Sensor housings, modules, and luminaires incorporating the same comprising a heat sink integrated with one or more walls defining a cavity accepting a sensor

Patent metadata

Field	Value
Publication number	US-10848650-B2
Application number	US-201715784931-A
Country	US
Kind code	B2
Filing date	Oct 16, 2017
Priority date	Oct 16, 2017
Publication date	Nov 24, 2020
Grant date	Nov 24, 2020

Abstract

Sensor housings, modules, and luminaires comprising the same are provided. The sensor housings and modules set forth herein have improved heat sinking abilities for dissipating heat from a sensor while simultaneously facilitating thermal isolation of the sensor. Briefly, a sensor housing described herein comprises a cavity for housing a sensor and a heat sink. The heat sink is configured to dissipate heat from the sensor housing and thermally isolate the sensor housing from other heat generating components, such as other portions of a luminaire.

First claim

The invention claimed is:

1. A sensor housing for a luminaire comprising:
one or more walls defining a cavity for accepting a sensor; and
a heat sink integrated with the one or more walls,
wherein the sensor housing is associated with the luminaire.

2. The sensor housing of claim 1 , wherein the heat sink forms a portion of the one or more walls.

3. The sensor housing of claim 1 , wherein the heat sink is coupled to a surface of the one or more walls.

4. The sensor housing of claim 1 , wherein the one or more walls are a front face, rear face and/or sidewalls of the sensor housing.

5. The sensor housing of claim 1 , wherein the heat sink comprises a plurality of heat dissipation structures.

6. The sensor housing of claim 5 , wherein the heat dissipation structures comprise fins.

7. The sensor housing of claim 5 , wherein the heat dissipation structures are radially arranged over the one or more walls.

8. The sensor housing of claim 3 , wherein the heat sink or a portion thereof is reversibly coupled to the one or more walls.

9. The sensor housing of claim 1 , wherein portions of the housing are overmolded in plastic.

10. The sensor housing of claim 1 , wherein the one or more walls comprise an aperture.

11. The sensor housing of claim 10 , wherein the aperture is configured to receive optics of a sensor.

12. The sensor housing of claim 1 , wherein the sensor is an image sensor, and the sensor housing is integrated with the luminaire.

13. The sensor housing of claim 1 further comprising one or more structures for coupling with the luminaire.

14. The sensor housing of claim 1 , wherein the one or more walls are operable to pass electromagnetic radiation emitted from the sensor.

15. The sensor housing of claim 14 , wherein the electromagnetic radiation is emitted from an antenna of the sensor at one or more frequencies for communication with at least one electronic device outside the sensor housing.

16. A sensor module for a luminaire comprising:
a sensor housing;
a sensor disposed in the sensor housing; and
a heat sink in thermal communication with the sensor housing,
wherein the sensor housing is associated with the luminaire.

17. The sensor module of claim 16 , wherein the heat sink forms one or more portions of the sensor housing.

18. The sensor module of claim 16 , wherein the heat sink is coupled to one or more walls of the sensor housing.

19. The sensor module of claim 18 , wherein the one or more walls are selected from the group consisting of a front wall, back wall, sidewall and combinations thereof.

20. The sensor module of claim 16 , wherein the heat sink comprises a plurality of heat dissipation structures.

21. The sensor module of claim 20 , wherein the heat dissipation structures comprise fins.

22. The sensor module of claim 20 , wherein the heat dissipation structures exhibit a radial arrangement relative to the sensor housing.

23. The sensor module of claim 16 , wherein the sensor housing comprises one or more apertures.

24. The sensor module of claim 16 further comprising thermally insulating material in the sensor housing.

25. The sensor module of claim 23 , wherein the sensor is an image sensor.

26. The sensor module of claim 25 , wherein the sensor module is integrated with the luminaire.

27. The sensor module of claim 16 , wherein the sensor is selected from the group consisting of a temperature sensor, a fluid sensor, a mass sensor, an airflow sensor, a humidity sensor, a directional sensor, a position sensor, a vibration sensor, an electrical sensor, a velocity sensor, a noise sensor, an air sensor, a chemical sensor, a carbon dioxide (CO 2 ) sensor, an oxygen (O 2 ) sensor, and combinations thereof.

28. The sensor module of claim 16 further comprising one or more structures for coupling with the luminaire.

29. The sensor module of claim 16 , wherein the sensor comprises electronic structure for wireless communication with one or more electronic devices outside the sensor module.

30. The sensor module of claim 29 , wherein the electronic structure comprises one or more antennae within the sensor housing.

31. A luminaire comprising:
a driver assembly thermally coupled to a first heat sink;
a light emitting diode (LED) assembly thermally coupled to a second heat sink; and
a sensor module comprising a sensor housing, at least one sensor component disposed in the sensor housing, and a heat sink in thermal communication with the sensor housing.

32. The luminaire of claim 31 , wherein the heat sink forms one or more portions of the sensor housing.

33. The luminaire of claim 31 , wherein the heat sink is coupled to one or more walls of the sensor housing.

34. The luminaire of claim 31 , wherein the heat sink comprises a plurality of heat dissipation structures.

35. The luminaire of claim 31 , wherein the sensor module is thermally isolated from the first and second heat sinks.

36. The luminaire of claim 31 , wherein the at least one sensor component comprises a sensing element and electronics for the sensing element.

37. The luminaire of claim 36 , wherein the electronics for the sensing element comprise one or more antennae for wireless communication with at least one electronic device outside the sensor housing.

38. The luminaire of claim 31 , wherein the at least one sensor component comprises sensor electronics.

39. The luminaire of claim 38 , wherein a sensing element is located outside the sensor housing.

Assignees

• Ideal Ind Lighting Llc

Inventors

• Youmans Mark
• Benjamin Hormoz
• Lowes Theodore

Classifications

• H04N23/52

  Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements · CPC title

• H04N23/51 Primary

  Housings · CPC title

• F21V23/008 Primary

  the casing being outside the housing of the lighting device · CPC title

• F21V29/773

  the planes containing the fins or blades having the direction of the light emitting axis · CPC title

• F21Y2105/10

  comprising a two-dimensional [2D] array of point-like light-generating elements · CPC title