Polyester resin composition and production method thereof

US10850485B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10850485-B2
Application numberUS-201615566570-A
CountryUS
Kind codeB2
Filing dateMar 22, 2016
Priority dateApr 15, 2015
Publication dateDec 1, 2020
Grant dateDec 1, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A polyester resin composition including an ionic liquid that can dissolve an acid component monomer and/or oligomers of a polyester terephthalate, and a copper element that exhibits a reduced amount of production of the acid component monomer and/or oligomers of the polyester. Examples of the ionic liquid include 1-butyl-3-methylimidazolium acetate, 1-butyl-3-methylimidazolium chloride and tetrabutyl ammonium bromide. In one polyester resin composition, the surface roughness Ra of a capture plate is less than 0.150 μm, as measured when a sample of the polyester resin composition is melt at 300° C. for 60 minutes under a nitrogen atmosphere, quickly cooled and thermally treated at 220° C. for 8 hours to form scattered products which are then attached to the capture plate and a gelation ratio after a 6-hour melting treatment at 300° C. under an atmosphere with an oxygen concentration of 1% is 5% or less.

First claim

Opening claim text (preview).

The invention claimed is: 1. A polyester resin composition comprising: 1) a polyester consisting essentially of polyethylene terephthalate, 2) an ionic liquid selected from the group consisting of tetrabutyl ammonium benzoate, tetrabutyl ammonium salicylate and a combination thereof, and 3) a copper compound selected from the group consisting of copper(I) oxide, copper(II) oxide, lithium dimethylcuprate, lithium dibutylcuprate, copper(I) acetate, copper(II) acetate, copper benzoate, copper carbonate, copper chloride, copper bromide and copper iodide; wherein a surface roughness Ra of a glass plate having scattered products derived from the polyester resin composition attached thereto is less than 0.150 μm as measured when a sample of the polyester resin composition is melted at 300° C. for 60 minutes under a nitrogen atmosphere, cooled and thermally treated at 220° C. for 8 hours to form the scattered products attached to the glass plate, the glass plate having an initial surface roughness Ra of 0.010 μm, and a gelation ratio after a 6-hour melting treatment at 300° C. under an atmosphere with an oxygen concentration of 1% is 5% or less. 2. The polyester resin composition according to claim 1 , wherein the ionic liquid content is 0.01 to 20 wt % based on the polyester resin. 3. The polyester resin composition according to claim 1 , wherein pKa of a conjugate acid of an anion in the ionic liquid is greater than −10. 4. The polyester resin composition according to claim 1 , wherein an anion molecular weight in the ionic liquid is 270 or less.

Assignees

Inventors

Classifications

  • Polyesters derived from dicarboxylic acids and dihydroxy compounds; (C08J2367/06 takes precedence) · CPC title

  • Manufacture of films or sheets · CPC title

  • Post-polymerisation treatment · CPC title

  • Germanium, tin, lead, arsenic, antimony, bismuth, titanium, zirconium, hafnium, vanadium, niobium, tantalum, or compounds thereof {(C08G63/823 takes precedence)} · CPC title

  • Solid-state polycondensation · CPC title

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What does patent US10850485B2 cover?
A polyester resin composition including an ionic liquid that can dissolve an acid component monomer and/or oligomers of a polyester terephthalate, and a copper element that exhibits a reduced amount of production of the acid component monomer and/or oligomers of the polyester. Examples of the ionic liquid include 1-butyl-3-methylimidazolium acetate, 1-butyl-3-methylimidazolium chloride and tetr…
Who is the assignee on this patent?
Toray Industries
What technology area does this patent fall under?
Primary CPC classification C08G63/183. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Dec 01 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).