Laminate and kit

Patent metadata

Field	Value
Publication number	US-10833272-B2
Application number	US-201715787990-A
Country	US
Kind code	B2
Filing date	Oct 19, 2017
Priority date	Apr 28, 2015
Publication date	Nov 10, 2020
Grant date	Nov 10, 2020

Abstract

Provided are a laminate which includes an organic semiconductor film, a water-soluble resin layer, and a photosensitive resin layer and in which cracks are unlikely to occur; and a kit.
The laminate includes a water-soluble resin layer containing a water-soluble resin and a photosensitive resin layer containing a photosensitive resin, which are provided in this order on an organic semiconductor film. The water-soluble resin layer and the photosensitive resin layer are adjacent to each other, the water-soluble resin is at least one of polyvinylpyrrolidone having a weight-average molecular weight of 300,000 or greater or polyvinyl alcohol having a weight-average molecular weight of 15,000 or greater, and the photosensitive resin has a weight-average molecular weight of 30,000 or greater.

First claim

What is claimed is:

1. A laminate comprising:
a water-soluble resin layer which contains a water-soluble resin and a photosensitive resin layer which contains a photosensitive resin, which are provided in this order on an organic semiconductor film,
wherein the water-soluble resin layer and the photosensitive resin layer are adjacent to each other,
the water-soluble resin is at least one of polyvinylpyrrolidone having a weight-average molecular weight of 300,000 or greater or polyvinyl alcohol having a weight-average molecular weight of 15,000 or greater,
the photosensitive resin has a weight-average molecular weight of 30,000 or greater, and the thickness of the water-soluble resin layer is in a range of 0.1 to 10 μm, and the thickness of the photosensitive resin layer is in a range of 0.1 to 10 μm.

2. The laminate according to claim 1 ,
wherein the photosensitive resin layer is a chemically amplified photosensitive resin layer.

3. The laminate according to claim 1 ,
wherein the photosensitive resin layer is a negative type photosensitive resin layer.

4. The laminate according to claim 1 ,
wherein an exposed portion of the photosensitive layer is hardly soluble in a developer containing an organic solvent.

5. The laminate according to claim 1 ,
wherein the photosensitive resin has a cyclic ether ester structure.

6. The laminate according to claim 1 ,
wherein the photosensitive resin has a constitutional unit having a group represented by Formula (1),

in Formula (1), R 1 represents a hydrogen atom or an alkyl group, L 1 represents a carbonyl group or a phenylene group, and R 21 to R 27 each independently represent a hydrogen atom or an alkyl group.

7. The laminate according to claim 1 ,
wherein the weight-average molecular weight of the photosensitive resin is 40,000 or greater.

8. The laminate according to claim 1 ,
wherein the amount of solvent contained in the water-soluble resin layer is in a range of 1% to 10% by mass, and
the amount of organic solvent contained in the photosensitive resin layer is in a range of 1% to 10% by mass.

9. A laminate comprising:
a water-soluble resin layer which contains a water-soluble resin and a photosensitive resin layer which contains a photosensitive resin, which are provided in this order on an organic semiconductor film,
wherein the water-soluble resin layer and the photosensitive resin layer are adjacent to each other,
the water-soluble resin is at least one of polyvinylpyrrolidone having a weight-average molecular weight of 300,000 or greater or polyvinyl alcohol having a weight-average molecular weight of 15,000 or greater,
the photosensitive resin has a weight-average molecular weight of 30,000 or greater, and
the amount of component having a weight-average molecular weight of 1,000 or less, which is contained in the water-soluble resin, is 10% by mass or less of the entire water-soluble resin component.

10. A laminate comprising:
a water-soluble resin layer which contains a water-soluble resin and a photosensitive resin layer which contains a photosensitive resin, which are provided in this order on an organic semiconductor film,
wherein the water-soluble resin layer and the photosensitive resin layer are adjacent to each other,
the water-soluble resin is at least one of polyvinylpyrrolidone having a weight-average molecular weight of 300,000 or greater or polyvinyl alcohol having a weight-average molecular weight of 15,000 or greater,
the photosensitive resin has a weight-average molecular weight of 30,000 or greater, and
the amount of component having a weight-average molecular weight of 1,000 or less, which is contained in the photosensitive resin, is 10% by mass or less of the entire photosensitive resin component.

11. The laminate according to claim 1 , further comprising:
a device substrate which is provided on a surface of the organic semiconductor film on a side far from the water-soluble resin layer.

12. The laminate according to claim 1 ,
wherein the water-soluble resin layer is provided on a surface of the organic semiconductor film.

Assignees

• Fujifilm Corp

Inventors

• Masuda Seiya
• Kamochi Yoshitaka
• Nakamura Atsushi

Classifications

• C08F220/281

  and containing only one oxygen, e.g. furfuryl (meth)acrylate or 2-methoxyethyl (meth)acrylate · CPC title

• G03F7/32

  Liquid compositions therefor, e.g. developers · CPC title

• G03F7/039

  Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023) · CPC title

• B32B27/30 Primary

  comprising vinyl {(co)polymers; comprising acrylic (co)polymers} · CPC title

• B32B27/08

  of synthetic resin · CPC title