Flowmeters and methods of manufacture

US10852173B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10852173-B2
Application numberUS-201816224380-A
CountryUS
Kind codeB2
Filing dateDec 18, 2018
Priority dateDec 18, 2018
Publication dateDec 1, 2020
Grant dateDec 1, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A flowmeter system that includes a flowmeter body defining a central bore. A plurality of flanges couple to the flowmeter body. The flowmeter body and the plurality of flanges form a one-piece structure without welded joints. A rotor within the central bore of the flowmeter body. A first vane within the central bore of the flowmeter body. The first vane couples to and supports the rotor within the flowmeter body. The flowmeter body, the flanges, the rotor, and the first vane comprise additive structures.

First claim

Opening claim text (preview).

The invention claimed is: 1. A flowmeter system, comprising: a flowmeter body defining a central bore; a plurality of flanges coupled to the flowmeter body, wherein the flowmeter body and the plurality of flanges form a one-piece structure without welded joints; a rotor within the central bore of the flowmeter body; a first vane within the central bore of the flowmeter body, wherein the first vane couples to and supports the rotor within the flowmeter body; and wherein at least one of the flowmeter body, the flanges, the rotor, and the first vane comprise additive structures. 2. The flowmeter system of claim 1 , wherein the additive structures comprise a lattice structure. 3. The flowmeter system of claim 1 , wherein the additive structures comprise a honeycomb structure. 4. The flowmeter system of claim 1 , wherein the rotor comprises additive structures that comprise a paramagnetic material. 5. The flowmeter system of claim 1 , comprising a second vane configured to support the rotor. 6. The flowmeter system of claim 5 , wherein the first vane and the second vane comprise a respective first vane body and a second vane body, and wherein the first vane body defines a first aperture and the second vane body defines a second aperture. 7. The flowmeter system of claim 6 , comprising a shaft configured to extend through an aperture in the rotor, wherein a first end of the shaft is configured to rest within the first aperture and a second end of the shaft is configured to rest within the second aperture. 8. The flowmeter system of claim 6 , wherein the first vane comprises a vane body and a vane fin coupled to the vane body wherein the vane body and the vane fin comprise the additive structures. 9. The flowmeter system of claim 1 , wherein the plurality of flanges comprises a first flange, a second flange, and a third flange, and wherein the first flange and the second flange couple to ends of the flowmeter body and the third flange is between the first flange and the second flange. 10. The flowmeter system of claim 9 , wherein the third flange surrounds an aperture that extends through the flowmeter body. 11. A method of manufacturing a flowmeter system, the method comprising: defining a configuration for a flowmeter body, a rotor, a vane, and/or a flange, wherein at least one of the flowmeter body, the rotor, the vane, and/or the flange comprises an additive structure; depositing a feedstock into a chamber; applying an energy source to the feedstock; and consolidating the feedstock into a layer according to the defined configuration. 12. The method of claim 11 , wherein the feedstock comprises a paramagnetic material. 13. The method of claim 11 , wherein the additive structure is a lattice structure. 14. The method of claim 11 , wherein the additive structure is a honeycomb structure. 15. The method of claim 11 , wherein the vane comprises a vane body and a vane fin coupled to the vane body wherein the vane body and the vane fin comprise the additive structure. 16. A flowmeter system, comprising: a flowmeter body defining a central bore; a plurality of flanges coupled to the flowmeter body, wherein the flowmeter body and the plurality of flanges form a one-piece structure without welded joints; a rotor within the central bore of the flowmeter body; a first vane within the central bore of the flowmeter body, wherein the vane couples to and supports the rotor within the flowmeter body; and wherein the flowmeter body, the flanges, the rotor, and the first vane comprise additive structures. 17. The flowmeter system of claim 16 , wherein additive structure changes within at least one of the flowmeter body, the flanges, the rotor, and the first vane. 18. The flowmeter system of claim 17 , wherein a pattern of the additive structures change. 19. The flowmeter system of claim 17 , wherein dimensions of the additive structures change. 20. The flowmeter system of claim 16 , wherein the rotor comprises additive structures that comprise a paramagnetic material.

Assignees

Inventors

Classifications

  • G01F15/14Primary

    Casings, e.g. of special material · CPC title

  • G01F15/006Primary

    characterised by the use of a particular material, e.g. anti-corrosive material (G01F15/14 takes precedence) · CPC title

  • by thermal means (control of energy beam parameters for post heating B22F10/364) · CPC title

  • Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

  • comprising complex forms, e.g. honeycombs · CPC title

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What does patent US10852173B2 cover?
A flowmeter system that includes a flowmeter body defining a central bore. A plurality of flanges couple to the flowmeter body. The flowmeter body and the plurality of flanges form a one-piece structure without welded joints. A rotor within the central bore of the flowmeter body. A first vane within the central bore of the flowmeter body. The first vane couples to and supports the rotor within …
Who is the assignee on this patent?
Sensia Llc
What technology area does this patent fall under?
Primary CPC classification G01F15/14. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Dec 01 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).