Material for printed circuit board, metal laminate, methods for producing them, and method for producing printed circuit board

Patent metadata

Field	Value
Publication number	US-10844153-B2
Application number	US-201715786876-A
Country	US
Kind code	B2
Filing date	Oct 18, 2017
Priority date	May 11, 2015
Publication date	Nov 24, 2020
Grant date	Nov 24, 2020

Abstract

A material having a fluorinated resin layer is subjected to heat treatment. The fluorinated resin layer is composed of a composition containing a fluorinated copolymer (a) having at least one type of functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, having a melting point of from 280 to 320° C. and a melt flow rate of at least 2 g/10 min measured at 372° C. under a load of 49 N. The heat treatment is carried out at a temperature of at least 250° C. and lower by at least 5° C. than the melting point of the fluorinated copolymer (a) so that the ratio of the melt flow rate of the fluorinated resin layer after the heat treatment to that before the heat treatment, and the melt flow rate of the fluorinated resin layer after the heat treatment, are respectively within specific ranges.

First claim

What is claimed is:

1. A method for producing a material for a printed circuit board, comprising:
subjecting a film (A) provided with a fluorinated resin layer comprising a composition comprising a fluorinated copolymer (a) to a heat treatment to obtain a material for a printed circuit board, wherein
the film (A) is a film (A1) consisting of the fluorinated resin layer or an adhesive film (A2) having the fluorinated resin layer directly laminated on at least one side of a heat resistant resin film,
the fluorinated copolymer (a) has at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, has a melting point of from 280 to 320° C., and has a melt flow rate of at least 2 g/10 min measured at 372° C. under a load of 49N, and
the heat treatment of the film (A) is carried out at a temperature of at least 250° C. and lower by at least 5° C. than the melting point of the fluorinated copolymer (a) so that the ratio of the following melt flow rate (II) (MFR(II)) to the following melt flow rate (I) (MFR(I)) [MFR(II)/MFR(I)] is from 0.05 to 0.5 and that the following MFR(II) is at most 15 g/10 min, wherein,
MFR(I): the melt flow rate of the fluorinated resin layer before the heat treatment measured at 372° C. under a load of 49N; and
MFR(II): the melt flow rate of the fluorinated resin layer after the heat treatment measured at 372° C. under a load of 49N.

2. The method for producing a material for a printed circuit board according to claim 1 , wherein the fluorinated copolymer (a) has at least a carbonyl group-containing group as the functional group, and the carbonyl group-containing group is at least one selected from the group consisting of a group having a carbonyl group between carbon atoms in a hydrocarbon group, a carbonate group, a carboxy group, a haloformyl group, an alkoxycarbonyl group and an acid anhydride residue.

3. The method for producing a material for a printed circuit board according to claim 1 , wherein the content of the functional group is from 10 to 60,000 groups per 1×10 6 carbon atoms in the main chain of the fluorinated copolymer (a).

4. A method for producing a metal laminate, comprising:
producing a material for a printed circuit board by the method according to claim 1 ; and
directly laminating a metal layer on the fluororesin layer of the material for a printed circuit board.

5. A method for producing a printed circuit board, comprising:
producing a metal laminate by the method according to claim 4 ; and
etching the metal layer to form a patterned circuit.

6. The method for producing a printed circuit board according to claim 5 , wherein the formed patterned circuit is soldered by a soldering iron.

7. A method for producing a metal laminate, comprising:
subjecting a metal laminate precursor comprising an adhesive film (A2) having a fluorinated resin layer comprising a composition comprising a fluorinated copolymer (a) directly laminated on at least one side of a heat resistant resin film, and a metal layer directly laminated on the at least one fluorinated resin layer, to a heat treatment to obtain a metal laminate, wherein
the fluorinated copolymer (a) has at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, has a melting point of from 280 to 320° C., and has a melt flow rate of at least 2 g/10 min measured at 372° C. under a load of 49N, and
the heat treatment is carried out at a temperature of at least 250° C. and lower by at least 5° C. than the melting point of the fluorinated copolymer (a) so that the ratio of the following melt flow rate (VI) (MFR(VI)) to the following melt flow rate (V) (MFR(V)) [MFR(VI)/MFR(V)] is from 0.05 to 0.5 and that the following MFR(VI) is at most 15 g/10 min, wherein,
MFR(V): the melt flow rate of the fluorinated resin layer before the heat treatment measured at 372° C. under a load of 49N; and
MFR(VI): the melt flow rate of the fluorinated resin layer after the heat treatment measured at 372° C. under a load of 49N.

8. The method for producing a metal laminate according to claim 7 , wherein the fluorinated copolymer (a) has at least a carbonyl group-containing group as the functional group, and the carbonyl group-containing group is at least one selected from the group consisting of a group having a carbonyl group between carbon atoms in a hydrocarbon group, a carbonate group, a carboxy group, a haloformyl group, an alkoxycarbonyl group and an acid anhydride residue.

9. The method for producing a metal laminate according to claim 7 , wherein the content of the functional group is from 10 to 60,000 groups per 1×10 6 carbon atoms in the main chain of the fluorinated copolymer (a).

10. The method for producing a metal laminate according to claim 7 , wherein the fluorinated resin layer has a thickness of from 1 to 20 μm.

11. A method for producing a printed circuit board, comprising:
producing a metal laminate by the method according to claim 7 ; and
etching the metal layer to form a patterned circuit.

12. The method for producing a printed circuit board according to claim 11 , wherein the patterned circuit is soldered by a soldering iron.

Assignees

• Agc Inc

Inventors

• Hosoda Tomoya
• Kasai Wataru
• Sasaki Toru
• Abe Masatoshi

Classifications

• C08F214/265

  with non-fluorinated comonomers · CPC title

• H05K3/386

  by the use of an organic polymeric bonding layer, e.g. adhesive · CPC title

• B32B27/30

  comprising vinyl {(co)polymers; comprising acrylic (co)polymers} · CPC title

• C09J127/18

  Homopolymers or copolymers of tetrafluoroethene · CPC title

• H05K2201/015

  Fluoropolymer, e.g. polytetrafluoroethylene [PTFE] · CPC title