Multilayer electronic component

Patent metadata

Field	Value
Publication number	US-10832869-B2
Application number	US-201916279070-A
Country	US
Kind code	B2
Filing date	Feb 19, 2019
Priority date	Aug 30, 2018
Publication date	Nov 10, 2020
Grant date	Nov 10, 2020

Abstract

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein the external electrodes including, respectively, electrode layers electrically connected to the internal electrodes, respectively, and conductive resin layers disposed on the electrode layers, respectively.

First claim

What is claimed is:

1. A multilayer ceramic electronic component comprising:
a ceramic body having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, and including dielectric layers and a plurality of internal electrodes disposed to face each other in the first direction with each of the dielectric layers interposed therebetween; and
multi-layer external electrodes disposed on the third and fourth surfaces of the ceramic body and electrically connected to the internal electrodes, respectively,
wherein the ceramic body includes an active portion in which capacitance is formed by including the plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween and cover portions disposed on upper and lower surfaces of the active portion in the first direction, respectively,
the multi-layer external electrodes each including an electrode layer electrically connected to the plurality of internal electrodes, respectively, and a conductive resin layer disposed on the electrode layer, each conductive resin layer extending onto and into contact with the first and second surfaces of the ceramic body, and
a ratio of a thickness of each of the cover portions in the first direction to a first distance in the second direction from one end of each respective multi-layer external electrode, including the conductive resin layer contacting the first or second surface of the ceramic body, to an opposing outermost surface of the respective multi-layer external electrode in the second direction, ranges from 20 to 60%.

2. The multilayer ceramic electronic component of claim 1 , wherein a ratio of the first distance to a length of the ceramic body in the second direction ranges from 20 to 35%.

3. The multilayer ceramic electronic component of claim 1 , wherein the electrode layer of each multi-layer external electrode includes one or more conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

4. The multilayer ceramic electronic component of claim 1 , wherein the conductive resin layer of each multi-layer external electrode includes one or more conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof, and a base resin.

5. The multilayer ceramic electronic component of claim 1 , wherein a thickness of each internal electrode is less than 1 μm.

6. The multilayer ceramic electronic component of claim 1 , wherein a thickness of each dielectric layer is less than 2.8 μm.

7. The multilayer ceramic electronic component of claim 1 , wherein td>2×te in which dimension “td” is a thickness of each dielectric layer and dimension “te” is a thickness of each internal electrode.

8. A multilayer ceramic electronic component comprising:
a ceramic body having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, and including dielectric layers and a plurality of internal electrodes disposed to face each other in the first direction with each of the dielectric layers interposed therebetween, wherein a thickness of each dielectric layer is less than 2.8 μm; and
multi-layer external electrodes disposed on the third and fourth surfaces of the ceramic body and electrically connected to the internal electrodes, respectively,
wherein the ceramic body includes an active portion in which capacitance is formed by including the plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween and cover portions disposed on upper and lower surfaces of the active portion in the first direction, respectively,
the multi-layer external electrodes each including an electrode layer electrically connected to the plurality of internal electrodes, respectively, and a conductive resin layer disposed on the electrode layer, each conductive resin layer extending onto and into contact with the first and second surfaces of the ceramic body, and
a first distance in the second direction from one end of each respective multi-layer external electrode, including the conductive resin layer contacting the first or second surface of the ceramic body, to an opposing outermost surface of the respective multi-layer external electrode in the second direction, is configured such that:
a first ratio of a thickness of each of the cover portions in the first direction to the first distance ranges from 20 to 60%, and
a second ratio of the first distance to a length of the ceramic body in the second direction ranges from 20 to 35%.

9. The multilayer ceramic electronic component of claim 8 , wherein the electrode layer of each multi-layer external electrode includes one or more conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

10. The multilayer ceramic electronic component of claim 8 , wherein the conductive resin layer of each multi-layer external electrode includes one or more conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof, and a base resin.

11. The multilayer ceramic electronic component of claim 8 , wherein a thickness of each internal electrode is less than 1 μm.

12. The multilayer ceramic electronic component of claim 8 , wherein td>2×te in which dimension “td” is a thickness of each dielectric layer and dimension “te” is a thickness of each internal electrode.

Assignees

• Samsung Electro Mech

Inventors

• Kim Je Jung
• Jeong Do Young
• Shin Dong Hwi
• Park Sang Soo
• Shin Woo Chul

Classifications

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/1209

  characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence) · CPC title

• H01G4/232 Primary

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/0085

  Fried electrodes · CPC title