Imaging element with a first and second converging portion for converging light between a first and second signal extraction portion of adjacent pixels

Patent metadata

Field	Value
Publication number	US-10840284-B2
Application number	US-201816349745-A
Country	US
Kind code	B2
Filing date	Sep 14, 2018
Priority date	Sep 28, 2017
Publication date	Nov 17, 2020
Grant date	Nov 17, 2020

Abstract

The present technology relates to an imaging element and an imaging device that enables reduction of a distance measurement error. The device includes a pixel array unit including a plurality of pixels that performs photoelectric conversion of light, in which each includes: a substrate that performs photoelectric conversion of the light; a first signal extraction portion including an application electrode to generate an electric field by application of a voltage and an attraction electrode to detect a signal carrier generated by photoelectric conversion; a second signal extraction portion including the application electrode and the attraction electrode; and a converging portion that is formed on the substrate and causes the light to enter the substrate. The converging portion converges the light at least between the first signal extraction portion and the second signal extraction portion provided in the substrate. The present technology can be applied to a CAPD sensor.

First claim

What is claimed is:

1. An imaging element, comprising:
a pixel array unit including a plurality of pixels that performs photoelectric conversion of light having entered, wherein
each of the pixels includes:
a substrate that performs photoelectric conversion of the light having entered;
a first signal extraction portion including an application electrode to generate an electric field by application of a voltage and an attraction electrode to detect a signal carrier generated by photoelectric conversion;
a second signal extraction portion including the application electrode and the attraction electrode; and
a converging portion that is formed on the substrate and causes the light to enter the substrate,
wherein the converging portion converges the light at least between the first signal extraction portion and the second signal extraction portion provided in the substrate, and
wherein the converging portion includes:
a first converging portion that converges the light between the first signal extraction portion and the second signal extraction portion of each of the pixels, and
a second converging portion that converges the light between the first signal extraction portion or the second signal extraction portion of each of the pixels, and the second signal extraction portion or the first signal extraction portion of an adjacent pixel adjacent to each of the pixels.

2. The imaging element according to claim 1 , wherein
the converging portion includes an on-chip lens having an upwardly convex curved surface shape.

3. The imaging element according to claim 2 , wherein
the on-chip lens is formed by etch back on STSR.

4. The imaging element according to claim 2 , wherein
the on-chip lens is formed by reflow processing.

5. The imaging element according to claim 2 , wherein
the on-chip lens is formed using a high refractive index material.

6. The imaging element according to claim 2 , wherein
the on-chip lens is formed by etching on a substrate material constituting the substrate.

7. The imaging element according to claim 2 , further comprising
an overcoat layer formed on the on-chip lens.

8. The imaging element according to claim 1 , wherein
the converging portion includes an on-chip lens having a downwardly convex curved surface shape.

9. The imaging element according to claim 1 , wherein
the converging portion includes a diffractive lens.

10. The imaging element according to claim 1 , wherein
the converging portion includes a gradient index lens.

11. The imaging element according to claim 1 , wherein
the first signal extraction portion and the second signal extraction portion are provided on a surface side on an opposite side of the substrate from an incident surface.

Assignees

• Sony Semiconductor Solutions Corp

Inventors

• ENNOJI Kohei
• Yamaguchi Shingo

Classifications

• H04N25/76

  Addressed sensors, e.g. MOS or CMOS sensors · CPC title

• H04N25/70

  SSIS architectures; Circuits associated therewith · CPC title

• H10F39/199

  Back-illuminated image sensors · CPC title

• H10F39/8057

  Optical shielding · CPC title

• H10F39/8063 Primary

  Microlenses · CPC title