Multilayer capacitor and board having the same
US-2018019064-A1 · Jan 18, 2018 · US
US10854384B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10854384-B2 |
| Application number | US-201816205639-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 30, 2018 |
| Priority date | Oct 10, 2018 |
| Publication date | Dec 1, 2020 |
| Grant date | Dec 1, 2020 |
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A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes alternately exposed to first and second outer surfaces with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second outer surfaces of the ceramic body so as to be connected to the first and second internal electrodes, respectively. The first internal electrode has a plurality of first ends connected to the first external electrode and a first recessed region positioned between the plurality of first ends, the first recessed region at least partially filled with a dielectric material. The second internal electrode has a plurality of second ends connected to the second external electrode and a second recessed region positioned between the plurality of second ends, the second recessed region at least partially filled with the dielectric material.
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What is claimed is: 1. A multilayer ceramic electronic component comprising: a ceramic body including a dielectric layer, and first and second internal electrodes alternately exposed to first and second outer surfaces with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second outer surfaces of the ceramic body so as to be connected to the first and second internal electrodes, respectively, wherein the first internal electrode has a plurality of first ends connected to the first external electrode and a first recessed region positioned between the plurality of first ends, the first recessed region at least partially filled with a dielectric material, and the second internal electrode has a plurality of second ends connected to the second external electrode and a second recessed region positioned between the plurality of second ends, the second recessed region at least partially filled with the dielectric material, in a cross-section cut across the first and second outer surfaces and the first and second recessed regions, the dielectric layer has a diagonal boundary line on only an upper part, a lower part, or both the upper part and the lower part of the other end of each of the first and second internal electrodes. 2. The multilayer ceramic electronic component of claim 1 , wherein at least a part of a boundary line of the first recessed region is an oblique with respect to the plurality of first ends, and at least a part of a boundary line of the second recessed region is an oblique with respect to the plurality of second ends. 3. The multilayer ceramic electronic component of claim 2 , wherein a total length, in a width direction of the ceramic body, of the plurality of first ends is shorter than half a width of the ceramic body, and a total length, in the width direction of the ceramic body, of the plurality of second ends is shorter than half the width of the ceramic body. 4. The multilayer ceramic electronic component of claim 3 , wherein an interval between the plurality of first ends is shorter than the total length of the plurality of first ends, and wherein an interval between the plurality of second ends is shorter than the total length of the plurality of second ends. 5. The multilayer ceramic electronic component of claim 2 , wherein the first recessed region is spaced apart from the second internal electrode when viewed in a thickness direction of the ceramic body, and the second recessed region is spaced apart from the first internal electrode when viewed in the thickness direction. 6. The multilayer ceramic electronic component of claim 1 , wherein each of the first and second recessed regions has a semicircular shape. 7. The multilayer ceramic electronic component of claim 1 , wherein a thickness of a region of the dielectric layer at an upper part or a lower part of the plurality of first and second ends is larger than that of another region of the dielectric layer between the first and second internal electrodes. 8. The multilayer ceramic electronic component of claim 1 , wherein the dielectric material filled in at least a part of the first and second recessed regions is filled with a density larger than the dielectric layer. 9. The multilayer ceramic electronic component of claim 1 , wherein the first and second internal electrodes include Ni. 10. The multilayer ceramic electronic component of claim 1 , wherein the plurality of first ends and the first recessed region are exposed to the first outer surface, and the plurality of second ends and the second recessed region are exposed to the second outer surface. 11. The multilayer ceramic electronic component of claim 1 , wherein the dielectric material at least partially filling the first recessed region is spaced apart from the second external electrode, and the dielectric material at least partially filling the second recessed region is spaced apart from the first external electrode. 12. The multilayer ceramic electronic component of claim 1 , wherein the dielectric material at least partially filling the first recessed region is in contact with the first external electrode, and the dielectric material at least partially filling the second recessed region is in contact with the second external electrode.
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