Logo on a device

Patent metadata

Field	Value
Publication number	US-10835978-B2
Application number	US-201616091030-A
Country	US
Kind code	B2
Filing date	Jul 6, 2016
Priority date	Jul 6, 2016
Publication date	Nov 17, 2020
Grant date	Nov 17, 2020

Abstract

In some examples, a method of forming a logo on a device includes forming, using a laser, a pattern on an outer surface of a housing of the device, and soldering a metal to the pattern formed using the laser, the soldered metal forming the logo.

First claim

What is claimed is:

1. A method of forming a logo on a device using a laser, comprising:
laser forming a pattern on an outer surface of a housing of the device by activating at least a portion of the outer surface of the housing, wherein the housing includes an additive that is activated by irradiating the outer surface of the housing with the laser to form the pattern on the outer surface;
plating a metal layer to the pattern after laser forming the pattern; and
soldering a metal to the metal layer to generate a soldered metal forming the logo on the metal layer that is plated to the pattern on the outer surface of the housing.

2. The method of claim 1 , wherein the housing includes a groove in the outer surface of the housing, and wherein forming the pattern on the outer surface of the housing comprises laser forming the pattern within a the groove.

3. The method of claim 1 , wherein the housing includes a plurality of grooves in the outer surface of the housing, and wherein forming the pattern on the outer surface of the housing comprises laser forming the pattern within a the plurality of grooves.

4. The method of claim 1 , wherein laser forming the pattern on the outer surface of the housing comprises laser forming the pattern on a flat outer surface of the housing.

5. The method of claim 1 , wherein plating the metal layer to the pattern comprises placing the housing into a metallization bath containing a metal.

6. The method of claim 1 , further comprising:
laser forming a second pattern on the outer surface of the housing or another surface of the device; and
plating a second metal layer to the second pattern, the second metal layer forming an antenna of the device in addition to the soldered metal forming the logo.

7. The method of claim 6 , wherein laser forming the pattern on the outer surface of the housing and laser forming the second pattern are performed by a same manufacturing stage.

8. A method of forming a logo on a device using a laser, comprising:
laser forming a pattern on an outer surface of a housing of the device;
plating a metal layer to the pattern after laser forming the pattern, wherein plating the metal layer to the pattern comprises placing the housing into a metallization bath containing a metal; and
soldering a metal to the metal layer to generate a soldered metal forming the logo on the metal layer that is plated to the pattern on the outer surface of the housing.

9. The method of claim 8 , wherein the housing includes a groove in the outer surface of the housing, and wherein forming the pattern on the outer surface of the housing comprises laser forming the pattern within a the groove.

10. The method of claim 8 , wherein the housing includes a plurality of grooves in the outer surface of the housing, and wherein forming the pattern on the outer surface of the housing comprises laser forming the pattern within a the plurality of grooves.

11. The method of claim 8 , wherein laser forming the pattern on the outer surface of the housing comprises laser forming the pattern on a flat outer surface of the housing.

12. The method of claim 8 , further comprising:
laser forming a second pattern on the outer surface of the housing or another surface of the device; and
plating a second metal layer to the second pattern, the second metal layer forming an antenna of the device in addition to the soldered metal forming the logo.

13. The method of claim 12 , wherein laser forming the pattern on the outer surface of the housing and laser forming the second pattern are performed by a same manufacturing stage.

14. A method of forming a logo on a device using a laser, comprising:
laser forming a pattern on an outer surface of a housing of the device;
plating a metal layer to the pattern after laser forming the pattern;
soldering a metal to the metal layer to generate a soldered metal forming the logo on the metal layer that is plated to the pattern on the outer surface of the housing;
laser forming a second pattern on the outer surface of the housing or another surface of the device; and
plating a second metal layer to the second pattern, the second metal layer forming an antenna of the device in addition to the soldered metal forming the logo.

15. The method of claim 14 , wherein laser forming the pattern on the outer surface of the housing and laser forming the second pattern are performed by a same manufacturing stage.

16. The method of claim 14 , wherein the housing includes a groove in the outer surface of the housing, and wherein forming the pattern on the outer surface of the housing comprises laser forming the pattern within a the groove.

17. The method of claim 14 , wherein the housing includes a plurality of grooves in the outer surface of the housing, and wherein forming the pattern on the outer surface of the housing comprises laser forming the pattern within a the plurality of grooves.

18. The method of claim 14 , wherein laser forming the pattern on the outer surface of the housing comprises laser forming the pattern on a flat outer surface of the housing.

Assignees

• Hewlett Packard Development Co

Inventors

• Sutherland Timothy J

Classifications

• B44C1/228

  by laser radiation · CPC title

• B44C3/10

  Producing and filling perforations, e.g. tarsia plates · CPC title

• B23K26/355

  Texturing · CPC title

• B23K1/0056

  soldering by means of beams, e.g. lasers, electron beams [EB] · CPC title

• B23K1/20 Primary

  Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating · CPC title