Photosensitive adhesive composition

Patent metadata

Field	Value
Publication number	US-10844255-B2
Application number	US-201716329068-A
Country	US
Kind code	B2
Filing date	Aug 25, 2017
Priority date	Aug 30, 2016
Publication date	Nov 24, 2020
Grant date	Nov 24, 2020

Abstract

A novel photosensitive adhesive composition including the following components (A), (B), (C), and (D): Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal, Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal, Component (C): a radical photopolymerization initiator, and Component (D): a solvent, wherein the content by mass of the component (B) is larger than that of the component (A),

(wherein X is a C 1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group, m and n are each independently 0 or 1, Q is a divalent C 1-16 hydrocarbon group, Z is a divalent C 1-4 linking group, the divalent linking group being bonded to an —O— group in formula (1), and R 1 is a hydrogen atom or a methyl group.)

First claim

The invention claimed is:

1. A photosensitive adhesive composition comprising the following components (A), (B), (C), and (D):
Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal,
Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal,
Component (C): a radical photopolymerization initiator, and
Component (D): a solvent,
wherein the content by mass of the component (B) is larger than that of the component (A),

wherein
X is methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, s-butyl group, t-butyl group, n-pentyl group, 1-methyl-n-butyl group, 2-methyl-n-butyl group, 3-methyl-n-butyl group, 1,1-dimethyl-n-propyl group, 1,2-dimethyl-n-propyl group, 2,2-dimethyl-n-propyl group, 1-ethyl-n-propyl group, n-hexyl group, 1-methyl-n-pentyl group, 2-methyl-n-pentyl group, 3-methyl-n-pentyl group, 4-methyl-n-pentyl group, 1,1-dimethyl-n-butyl group, 1,2-dimethyl-n-butyl group, 1,3-dimethyl-n-butyl group, 2,2-dimethyl-n-butyl group, 2,3-dimethyl-n-butyl group, 3,3-dimethyl-n-butyl group, 1-ethyl-n-butyl group, 2-ethyl-n-butyl group, 1,1,2-trimethyl-n-propyl group, 1,2,2-trimethyl-n-propyl group, 1-ethyl-1-methyl-n-propyl group, 1-ethyl-2-methyl-n-propyl group, —CH═CH 2 , —CH 2 —CH═CH 2 , or

m and n are each independently 0 or 1,
Q is a divalent C 1-16 hydrocarbon group,
Z is a divalent C 1-4 linking group, the divalent linking group being bonded to an —O— group in formula (1), and
R 1 is a hydrogen atom or a methyl group.

2. The photosensitive adhesive composition according to claim 1 , wherein the divalent hydrocarbon group of Q in formula (1) is a linear or branched alkylene group, a group containing two carbon atoms bonded through a double bond, or a group containing in a main chain an alicyclic hydrocarbon group or aromatic hydrocarbon group optionally having at least one substituent.

3. The photosensitive adhesive composition according to claim 1 , wherein the divalent linking group of Z in formula (2) is a linear or branched alkylene group optionally having at least one hydroxy group as a substituent.

4. The photosensitive adhesive composition according to claim 1 , wherein the mass ratio of the component (A) to the component (B) is 1:2 to 1:20.

5. The photosensitive adhesive composition according to claim 1 , further comprising a bifunctional (meth)acrylate and/or a multifunctional thiol.

6. An adhesion method comprising steps of:
applying the photosensitive adhesive composition according to claim 1 to a first substrate;
pre-baking the photosensitive adhesive composition applied to the first substrate at 50° C. to 160° C.;
exposing the coating film on the first substrate after the pre-baking;
developing the coating film after the exposure; and
bonding a second substrate to the first substrate after the development and thermally curing the coating film by heating.

Assignees

• Nissan Chemical Corp

Inventors

• Ohashi Takuya
• Enomoto Tomoyuki
• Kishioka Takahiro

Classifications

• G03F7/40

  Treatment after imagewise removal, e.g. baking · CPC title

• G03F7/004

  Photosensitive materials (G03F7/12, G03F7/14 take precedence) · CPC title

• C09J171/08 Primary

  Polyethers derived from hydroxy compounds or from their metallic derivatives (C09J171/02 takes precedence) · CPC title

• C09J167/07

  having terminal carbon-to-carbon unsaturated bonds · CPC title

• C09J5/06

  involving heating of the applied adhesive · CPC title