Mobile device and antenna structure

Patent metadata

Field	Value
Publication number	US-10833398-B2
Application number	US-201916660051-A
Country	US
Kind code	B2
Filing date	Oct 22, 2019
Priority date	Nov 8, 2012
Publication date	Nov 10, 2020
Grant date	Nov 10, 2020

Abstract

A mobile device includes a dielectric substrate, a metal layer, a metal housing, a nonconductive partition, at least one connection element, and a feeding element. The metal layer is disposed on the dielectric substrate, and includes an upper element and a main element, wherein a slot is formed between the upper element and the main element. The metal housing is substantially a hollow structure, and has a slit, wherein the slit is substantially aligned with the slot of the metal layer. The connection element couples the upper element of the metal layer to the metal housing. The feeding element is coupled to the upper element of the metal layer or coupled to the metal housing. An antenna structure is formed by the feeding element, the upper element of the metal layer, the connection element, and the metal housing.

First claim

What is claimed is:

1. A mobile device, at least comprising:
a metal housing, being substantially a hollow structure, wherein the metal housing has a back region and at least one side region;
a first slit, formed on the metal housing;
a dielectric substrate, comprising a first protruded portion and a second protruded portion which are different from each other;
a first connection element, disposed on the first protruded portion, and electrically coupled to the metal housing; and
a first signal source, disposed on the dielectric substrate, and electrically coupled to the first connection element.

2. The mobile device as claimed in claim 1 , further comprising:
a first nonconductive partition, at least partially disposed in the first slit of the metal housing.

3. The mobile device as claimed in claim 2 , wherein the first nonconductive partition is substantially a ring structure.

4. The mobile device as claimed in claim 3 , further comprising:
a first feeding element, disposed on the dielectric substrate, and electrically coupled to the first connection element.

5. The mobile device as claimed in claim 4 , further comprising:
an impedance adjustment element, electrically coupled to the first connection element and the metal housing, wherein the mobile device receives and transmits wireless signals by tuning an impedance value of the impedance adjustment element.

6. The mobile device as claimed in claim 5 , wherein the impedance adjustment element is a capacitance adjustment element.

7. The mobile device as claimed in claim 4 , wherein the first feeding element is electrically coupled through a metal spring to the metal housing.

8. The mobile device as claimed in claim 7 , wherein an end of the first feeding element is electrically coupled to the metal spring, and another end of the first feeding element is electrically coupled to the first signal source.

9. The mobile device as claimed in claim 2 , wherein an area of the first nonconductive partition is not greater than an opening area of the first slit of the metal housing.

10. The mobile device as claimed in claim 1 , wherein the first slit is positioned at the back region and the at least one side region.

11. The mobile device as claimed in claim 1 , further comprising:
a second slit, wherein the second slit is positioned at the back region and the at least one side region.

12. The mobile device as claimed in claim 11 , further comprising:
a second nonconductive partition, at least partially disposed in the second slit of the metal housing.

13. The mobile device as claimed in claim 12 , wherein an area of the second nonconductive partition is not greater than an opening area of the second slit of the metal housing.

14. The mobile device as claimed in claim 1 , further comprising:
a metal layer, at least partially disposed on the dielectric substrate.

15. The mobile device as claimed in claim 14 , wherein the metal layer is positioned between the first connection element and the dielectric substrate, and the first connection element electrically couples the metal layer to the metal housing.

16. The mobile device as claimed in claim 15 , further comprising:
a second connection element, disposed on the second protruded portion which extends from the dielectric substrate;
wherein a second signal source is disposed on the dielectric substrate and is electrically coupled to the second connection element.

17. The mobile device as claimed in claim 16 , wherein the second signal source is electrically coupled through the second connection element to the metal housing.

18. The mobile device as claimed in claim 17 , wherein the first signal source is electrically coupled through the first connection element to the metal housing.

19. The mobile device as claimed in claim 17 , wherein the metal layer does not dispose on the second protruded portion of the dielectric substrate.

20. The mobile device as claimed in claim 14 , further comprising a first region which is defined by the metal layer and is formed by a portion of the dielectric substrate, and wherein the metal layer substantially does not dispose on the first region.

21. The mobile device as claimed in claim 20 , wherein a vertical projection of the first slit at least partially overlaps the first region of the dielectric substrate.

22. The mobile device as claimed in claim 14 , wherein the metal layer does not dispose on the first protruded portion of the dielectric substrate.

23. The mobile device as claimed in claim 1 , further comprising:
a first RF (Radio Frequency) module; and
a first matching circuit, wherein the first RF module and the first matching circuit are disposed on the dielectric substrate, and wherein the first signal source is electrically coupled to the first RF module and the first matching circuit.

24. The mobile device as claimed in claim 1 , further comprising:
a second signal source;
a second feeding element; and
a second connection element;
wherein the second signal source and the second feeding element are disposed on the dielectric substrate, and wherein the second connection element is disposed on the second protruded portion;
wherein the second signal source is electrically coupled through the second feeding element and the second connection element to the metal housing.

25. The mobile device as claimed in claim 1 , further comprising:
one or more electronic components, disposed on the dielectric substrate.

26. The mobile device as claimed in claim 1 , wherein the first connection element is a metal spring.

27. The mobile device as claimed in claim 1 , wherein at least one portion of the metal housing is configured to receive and transmit at least one wireless signal.

Assignees

• Htc Corp

Inventors

• Tsai Tiao-Hsing
• Chiu Chien-Pin
• Wu Hsiao-Wei
• Kuo Chao-Chiang

Classifications

• H01Q1/50

  Structural association of antennas with earthing switches, lead-in devices or lightning protectors · CPC title

• H01Q13/106

  Microstrip slot antennas (patch antenna elements H01Q9/0407) · CPC title

• H01Q1/243 Primary

  with built-in antennas · CPC title

• H01Q1/2266

  disposed inside the computer · CPC title

• H01Q1/44

  using equipment having another main function to serve additionally as an antenna {, e.g. means for giving an antenna an aesthetic aspect}(H01Q1/27 - H01Q1/34 take precedence) · CPC title