Holey graphene mesh and solvent-free manufacturing and composites thereof

Patent metadata

Field	Value
Publication number	US-10836137-B2
Application number	US-201816040627-A
Country	US
Kind code	B2
Filing date	Jul 20, 2018
Priority date	Jul 20, 2017
Publication date	Nov 17, 2020
Grant date	Nov 17, 2020

Abstract

Systems, methods, and devices of the various embodiments provide for the creation of holey graphene meshes (HGMs) and composite articles including HGMs. Various embodiments provide solvent-free methods for creating arrays of holes on holey graphene-based articles formed from dry compression (such as films, discs, pellets), thereby resulting in a HGM. In further embodiments, a HGM can used as part of a composite, such as by: 1) embedding a HGM into another matrix material such as carbon, polymer, metals, metal oxides, etc; and/or (2) the HGM serving as a matrix by filling the holes of the HGM or functionalizing the HGM body with another one or more materials. In various embodiments, HGM can also be made as a composite itself by creating holes on dry-compressed articles pre-embedded with one or more other materials.

First claim

What is claimed is:

1. A method for solvent-free manufacturing, comprising:
providing a holey graphene article; and
forming a selected pattern array of holes of a selected shape in the holey graphene article without the use of a solvent to create a holey graphene mesh.

2. The method of claim 1 , wherein the holey graphene article is comprised of holey graphene and at least one other material.

3. The method of claim 2 , wherein the other material is Ruthenium, Platinum, Ferric Oxide, Titanium Dioxide, Silicon, or Epoxy.

4. The method of claim 1 , wherein the selected pattern array of holes results in a hole density of at least 20% in the holey graphene mesh.

5. The method of claim 1 , wherein selected shape is circular or square.

6. The method of claim 5 , wherein the selected pattern array of holes is such that each of the array of holes has a diameter of about 114 μm and a center-to-center hole distance of about 310 μm.

7. The method of claim 1 , further comprising adding at least one additional material to the holey graphene mesh.

8. The method of claim 7 , wherein the additional material is Ruthenium, Platinum, Ferric Oxide, Titanium Dioxide, Silicon, or Epoxy.

Assignees

• Nasa

Inventors

• Lin Yi
• Connell John W
• Hopkins John W
• Moitoso Brandon

Classifications

• C01B2204/22

  Electronic properties · CPC title

• B32B2264/10

  Inorganic particles · CPC title

• B32B2457/12

  Photovoltaic modules · CPC title

• B32B2307/732

  Dimensional properties · CPC title

• B32B2311/18

  Titanium · CPC title