Semiconductor device with upper and lower switching devices and isolation transformer

Patent metadata

Field	Value
Publication number	US-10833595-B2
Application number	US-201716307398-A
Country	US
Kind code	B2
Filing date	Jun 28, 2017
Priority date	Jul 1, 2016
Publication date	Nov 10, 2020
Grant date	Nov 10, 2020

Abstract

Provided is a semiconductor device that has a configuration provided with: a driving unit for driving an upper switching element and a lower switching element according to a control signal for controlling the driving of the upper switching element and the lower switching element, which are connected in series to constitute a bridge circuit; an insulating unit having an insulating transformer; and a package for sealing at least a part of the insulating unit and the driving unit. The insulating unit transmits a signal corresponding to the control signal to the driving unit side while insulating the signal.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a plurality of upper switching devices and a plurality of lower switching devices connected in series to together constitute a bridge circuit;
a driver configured to drive the upper switching devices and the lower switching devices, according to a control signal for controlling driving of the upper switching devices and the lower switching devices;
an isolation transformer; and
a package in which at least part of the upper switching devices, part of the lower switching devices, part of the isolation transformer, and part of the driver are sealed, wherein
the isolation transformer is configured to transmit a signal corresponding to the control signal to the driver while isolating the signal,
the plurality of upper switching devices are placed on a same island, and
the plurality of lower switching devices are placed on separate islands respectively.

2. The semiconductor device of claim 1 , wherein
the driver includes an upper driver configured to drive the upper switching devices and a lower driver configured to drive the lower switching devices, and
the isolation transformer is arranged at a position between, and on a same plane as, the upper driver and the lower driver.

3. The semiconductor device of claim 1 , further comprising:
a transmitter configured to generate a pulse signal based on the received control signal to output the pulse signal to the isolation transformer.

4. The semiconductor device of claim 1 , wherein
the driver is configured to transmit a detection signal that reflects a driving state to the isolation transformer, and
the isolation transformer is configured to transmit, while isolating, the detection signal to outside the device.

5. The semiconductor device of claim 4 , wherein
the driver further includes a transmitter configured to generate a pulse signal based on the received detection signal to output the pulse signal to the isolation transformer.

6. The semiconductor device of claim 4 , further comprising:
a receiver configured to generate a signal based on a pulse output fed from the isolation transformer to transmit the signal to outside the device.

7. The semiconductor device of claim 1 , wherein
the isolation transformer further includes:
a first coil formed on a surface of an insulating substrate having a semiconductor layer or in the insulating substrate; and
a second coil formed opposite the first coil across a dielectric member.

8. The semiconductor device of claim 7 , wherein
the first coil and the second coil are arranged over one another in a plan view.

9. The semiconductor device of claim 1 , wherein
the isolation transformer and the driver are each configured as a chip.

10. The semiconductor device of claim 1 , wherein
the upper switching devices and the lower switching devices are IGBTs or MOSFETs with a Si substrate, or IGBTs or MOSFETs with a SiC substrate or a wide-bandgap type semiconductor substrate.

11. An inverter system comprising:
the semiconductor device of claim 1 ;
a controller configured to transmit a control signal to the semiconductor device; and
a circuit board on which the semiconductor device and the controller are mounted.

12. A device comprising:
the inverter system of claim 11 ; and
a motor driven by the inverter system.

13. An electric power conversion device configured to perform electric power conversion by driving a plurality of upper switching devices and a plurality of lower switching devices connected in series to together constitute a bridge circuit, the electric power conversion device comprising:
the plurality of upper switching devices;
the plurality of lower switching devices;
first and second drive circuit chips configured to drive the upper switching devices and the lower switching devices based on a signal corresponding to a control signal fed in from outside;
an isolation transformer configured to isolate between the control signal and the signal for driving the first and second drive circuit chips;
a circuit board on which at least the isolation transformer is mounted; and
a package in which at least part of the upper switching devices, part of the lower switching devices, part of the circuit board, part of the isolation transformer, and part of the first and second drive circuit chips are sealed, wherein
the isolation transformer is arranged in a region between the first and second drive circuit chips in a plan view,
the plurality of upper switching devices are placed on a same island, and
the plurality of lower switching devices are placed on separate islands respectively.

14. The electric power conversion device of claim 13 , wherein
the isolation transformer includes:
a first coil formed on a surface of an insulating substrate having a semiconductor layer or in the insulating substrate; and
a second coil formed on a surface of a dielectric member or in the dielectric member so as to be opposite the first coil across the dielectric member.

15. The electric power conversion device of claim 13 , wherein
the circuit board includes a metal island connected to a lead terminal.

16. The electric power conversion device of claim 13 , wherein
the circuit board includes an insulating printed circuit board.

17. The electric power conversion device of claim 13 , wherein
the circuit board includes a metal island connected to a lead terminal and an insulating printed circuit board.

18. The electric power conversion device of claim 13 , wherein
the circuit board further has mounted thereon a transmission-reception chip configured to transmit and receive the control signal.

19. The electric power conversion device of claim 13 , wherein
the first and second drive circuit chips are mounted on a shared island.

Assignees

• Rohm Co Ltd

Inventors

• Ando Motohiro

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W72/527

  Multiple bond wires having different sizes · CPC title

• H10W72/07552

  changes in structures or sizes · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title