Three-dimensional (3D) printing with epoxy mold compound

Patent metadata

Field	Value
Publication number	US-10850446-B2
Application number	US-201616073181-A
Country	US
Kind code	B2
Filing date	Apr 20, 2016
Priority date	Apr 20, 2016
Publication date	Dec 1, 2020
Grant date	Dec 1, 2020

Abstract

In a three-dimensional printing method example, an epoxy mold compound build material is applied. A fusing agent is selectively applied on at least a portion of the epoxy mold compound build material. The epoxy mold compound build material is exposed to energy, thereby fusing the portion of the epoxy mold compound build material in contact with the fusing agent to form a layer.

First claim

What is claimed is:

1. A three-dimensional (3D) printing method, comprising:
applying a one part thermal cure epoxy mold compound build material;
selectively applying a fusing agent on at least a portion of the epoxy mold compound build material; and
exposing the epoxy mold compound build material to energy, thereby fusing the portion of the epoxy mold compound build material in contact with the fusing agent to form a layer.

2. The method as defined in claim 1 wherein the epoxy mold compound build material is a white powder.

3. The method as defined in claim 2 , further comprising preparing the epoxy mold compound build material by grinding and sorting, by particle size, an epoxy mold compound build material precursor.

4. The method as defined in claim 3 wherein the grinding is accomplished in liquid nitrogen.

5. The method as defined in claim 2 wherein the epoxy mold compound build material includes a catalyst selected from the group consisting of a phosphorous catalyst, an amine catalyst, and an imidazole catalyst.

6. The method as defined in claim 1 wherein the epoxy mold compound build material is a thermal set material.

7. The method as defined in claim 1 wherein the applying of the epoxy mold compound build material is accomplished by spraying the epoxy mold compound build material.

8. The method as defined in claim 7 wherein the epoxy mold compound build material includes a melting epoxy resin and a non-melting filler, and wherein a ratio of melting epoxy resin to non-melting filler ranges from about 1 to about 10.

9. The method as defined in claim 8 wherein:
the melting epoxy resin is a cycloaliphatic epoxide; and
the non-melting filler is selected from the group consisting of silica, alumina, alumina nitride, quartz, and combinations thereof.

10. The method as defined in claim 1 wherein:
prior to selectively applying the fusing agent, the method further comprises heating the epoxy mold compound build material to a heating temperature ranging from about 80° C. to about 100° C.; and
the exposing of the epoxy mold compound build material to the energy raises a temperature of the portion of the epoxy mold compound build material in contact with the fusing agent to a final temperature ranging from about 100° C. to about 130° C.

11. The method as defined in claim 1 , further comprising selectively applying a detailing agent to an other portion of the epoxy mold compound build material, wherein the other portion of the epoxy mold compound build material does not fuse during the exposing of the epoxy mold compound build material to energy.

12. The method as defined in claim 11 wherein:
the exposing of the epoxy mold compound build material to the energy raises a temperature of the portion of the epoxy mold compound build material in contact with the fusing agent to a final temperature; and
a temperature of the other portion of the epoxy mold compound during the exposure to the energy is at least 20° C. less than the final temperature.

13. The method as defined in claim 1 wherein the fusing agent includes a radiation absorber selected from the group consisting of carbon black, carbon fibers, graphite, iron oxides, and spherical gold nanoparticles.

14. The method as defined in claim 1 , wherein the epoxy mold compound build material includes a silane coupling agent adhesion promoter.

15. The method as defined in claim 1 , wherein the epoxy mold compound build material includes a mold release agent selected from the group consisting of a hydrocarbon wax, silicone, sodium dodecyl sulfate (SDS) soap, and a fatty acid.

16. The method as defined in claim 1 wherein the epoxy mold compound build material is applied without a hardener or curing agent.

17. A three-dimensional (3D) printing system, comprising:
a supply containing a one part thermal cure epoxy mold compound build material;
a build material distributor;
a supply of a fusing agent;
an inkjet applicator for selectively dispensing the fusing agent;
a controller; and
a non-transitory computer readable medium having stored thereon computer executable instructions to cause the controller to:
utilize the build material distributor to dispense the epoxy mold compound build material; and
utilize the inkjet applicator to selectively dispense the fusing agent to pattern a three-dimensional part layer.

18. The 3D printing system as defined in claim 17 , further comprising:
a supply of a detailing agent; and
an other inkjet applicator for selectively dispensing the detailing agent;
wherein the computer executable instructions further cause the controller to utilize the other inkjet applicator to selectively dispense the detailing agent.

19. The 3D printing system as defined in claim 17 wherein the epoxy mold compound build material is a white powder including a melting epoxy resin and a non-melting filler, and wherein a ratio of the melting epoxy resin to the non-melting filler ranges from about 1 to about 10.

Assignees

• Hewlett Packard Development Co

Inventors

• Chen Chien-Hua
• Liu Qin
• Monroe Michael G

Classifications

• B33Y70/10

  Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials · CPC title

• B33Y30/00

  Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

• B33Y10/00

  Processes of additive manufacturing · CPC title

• B29C64/165 Primary

  using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber · CPC title

• B29C64/393

  for controlling or regulating additive manufacturing processes · CPC title