Fingerprint sensor and manufacturing method thereof
US-2016358007-A1 · Dec 8, 2016 · US
Fingerprint chip package and method for processing same
US10854536B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10854536-B2 |
| Application number | US-201816133668-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 17, 2018 |
| Priority date | Jan 22, 2017 |
| Publication date | Dec 1, 2020 |
| Grant date | Dec 1, 2020 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A fingerprint chip package and method for processing same, relating to a field of biometric identification. The fingerprint chip package includes: a lead frame (1), a chip (2), and a plastic packaging part enclosing the lead frame (1) and the chip (2); the lead frame (1) comprises a base island (13), a connecting rib (11), and a golden finger (12); the base island (13) is used for bearing the chip (2); the connecting rib (11) is used for supporting the lead frame (1) and connecting the base island (13) via the golden finger (12); and the golden finger (12) is used for fixing the base island (13) and electrically connecting with the chip (2).
First claim
Opening claim text (preview).
What is claimed is: 1. A fingerprint chip package, comprising: a lead frame, a chip, and a plastic packaging part enclosing the lead frame and the chip; wherein the lead frame comprises a base island, a connecting rib, and connecting fingers, wherein the connecting rib is a metal frame; the base island is used for bearing the chip; the connecting fingers comprises a first connecting finger and a second connecting finger; the base island is fixedly connected to the connecting rib via the first connecting finger on at least two sides of the connecting rib; and the chip is electrically connected to the second connecting finger on at least one side of the connecting rib, wherein the connecting rib on an end of the second connecting finger is disconnected. 2. The fingerprint chip package according to claim 1 , wherein the connecting fingers are disposed on four sides of the connecting rib, respectively, and at least one connecting finger is disposed on each side. 3. The fingerprint chip package according to claim 1 , wherein the base island is fixedly connected to the multiple first connecting fingers on three sides, and the chip is electrically connected to the second connecting finger on one side. 4. The fingerprint chip package according to claim 1 , wherein at least one aluminum pad is provided on the chip; and the aluminum pads on the chip are connected with the second connecting finger using a bonding wire. 5. The fingerprint chip package according to claim 2 , wherein at least one aluminum pad is provided on the chip; and the aluminum pads on the chip are connected with the second connecting finger using a bonding wire.
Assignees
Inventors
Classifications
between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title
comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title
of bond wires · CPC title
Interconnections for measuring or testing, e.g. probe pads · CPC title
Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title
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Frequently asked questions
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- What does patent US10854536B2 cover?
- A fingerprint chip package and method for processing same, relating to a field of biometric identification. The fingerprint chip package includes: a lead frame (1), a chip (2), and a plastic packaging part enclosing the lead frame (1) and the chip (2); the lead frame (1) comprises a base island (13), a connecting rib (11), and a golden finger (12); the base island (13) is used for bearing the c…
- Who is the assignee on this patent?
- Shenzhen Goodix Tech Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W70/042. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 01 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).