Arrangement for actively suppressing interference signals

Patent metadata

Field	Value
Publication number	US-10840801-B2
Application number	US-201815968959-A
Country	US
Kind code	B2
Filing date	May 2, 2018
Priority date	May 24, 2017
Publication date	Nov 17, 2020
Grant date	Nov 17, 2020

Abstract

The invention, which relates to an arrangement (1) for the active suppression of interference signals, addresses the problem of specifying an arrangement (1) for the active suppression of interference signals, with which the reliable and secure compensation of the EMC interferences is achieved, which has a lower installation space requirement, generates less interference emission and is cost-effective of production. This problem is resolved thereby that beneath the main circuit board (12) disposed on the surface of the housing (10) a recess (14) is disposed and that in this recess (14) a circuit board (15) for the active EMC filter (4) is emplaced.

First claim

The invention claimed is:

1. An arrangement for the active suppression of interference signals, comprising at least one main circuit board of an inverter having input and output terminals on a first side opposite to a second side, an active EMC filter, a housing of a refrigerant compressor, wherein, encompassed by the housing, a coolant is disposed and wherein the second side of the main circuit board is disposed on a surface of the housing opposite to the coolant, wherein beneath the at least one main circuit board disposed on the surface of the housing a first recess and a second recess are disposed in the housing and that in this recess a circuit board for the active EMC filter is emplaced; and power semiconductors are in the second recess disposed on the surface of the housing; and second side of the main circuit board comprises a shielding zone of an electrically conductive material, which completely covers the recesses.

2. An arrangement as in claim 1 , wherein the circuit board for the active EMC filter is connected with the housing of the refrigerant compressor across a thermally conductive layer having low heat transfer resistance.

3. An arrangement as claim 1 , wherein between the circuit board and the housing an insulation compound or a thermal interface material (TIM) is disposed.

4. An arrangement as in claim 1 , wherein at least one member selected from the group consisting of clamps, threaded fasteners and a thermally conductive adhesive is disposed on the surface of the housing for the securement of the circuit board.

5. An arrangement as in claim 1 , wherein the circuit board is an IMS circuit board with an aluminum carrier.

6. An arrangement as in claim 1 , wherein the electrically conducting material comprises at least one metal selected from the group consisting of copper, gold or aluminum.

7. An arrangement as in claim 1 , wherein the electric terminals of the circuit board are disposed such that they lead through the main circuit board.

8. An arrangement as in claim 1 , wherein that one or several of the components disposed on the circuit board are connected thermally conducting with the housing of the refrigerant compressor.

9. An arrangement as in claim 1 , wherein on the main circuit board a passive EMC filter is disposed which at the input side is connected upstream of the active EMC filter.

10. An arrangement as in claim 1 , wherein the circuit board for the active EMC filter is connected with the housing of the refrigerant compressor across a thermally conductive layer having low heat transfer resistance.

11. An arrangement as in one of claim 1 , wherein a thermal interface material (TIM) is disposed between the circuit board and the housing an insulation compound.

12. An arrangement as in one of claim 2 , wherein a thermal interface material (TIM) is disposed between the circuit board and the housing an insulation compound.

13. An arrangement as in claim 1 , wherein at least one member selected from the group consisting of a threaded fastener, a clamp and a thermally conductive adhesive is disposed on the surface of the housing for the securement of the circuit board.

14. An arrangement as in claim 2 , wherein at least one member selected from the group consisting of a threaded fastener, a clamp and a thermally conductive adhesive is disposed on the surface of the housing for the securement of the circuit board.

15. An arrangement as in claim 3 , wherein for the securement of the circuit board on the surface of the housing threaded fasteners, clamps or a thermally conductive adhesive is disposed.

16. An arrangement as claim 1 , wherein the circuit board is an IMS circuit board with an aluminum carrier.

17. An arrangement as claim 2 , wherein the circuit board is an IMS circuit board with an aluminum carrier.

18. An arrangement as claim 3 , wherein the circuit board is an IMS circuit board with an aluminum carrier.

19. An arrangement as claim 4 , wherein the circuit board is an IMS circuit board with an aluminum carrier.

Assignees

• Hanon Systems

Inventors

• Werker Stephan
• Lenz Mario
• Newton Stephen

Classifications

• H05K9/0037

  Housings with compartments containing a PCB, e.g. partitioning walls · CPC title

• H05K7/14322

  wherein the control and power circuits of a power converter are arranged within the same casing · CPC title

• H05K2201/066

  Heatsink mounted on the surface of the printed circuit board [PCB] · CPC title

• H05K3/0058

  Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K1/0281 takes precedence) · CPC title

• H05K3/368

  parallel to each other (H05K3/361 takes precedence) · CPC title