Compact optically efficient solid state light source with integrated thermal management

Patent metadata

Field	Value
Publication number	US-10842016-B2
Application number	US-201113177415-A
Country	US
Kind code	B2
Filing date	Jul 6, 2011
Priority date	Jul 6, 2011
Publication date	Nov 17, 2020
Grant date	Nov 17, 2020

Abstract

A compact and efficient LED array lighting component comprising a circuit board with an array of LED chips mounted on it and electrically interconnected. A plurality of primary lenses is included, each of which is formed directly over each LED chip and/or a sub-group of the LED chips. A heat sink is included with the circuit board mounted to the heat sink so that heat from the LED chips spreads into the heat sink. In some embodiments the circuit board can be thermally conductive and electrically insulating. Method of forming an LED component are also disclosed utilizing chip-on-board mounting techniques for mounting the LED chips on the circuit board, and molding of the primary lenses directly over the LED chips individually or in sub-groups of LED chips.

First claim

We claim:

1. An LED component, comprising:
a circuit board with an array of LED chips thereon and electrically interconnected, wherein said circuit board comprises a dielectric with one or more thermally conductive materials;
at least two bond pads on said circuit board configured to conduct an electrical signal to said plurality of LED chips, said at least two bond pads adjacent to one another, each of said bond pads comprising a surface area greater than 3 mm 2 ;
a plurality…

Assignees

• Bhat Chandan
• Lowes Theodore Douglas
• Garceran Julio
• Keller Bernd
• Cree Inc

Inventors

• Bhat Chandan
• Lowes Theodore Douglas
• Garceran Julio
• Keller Bernd

Classifications

• H10W90/756

  Electricity · mapped topic

• H10W90/736

  Electricity · mapped topic

• H10W72/884

  Electricity · mapped topic

• H05K1/0209 Primary

  Electricity · mapped topic

• H05K2201/066

  Electricity · mapped topic