Fold open face seal package

US10850903B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10850903-B2
Application numberUS-201816183931-A
CountryUS
Kind codeB2
Filing dateNov 8, 2018
Priority dateDec 9, 2015
Publication dateDec 1, 2020
Grant dateDec 1, 2020

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A fold open face seal package is provided. The package may comprise a one or two-piece thermoformed blister adhered to a backing card. In the one piece embodiment upper and lower portions of the blister are connected by one or more hinges. In the two-piece embodiment the blister is cut into upper and lower pieces which are adhered to the backing card. The package may be opened by folding the backing card back along a bend line and then reclosed for later use.

First claim

Opening claim text (preview).

The invention claimed is: 1. A recloseable package for holding one or more articles, the package being repeatedly configurable between a closed position and an open position, the package comprising: a backing card having a front surface, two side edges and a bend line, the bend line dividing the backing card into a card upper portion and a card lower portion, the bend line defining an axis of rotation, the backing card defining a first plane when the package is in the closed position; and a one piece blister adhered to the backing card and comprising a blister body and a flange extending laterally away from a periphery of the blister body, the flange having a width and terminating in a flange edge, the blister having a planar cutline located entirely within a second plane perpendicular to and intersecting the first plane at the bend line when the package is in the closed position, the cutline extending substantially continuously across the blister body, the cutline dividing the blister into a blister upper portion and a blister lower portion; the flange comprising a flange upper portion extending laterally from the blister upper portion and a flange lower portion extending laterally from the blister lower portion, the blister and the backing card defining an interior for holding the one or more articles, the flange comprising a formed hinge located on either lateral side of the blister body, each formed hinge comprising a three-dimensional contoured body extending longitudinally the width of the flange and tapering from a first end located at the flange edge to a second end located at the blister sidewall, the blister upper portion and the blister lower portion being connected at the formed hinges in both the closed and open configurations; wherein in the closed position, the blister upper portion is adhered to the card upper portion, the blister lower portion is adhered to the card lower portion, and the lower edge of the blister upper portion and the top edge of the blister lower portion abut along the cutline; and in the open position, the backing card remains intact but is in the bent position, the blister upper portion remains adhered to the card upper portion, the blister lower portion remains adhered to the card lower portion, and the lower edge of the blister upper portion and the top edge of the blister lower portion are spaced apart to allow access to the one or more articles. 2. The package of claim 1 wherein: the blister body comprises a front face having side edges and sidewalls extending rearwardly from the side edges and terminating at the body periphery, a top wall extending rearwardly from a top edge of the front face to the body periphery, and a bottom wall extending rearwardly from a bottom edge of the front face to the body periphery. 3. The package of claim 1 wherein: the package has an unopened configuration in which the body comprises small discontinuities along the cutline where the blister upper portion and the blister lower portion are connected to each other. 4. The package of claim 2 wherein: the body front face comprises a first area and a domed area relatively farther from the backing card than the first area. 5. The package of claim 4 wherein: the domed area straddles the cutline. 6. The package of claim 1 wherein, when the package is in the open configuration, the one or more articles are held within a portion of the interior space defined by the backing card and the blister lower portion. 7. The package of claim 1 wherein: each formed hinge further comprises two longitudinal edges coincident with the flange, the two longitudinal edges converging in the direction of the body sidewall.

Assignees

Inventors

Classifications

  • Batteries · CPC title

  • and forming one compartment · CPC title

  • B65D75/585Primary

    the tear-lines being broken by deformation or bending · CPC title

Patent family

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External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10850903B2 cover?
A fold open face seal package is provided. The package may comprise a one or two-piece thermoformed blister adhered to a backing card. In the one piece embodiment upper and lower portions of the blister are connected by one or more hinges. In the two-piece embodiment the blister is cut into upper and lower pieces which are adhered to the backing card. The package may be opened by folding the ba…
Who is the assignee on this patent?
Sonoco Dev Inc
What technology area does this patent fall under?
Primary CPC classification B65D75/585. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 01 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).