Silica molded bodies having low thermal conductivity

US10843965B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10843965-B2
Application numberUS-201615754394-A
CountryUS
Kind codeB2
Filing dateAug 9, 2016
Priority dateAug 28, 2015
Publication dateNov 24, 2020
Grant dateNov 24, 2020

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Hydrophobic shaped silica bodies having low density and low thermal conductivity are produced by forming a dispersion of silica in a solution of binder and organic solvent, and removing the solvent and shaping to form a shaped body. The shaped bodies retain their hydrophobicity, are stable with regards to shape, and are useful in acoustic and thermal insulation.

First claim

Opening claim text (preview).

The invention claimed is: 1. A process for producing silica granules having a C content of less than 8% by weight, a density, determined by Hg porosimetry, of less than 0.30 g/cm 3 , a pore volume for pores smaller than 4 μm, determined by Hg porosimetry, of more than 2.0 cm 3 /g, a proportion of the pores smaller than 4 μm, based on the total pore volume, of at least 60% and a thermal conductivity, determined by a non-steady-state method, of less than 30 mW/K*m, comprising: i) producing a dispersion containing pyrogenic silica, at least one binder and an organic solvent, and ii) evaporating the solvent from the dispersion, and shaping to form the shaped silica bodies. 2. The process of claim 1 , wherein the pyrogenic silica is selected from the group consisting of hydrophilic pyrogenic silica and mixtures of hydrophilic pyrogenic silica and partially hydrophobic pyrogenic silica. 3. The process of claim 1 , wherein at least one silane of the formula Z 1+x —Si((CH 2 ) v Y)R 2−x where Z is a methoxy or ethoxy group, R is a C 1 -C 3 alkyl group or C 2-3 alkenyl group, Y is hydrogen, a saturated or monounsaturated or polyunsaturated C 1 -C 20 -hydrocarbon radical, —OC(O)C(R′)═CH 2 , -vinyl, -hydroxyl, -halogen, phosphonato, —NCO, —NH—C(O)—OR″, -glycidoxy, —SH, or acid anhydride, x is 1 or 2 and v is 0, 1, or 3 is used as a binder. 4. The process of claim 1 , wherein the solvent is selected from the group consisting of alkanes, ethers, alcohols, and mixtures thereof. 5. Silica granules produced by the process of claim 1 . 6. Acoustic or thermal insulation comprising silica granules of claim 5 .

Assignees

Inventors

Classifications

  • for heat transfer properties such as thermal insulation values, e.g. R-values · CPC title

  • Sound-insulating materials · CPC title

  • Porous or lightweight materials · CPC title

  • Other features · CPC title

  • C04B38/009Primary

    Porous or hollow ceramic granular materials, e.g. microballoons (C04B18/027, C04B20/002 take precedence) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10843965B2 cover?
Hydrophobic shaped silica bodies having low density and low thermal conductivity are produced by forming a dispersion of silica in a solution of binder and organic solvent, and removing the solvent and shaping to form a shaped body. The shaped bodies retain their hydrophobicity, are stable with regards to shape, and are useful in acoustic and thermal insulation.
Who is the assignee on this patent?
Wacker Chemie Ag
What technology area does this patent fall under?
Primary CPC classification C04B38/009. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 24 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).