Display device and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-10854697-B2
Application number	US-201816204102-A
Country	US
Kind code	B2
Filing date	Nov 29, 2018
Priority date	Dec 2, 2013
Publication date	Dec 1, 2020
Grant date	Dec 1, 2020

Abstract

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

First claim

What is claimed is:

1. A method for manufacturing a display device, the method comprising the steps of:
preparing a stacked body comprising a first substrate, an organic resin layer over the first substrate, a transistor over the organic resin layer, an EL element over the transistor, a second substrate over the EL element, and a plurality of insulating layers and a sealing layer comprising a resin material between the EL element and the second substrate; and
separating the first substrate from the stacked body by irradiating the organic resin layer with a laser light through the first substrate.

2. The method for manufacturing a display device according to claim 1 , wherein the step of separating the first substrate from the stacked body is performed while injecting a liquid into an interface between the first substrate and the organic resin layer.

3. The method for manufacturing a display device according to claim 2 , wherein the liquid is water.

4. The method for manufacturing a display device according to claim 1 , further comprising a layer between the organic resin layer and the transistor,
wherein the layer has a stacked structure, and
wherein the layer comprises any one of silicon oxide, silicon oxynitride, silicon nitride, and silicon nitride oxide.

5. The method for manufacturing a display device according to claim 1 , wherein the organic resin layer comprises a polyimide resin.

6. A method for manufacturing a display device, the method comprising the steps of:
preparing a stacked body comprising a first substrate, an organic resin layer over the first substrate, a transistor over the organic resin layer, an EL element over the transistor, a second substrate over the EL element, and a sealant which bonds the first substrate to the second substrate and surrounds a pixel portion comprising the transistor and the EL element; and
separating the first substrate from the stacked body by irradiating the organic resin layer with a laser light through the first substrate.

7. The method for manufacturing a display device according to claim 6 , further comprising a sealing layer comprising a resin material between the EL element and the second substrate, wherein the sealant surrounds the sealing layer.

8. The method for manufacturing a display device according to claim 6 , further comprising a layer between the organic resin layer and the transistor,
wherein the layer has a stacked structure, and
wherein the layer comprises any one of silicon oxide, silicon oxynitride, silicon nitride, and silicon nitride oxide.

9. The method for manufacturing a display device according to claim 6 , wherein the organic resin layer comprises a polyimide resin.

10. A method for manufacturing a display device, the method comprising the steps of:
preparing a stacked body comprising a first substrate, an organic resin layer over the first substrate, a transistor over the organic resin layer, an EL element over the transistor, a second substrate over the EL element, and a sealant which bonds the first substrate to the second substrate and surrounds a pixel portion comprising the transistor and the EL element;
irradiating the organic resin layer with a laser light through the first substrate; and
separating the first substrate from the stacked body by rotation of a roller overlapping with the stacked body after the step of irradiating the organic resin layer with the laser light.

11. The method for manufacturing a display device according to claim 10 , further comprising a sealing layer comprising a resin material between the EL element and the second substrate, wherein the sealant surrounds the sealing layer.

12. The method for manufacturing a display device according to claim 10 , further comprising a layer between the organic resin layer and the transistor,
wherein the layer has a stacked structure, and
wherein the layer comprises any one of silicon oxide, silicon oxynitride, silicon nitride, and silicon nitride oxide.

13. The method for manufacturing a display device according to claim 10 , wherein the organic resin layer comprises a polyimide resin.

14. A method for manufacturing a display device, the method comprising the steps of:
preparing a stacked body comprising a first substrate, an organic resin layer formed as a single layer over the first substrate, a silicon oxide layer over and in contact with the organic resin layer, a transistor over the silicon oxide layer, an EL element over the transistor, and a sealing layer over the EL element;
separating the first substrate from the organic resin layer by irradiating the organic resin layer with a laser light through the first substrate; and
bonding a flexible substrate to the organic resin layer with a bonding layer interposed between the flexible substrate and the organic resin layer,
wherein, after the bonding, the organic resin layer in the display device is a single layer in contact with the silicon oxide layer and the bonding layer.

15. The method for manufacturing a display device according to claim 14 , wherein the step of separating the first substrate from the organic resin layer is performed while injecting a liquid into an interface between the first substrate and the organic resin layer.

16. The method for manufacturing a display device according to claim 15 , wherein the liquid is water.

17. The method for manufacturing a display device according to claim 14 , wherein the organic resin layer comprises a polyimide resin.

18. A method for manufacturing a display device, the method comprising the steps of:
preparing a stacked body comprising a first substrate, an organic resin layer formed as a single layer over the first substrate, a silicon oxide layer over and in contact with the organic resin layer, a transistor over the silicon oxide layer, an EL element over the transistor, and a sealing layer over the EL element;
separating the first substrate from the organic resin layer by irradiating the organic resin layer with a laser light outputted from a plurality of oscillators through the first substrate; and
bonding a flexible substrate to the organic resin layer with a bonding layer interposed between the flexible substrate and the organic resin layer,
wherein, after the bonding, the organic resin layer in the display device is a single layer in contact with the silicon oxide layer and the bonding layer.

19. The method for manufacturing a display device according to claim 18 , wherein the step of separating the first substrate from the organic resin layer is performed while injecting a liquid into an interface between the first substrate and the organic resin layer.

20. The method for manufacturing a display device according to claim 19 , wherein the liquid is water.

21. The method for manufacturing a display device according to claim 18 , wherein the organic resin layer comprises a polyimide resin.

22. A method for manufacturing a display device, the method comprising the steps of:
preparing a stacked body comprising a first substrate, an organic resin layer formed as a single layer over the first substrate, a silicon oxide layer over and in contact with the organic resin layer, an insulating layer over the silicon oxide layer, a semiconductor layer over and in contact with the insulating layer, an EL element over the semiconductor layer, and a sealing layer over the EL element;
separating the first substrate from the organic resin layer by irradiating the organic resin layer with a laser light through the f

Assignees

• Semiconductor Energy Lab

Inventors

• Yamazaki Shunpei
• Ohno Masakatsu
• Adachi Hiroki
• Idojiri Satoru
• Takeshima Koichi

Classifications

• Y02E10/549

  Organic PV cells · CPC title

• G02F1/1303

  Apparatus specially adapted to the manufacture of LCDs · CPC title

• H10K59/8792

  comprising light absorbing layers, e.g. black layers · CPC title

• H10K59/8722

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H10K59/126

  Shielding, e.g. light-blocking means over the TFTs · CPC title