Two-component putty, method for coating a substrate with such putty, substrates coated with such putty and use for such putty for improving erosion resistance

Patent metadata

Field	Value
Publication number	US-10844242-B2
Application number	US-201716302437-A
Country	US
Kind code	B2
Filing date	May 30, 2017
Priority date	May 31, 2016
Publication date	Nov 24, 2020
Grant date	Nov 24, 2020

Abstract

The present invention relates to a two-component putty comprising (1) a base component and (2) a curing component, wherein the base component comprises: —a polycarbonate diol having a hydroxyl number in the range of from 50 to 500 mg KOH/g; —a further resin component having a hydroxyl number of at least 300 mg KOH/g; and —an inorganic filler, wherein the curing component comprises a polyisocyanate, and wherein the amount of the inorganic filler is in the range of from 35 wt % to 60 wt %, based on the total weight of the putty, the putty contains less than 5 wt % of organic solvent, and the viscosity of the putty is in the range of from 30,000 mPa·s to 250,000 mPa·s. The present invention also relates to a method for coating a substrate by applying such putty and allowing the applied putty to cure. The invention further relates to a coated substrate obtainable by such method and the use of such two-component putty for improving erosion resistance of a substrate.

First claim

The invention claimed is:

1. A two-component putty comprising (1) a base component and (2) a curing component,
wherein the base component comprises,
a polycarbonate diol having a hydroxyl number in the range of from 50 to 500 mg KOH/g;
a further resin component having a hydroxyl number of at least 300 mg KOH/g; and
an inorganic filler,

wherein the curing component comprises a polyisocyanate,
and wherein the amount of the inorganic filler is in the range of from 35 wt % to 60 wt %, based on the total weight of the putty, the putty contains less than 5 wt % of organic solvent, and the viscosity of the putty as measured by means of a rotary viscometer at a shear rate of 1 s −1 and a temperature of 23° C., 30 seconds after having combined and mixed the base component and the curing component, is in the range of from 30,000 mPa.s to 250,000 mPa.s.

2. The two-component putty according to claim 1 , wherein the polycarbonate diol is a linear, aliphatic polycarbonate diol.

3. The two-component putty according to claim 1 , wherein the further resin component has an OH number in the range of from 300 to 700 mg KOH/g.

4. The two-component putty according to claim 1 , wherein the polyisocyanate is an aliphatic polyisocyanate containing a biuret group.

5. The two-component putty according to claim 1 , wherein the inorganic filler is modified with an organosilane.

6. The two-component putty according to claim 1 , wherein the viscosity of the putty is in the range of from 40,000 mPa·s to 200,000 mPa·s.

7. The two-component putty according to claim 1 , comprising,
7.5 to 40 wt % of a polycarbonate diol having a hydroxyl number in the range of from 100 to 400 mg KOH/g;
4 to 15 wt % of a further resin component having a hydroxyl number in the range of from 400 to 600 mg KOH/g; and
10 to 60 wt % polyisocyanate.

8. A method for coating a substrate comprising,
applying a two-component putty according to claim 1 to a substrate; and
allowing the applied putty to cure.

9. The method according to claim 8 , wherein the putty is applied directly to the substrate.

10. The method according to claim 8 , wherein the substrate is a plastic substrate.

11. The two-component putty according to claim 1 , wherein the further resin component has an OH number in the range of from 400 to 600 mg KOH/g.

12. The two-component putty according to claim 1 , wherein the viscosity of the putty is in the range of from 50,000 mPa·s to 150,000 mPa·s.

13. The two-component putty according to claim 7 where the polyisocyanate is a biuret-containing polyisocyanate.

14. The method according to claim 8 wherein the applied putty is allowed to cure at a temperature of at most 80° C.

15. The method according to claim 8 wherein the applied putty is allowed to cure at a temperature in the range of from 15° C. to 60° C.

16. The method according to claim 8 , wherein the substrate is an epoxy resin-based plastic substrate.

17. The method according to claim 8 , wherein the substrate is a fiber-reinforced epoxy resin-based plastic substrate.

Assignees

• Akzo Nobel Coatings Int Bv

Inventors

• Seeger Dirk
• Felker Johannes

Classifications

• C09D175/12 Primary

  from compounds containing nitrogen and active hydrogen, the nitrogen atom not being part of an isocyanate group · CPC title

• C09D5/34 Primary

  Filling pastes (materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12) · CPC title

• C08J7/043

  Improving the adhesiveness of the coatings per se, e.g. forming primers (adhesives in the form of films or foils characterised by the primer layers between the polymer carriers and the adhesives C09J7/50) · CPC title

• C08J7/0427

  with only one layer of a composition containing a polymer binder (with more layers C08J7/042) · CPC title

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title