Substrate processing method and substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-10843223-B2
Application number	US-201815992250-A
Country	US
Kind code	B2
Filing date	May 30, 2018
Priority date	May 31, 2017
Publication date	Nov 24, 2020
Grant date	Nov 24, 2020

Abstract

A substrate processing method includes a rinse liquid supplying step of supplying a rinse liquid containing water to a major surface of a substrate, a rotating step of rotating the substrate around a rotation axis passing through a central portion of the major surface of the substrate, and a hydrophobizing agent supplying step of supplying a hydrophobizing agent containing a first dissolving agent to the major surface of the substrate to replace a liquid held on the major surface of the substrate with the hydrophobizing agent in parallel with the rotating step after the rinse liquid supplying step is performed, and the hydrophobizing agent supplying step includes a hydrophobizing agent discharging step of discharging a continuous flow of the hydrophobizing agent from a discharge port of a nozzle toward the major surface of the substrate held by a substrate holding unit with a Reynolds number at the discharge port being not more than 1500.

First claim

What is claimed is:

1. A substrate processing method comprising:
a rinse liquid supplying step of supplying a rinse liquid containing water to a major surface of a substrate;
a rotating step of rotating the substrate around a rotation axis passing through a central portion of the major surface of the substrate; and
a hydrophobizing agent supplying step of supplying a hydrophobizing agent containing a first dissolving agent to the major surface of the substrate to replace a liquid held on the major surface of the substrate with the hydrophobizing agent in parallel with the rotating step after the rinse liquid supplying step is performed; and
wherein the hydrophobizing agent supplying step includes a hydrophobizing agent discharging step of discharging a continuous flow of the hydrophobizing agent from a discharge port of a nozzle toward the major surface of the substrate held by a substrate holding unit with a Reynolds number at the discharge port being not more than 1500 and not less than 450.

2. The substrate processing method according to claim 1 , further comprising:
a second dissolving agent supplying step of supplying a second dissolving agent, differing in type from the first dissolving agent, to the major surface of the substrate to replace a liquid held on the major surface of the substrate with the second dissolving agent at a point after the rinse liquid supplying step is performed and before the hydrophobizing agent supplying step is performed; and
a first dissolving agent supplying step of supplying the first dissolving agent to the major surface of the substrate to replace a liquid held on the major surface of the substrate with the first dissolving agent in parallel with the rotating step at a point after the second dissolving agent supplying step is performed and before the hydrophobizing agent supplying step is performed.

Assignees

• Screen Holdings Co Ltd

Inventors

• Tanaka Takayoshi
• Emoto Tetsuya
• Oato Akira
• Nakano Yuta
• Nakano Teppei
• Akiyama Takashi
• TSUCHIHASHI Yuya
• Tamura Reo
• Eitoku Atsuro
• Iwata Tomomi

Classifications

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0406

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

• H10P70/20

  Cleaning during device manufacture · CPC title

• H10P72/0404

  for general liquid treatment, e.g. etching followed by cleaning · CPC title