Superconducting resonator to limit vertical connections in planar quantum devices

US10833390B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10833390-B2
Application numberUS-201916457142-A
CountryUS
Kind codeB2
Filing dateJun 28, 2019
Priority dateOct 30, 2017
Publication dateNov 10, 2020
Grant dateNov 10, 2020

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A set of superconducting devices is interconnected in a lattice that is fabricated in a single two-dimensional plane of fabrication such that a superconducting connection can only reach a first superconducting device in the set while remaining in the plane by crossing a component of a second superconducting device that is also located in the plane. A superconducting coupling device having a span and a clearance height is formed in the superconducting connection of the first superconducting device. A section of the superconducting coupling device is separated from the component of the second superconducting device by the clearance in a parallel plane. A potential of a first ground plane on a first side of the component is equalized with a second ground plane on a second side of the component using the superconducting coupling device.

First claim

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What is claimed is: 1. A superconducting coupling device comprising: a superconducting coupler comprising a superconducting connection between a first superconducting device fabricated in a plane and a second superconducting device fabricated in the plane, wherein a section of the superconducting coupler lies in a parallel plane at a clearance from the plane; a first ground plane on a first side of a component of the second superconducting device, wherein the clearance at least equals a threshold clearance, and wherein an insulator is formed between the component and the superconducting coupler to create the clearance; a second ground plane on a second side of the component of the second superconducting device; and an equalizing structure, wherein the equalizing structure equalizes a potential of the first ground plane with a potential of the second ground plane. 2. The superconducting coupling device of claim 1 , wherein the superconducting coupler comprises a resonator, and wherein the resonator is formed using a wirebond. 3. The superconducting coupling device of claim 1 , wherein the superconducting coupler comprises a resonator, and wherein the resonator is formed using a coplanar waveguide. 4. The superconducting coupling device of claim 1 , further comprising: a ground plane coupling between the first ground plane and the second ground plane. 5. The superconducting coupling device of claim 4 , wherein the ground plane coupling is a superconducting coupling. 6. The superconducting coupling device of claim 4 , wherein the ground plane coupling is a superconducting coupling, wherein the superconducting coupler comprises a superconducting resonator, and wherein a shape and a material of the superconducting resonator and the superconducting coupling are same as a shape and a material of the superconducting resonator. 7. The superconducting coupling device of claim 1 , further comprising: a rising section of the superconducting coupler, wherein the rising section couples one end of the superconducting coupler to one section of the superconducting connection on the first side of the component; and a rejoining section of the superconducting coupler, wherein the rejoining section couples a second end of the superconducting coupler to the second section of the superconducting connection on an opposite side of the component. 8. The superconducting coupling device of claim 1 , wherein the first superconducting device is a first qubit, wherein the second superconducting device is a second qubit, wherein the superconducting connection of the first superconducting device is a read line of the first qubit, and wherein the component of the second superconducting device is a resonant line of the second qubit. 9. A method comprising: forming a superconducting coupler comprising a superconducting connection between a first superconducting device fabricated in a plane and a second superconducting device fabricated in the plane, wherein a section of the superconducting coupler lies in a parallel plane at a clearance from the plane; forming a first ground plane on a first side of a component of the second superconducting device, wherein the clearance at least equals a threshold clearance, and wherein an insulator is formed between the component and the superconducting coupler to create the clearance; forming a second ground plane on a second side of the component of the second superconducting device; and forming an equalizing structure, wherein the equalizing structure equalizes a potential of the first ground plane with a potential of the second ground plane. 10. The method of claim 9 , wherein the superconducting coupling device comprises a resonator, and wherein the resonator is formed using a wirebond. 11. The method of claim 9 , wherein the superconducting coupling device comprises a resonator, and wherein the resonator is formed using a coplanar waveguide. 12. The method of claim 9 , further comprising: forming, as a part of forming the superconducting coupling device, a ground plane coupling between the first ground plane and the second ground plane. 13. The method of claim 12 , wherein the ground plane coupling is a superconducting coupling. 14. The method of claim 12 , wherein the ground plane coupling is a superconducting coupling, wherein the superconducting coupling device further comprises a superconducting resonator, and wherein the superconducting resonator and the superconducting coupling are formed using different superconducting materials. 15. The method of claim 9 , further comprising: forming a rising section of the coupling resonator, wherein the rising section couples one end of the coupling resonator to one section of the superconducting connection on the first side of the component; and forming a rejoining section of the superconducting coupling device, wherein the rejoining section couples a second end of the superconducting coupling device to the second section of the superconducting connection on an opposite side of the component. 16. The method of claim 9 , wherein the clearance at least equals a threshold clearance, and wherein an insulator is formed between the component and the superconducting coupling device to create the clearance. 17. The method of claim 9 , wherein the first superconducting device is a first qubit, wherein the second superconducting device is a second qubit, wherein the superconducting connection of the first superconducting device is a read line of the first qubit, and wherein the component of the second superconducting device is a resonant line of the second qubit. 18. A superconductor fabrication system comprising a lithography component, wherein the superconductor fabrication system when operated on a die to fabricate a superconductor device performs operations comprising: forming a superconducting coupler comprising a superconducting connection between a first superconducting device fabricated in a plane and a second superconducting device fabricated in the plane, wherein a section of the superconducting coupler lies in a parallel plane at a clearance from the plane; forming a first ground plane on a first side of a component of the second superconducting device, wherein the clearance at least equals a threshold clearance, and wherein an insulator is formed between the component and the superconducting coupler to create the clearance; forming a second ground plane on a second side of the component of the second superconducting device; and forming an equalizing structure, wherein the equalizing structure equalizes a potential of the first ground plane with a potential of the second ground plane. 19. The superconductor fabrication system of claim 18 , wherein the superconducting coupling device comprises a resonator, and wherein the resonator is formed using a wirebond. 20. The superconductor fabrication system of claim 18 , wherein the superconducting coupling device comprises a resonator, and wherein the resonator is formed using a coplanar waveguide. 21. The superconductor fabrication system of claim 18 , further comprising: forming, as a part of forming the superconducting coupling device, a ground plane coupling between the first ground plane and the second ground plane. 22. The superconductor fabrication system of claim 21 , wherein the ground plane coupling is a superconducting coupling. 23. The superconductor fabrication system of claim 21 , wherein the ground plane coupling is a superconduct

Assignees

Inventors

Classifications

  • Semiconductor qubit devices comprising a plurality of quantum mechanically interacting semiconductor quantum dots, e.g. Loss-DiVincenzo spin qubits · CPC title

  • Permanent superconducting devices · CPC title

  • H10N60/01Primary

    Manufacture or treatment · CPC title

  • H01P7/086Primary

    Coplanar waveguide resonators (H01P7/088 takes precedence) · CPC title

  • Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic · CPC title

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What does patent US10833390B2 cover?
A set of superconducting devices is interconnected in a lattice that is fabricated in a single two-dimensional plane of fabrication such that a superconducting connection can only reach a first superconducting device in the set while remaining in the plane by crossing a component of a second superconducting device that is also located in the plane. A superconducting coupling device having a spa…
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification H10N60/01. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 10 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).