Slide material and method for manufacturing same, and slide member

Patent metadata

Field	Value
Publication number	US-10844462-B2
Application number	US-201716336534-A
Country	US
Kind code	B2
Filing date	Jun 8, 2017
Priority date	Sep 30, 2016
Publication date	Nov 24, 2020
Grant date	Nov 24, 2020

Abstract

Provided are a slide material in which the joining strength between a Bi-containing copper alloy layer and a substrate is improved, and a method for manufacturing the slide material. The slide material according to the present invention has a substrate and a copper alloy layer. The copper alloy layer comprises a copper alloy containing 4.0-25.0 mass % of Bi and has a structure in which Bi phases are scattered in a copper alloy structure. The contact area ratio of Bi phases of the copper alloy layer at the joining interface with the substrate is not more than 2.0%. The slide material is manufactured by casting a molten copper alloy onto a substrate and causing the copper alloy to solidify unidirectionally.

First claim

The invention claimed is:

1. A sliding material comprising:
a substrate; and
a copper alloy layer bonded to the substrate,
wherein the copper alloy layer comprises a copper alloy including 4.0 to 25.0 mass % of Bi, the copper alloy having a structure in which Bi phases are dispersed in a copper alloy matrix, and
wherein a contact area ratio of the Bi phases at a bonding interface with the substrate is not more than 2.0%.

2. The sliding material according to claim 1 , wherein the contact area ratio of the Bi phases satisfies:
contact area ratio/Bi content≤0.075,
where the Bi content is represented by mass %.

3. The sliding material according to claim 1 , wherein the copper alloy includes:
4.0 to 25.0 mass % of Bi,
a total amount of not more than 50.0 mass % one or more selected from Sn, Al, Zn, Mn, Si, Ni, Fe, P, Zr, Ti and Mg, and
the balance of copper and inevitable impurities.

4. The sliding material according to claim 1 , wherein the copper alloy further includes a total amount of not more than 10 volume % of either or both of MoS 2 and graphite.

5. The sliding material according to claim 1 , further comprising an overlay on the copper alloy layer.

6. The sliding material according to claim 1 ,
wherein the substrate has a thickness of 1.0 to 25.0 mm, and
wherein the copper alloy layer has a thickness of 0.1 to 3.0 mm.

7. A method of manufacturing the sliding material according to claim 1 , comprising:
preparing the substrate;
melting the copper alloy;
casting the molten copper alloy on a surface of the substrate to be bonded to the copper alloy; and
cooling the substrate by a coolant from a surface of the substrate opposite to the surface to be bonded so that the copper alloy is unidirectionally solidified.

8. The method according to claim 7 , further comprising reducing an amount of the supplied coolant after a predetermined time from the casting.

9. The method 1 according to claim 7 , wherein the coolant is water or oil.

10. The method according to claim 7 ,
wherein the preparing of the substrate includes forming one or more substrate materials into a cylindrical substrate, and
wherein the casting of the molten copper alloy includes casting the molten copper alloy in the cylindrical substrate while rotating the cylindrical substrate around its center axis.

11. A sliding member comprising the sliding material according to claim 1 .

Assignees

• Daido Metal Co

Inventors

• Toda Kazuaki

Classifications

• B22D13/02

  of elongated solid or hollow bodies, e.g. pipes, in moulds rotating around their longitudinal axis · CPC title

• B22D19/00

  Casting in, on, or around objects which form part of the product (B22D23/04 takes precedence; alumino-thermic welding B23K23/00; coating by casting molten material on the substrate C23C6/00) · CPC title

• C22C9/02

  with tin as the next major constituent · CPC title

• B22D27/04

  Influencing the temperature of the metal, e.g. by heating or cooling the mould · CPC title

• C22C9/10

  with silicon as the next major constituent · CPC title