Flexible organic light emitting diode display device and method of fabricating same

Patent metadata

Field	Value
Publication number	US-10833135-B2
Application number	US-201816316353-A
Country	US
Kind code	B2
Filing date	Dec 20, 2018
Priority date	Oct 16, 2018
Publication date	Nov 10, 2020
Grant date	Nov 10, 2020

Abstract

A flexible organic light emitting diode (OLED) display device and a method for fabricating the same are disclosed. The flexible OLED display device includes a first flexible substrate, an inorganic layer, a second flexible substrate, a thin film transistor (TFT) layer, and an OLED light emitting layer; wherein the flexible OLED display device includes a display area and a non-display area. The first flexible substrate and the inorganic layer are located in the display area, and the second flexible substrate and the TFT layer extend from the display area to the non-display area.

First claim

What is claimed is:

1. A flexible organic light emitting diode (OLED) display device, comprising:
a first flexible substrate;
an inorganic layer disposed on a surface of the first flexible substrate;
a second flexible substrate disposed on a surface of the inorganic layer;
a thin film transistor (TFT) layer and an organic light emitting diode (OLED) light emitting layer disposed on a surface of the second flexible substrate;
wherein the flexible OLED display device comprises a display area and a non-display area located at an end of the display area, the first flexible substrate and the inorganic layer are only disposed in the display area, and the second flexible substrate and the TFT layer extend from the display area to the non-display area.

2. The flexible OLED display device of claim 1 , wherein a material of the inorganic layer is silicon oxynitride.

3. The flexible OLED display device of claim 1 , wherein a material of the first flexible substrate is polyimide, and a material of the second flexible substrate is the same as the material of the first substrate.

4. The flexible OLED display device of claim 1 , wherein a thickness of the first flexible substrate is greater than a thickness of the inorganic layer, and a thickness of the second flexible substrate is the same as the thickness of the first flexible substrate.

5. A method of fabricating a flexible organic light emitting diode OLED display device, comprising:
S 10 , providing a glass substrate, coating a surface of the glass substrate with a first flexible substrate, the first flexible substrate having a bending region and a non-bending region;
S 20 , forming a release layer on a portion of the first flexible substrate at the bending region;
S 30 , forming an inorganic layer on a surface of the first flexible substrate, wherein the inorganic layer completely covers the release layer;
S 40 , coating a second flexible substrate on a surface of the inorganic layer;
S 50 , sequentially forming a thin film transistor TFT layer and an OLED light emitting layer on a surface of the second flexible substrate; and
S 60 , removing the glass substrate, flipping over the first flexible substrate, and peeling off the portion of the first flexible substrate, the release layer, and a portion of the inorganic layer at the bending region;
S 70 , bending a portion of the second flexible substrate and a portion of the TFT layer at the bending region, and binding a flexible circuit board and a driving circuit to form the flexible OLED display device.

6. The method of fabricating a flexible OLED display device of claim 5 , wherein the step S 20 further comprises:
S 201 , using a mask to mask a portion of the first flexible substrate at the non-bending area; and
S 202 , spray coating a partial releasing agent on a remaining portion of the first flexible substrate that is not masked by the mask to form the release layer.

7. The method of fabricating a flexible OLED display device of claim 5 , wherein the step S 60 further comprises:
S 601 , removing the substrate, and flipping over the first flexible substrate;
S 602 , performing a laser half-cutting to the first flexible substrate at the portion of the bending region; and
S 603 , peeling off the portion of the first flexible substrate, the release layer, and the portion of the inorganic layer at the bending region.

8. The method of fabricating a flexible OLED display device of claim 5 , wherein a material of the inorganic layer is silicon oxynitride.

9. The method of fabricating a flexible OLED display device of claim 5 , wherein a material of the first flexible substrate is polyimide, and a material of the second flexible substrate is the same as the material of the first substrate.

10. The method of fabricating a flexible OLED display device of claim 5 , wherein a thickness of the first flexible substrate is greater than a thickness of the inorganic layer, and a thickness of the second flexible substrate is the same as the thickness of the first flexible substrate.

Assignees

• Wuhan China Star Optoelectronics Semiconductor Display Tech Co Ltd

Inventors

• Chen Jifeng
• Jia Yongzhen

Classifications

• H10K59/12

  Active-matrix OLED [AMOLED] displays · CPC title

• H10K77/111 Primary

  Flexible substrates · CPC title

• Y02E10/549

  Organic PV cells · CPC title

• H01L27/3244 Primary

  Electricity · mapped topic

• H01L51/56

  Electricity · mapped topic