the combination of one or more of the current sensors, the at least one gate driver, the power supply, the clamp circuit, the power semi-conductor modules and the power quality capacitors.

15. Apparatus according to claim 1 , wherein
the apparatus comprises the end-plate;
the inner hub portion is configured to receive a shaft of a rotor of the motor; and
the peripheral portion includes heat fins configured to dissipate away from the end-plate heat generated by the plurality of power modules and the at least one control electronics module.

16. Apparatus according to claim 1 , wherein the apparatus comprises a motor casing configured to operate as a heat sink to provide enhanced thermal operation of the power plane.

17. Apparatus according to claim 1 , wherein the apparatus is, or takes the form of, a motor assembly further comprising a motor for driving a rotary device or pump.

18. A motor assembly for driving a rotary device or pump comprising:
an end-plate defining a space envelope, the space envelope having a doughnut geometry and being formed between an inner hub portion of the end-plate that receives a shaft of a motor along a central shaft axis and a peripheral portion of the end-plate that extends circumferentially around the space envelope, the peripheral portion having heat fins configured to dissipate heat away from the end-plate; and
a power plane having a corresponding doughnut geometry similar to the doughnut geometry of the space envelope and being mounted inside the space envelope, the power plane including electronics of a variable frequency drive and configured as a multi-layer circuit board or assembly having at least:
a power layer comprising a plurality of power modules, the power modules arranged in a circular pattern about the central shaft axis and configured to provide power to the motor,
a control layer comprising at least one control electronics module configured to control the power provided to the motor, and
a thermal barrier and printed circuit boa

Assignees

• Itt Mfg Enterprises Llc

Inventors

• Williams Dean P
• Playford Mark A
• Kernan Daniel J
• Empringham Lee
• De Lillo Liliana V
• Tighe Christopher J F

Classifications

• H02K9/06

  with fans or impellers driven by the machine shaft · CPC title

• H02K5/18 Primary

  with ribs or fins for improving heat transfer · CPC title

• H02K11/33 Primary

  Drive circuits, e.g. power electronics (H02K11/38 takes precedence) · CPC title

• H02K11/27

  Devices for sensing current, or actuated thereby (overcurrent protection responsive to temperature of the machines or parts thereof, e.g. windings, H02K11/25) · CPC title

• H02K5/225

  Terminal boxes or connection arrangements (specially adapted for submersible motors H02K5/132) · CPC title