Wood inlay card and method for making the same

US10832115B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10832115-B2
Application numberUS-201916421943-A
CountryUS
Kind codeB2
Filing dateMay 24, 2019
Priority dateNov 29, 2016
Publication dateNov 10, 2020
Grant dateNov 10, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A transaction card construction and a method for making a transaction card are provided for improving card performance. The transaction card construction comprises an inlay component comprising wood and a housing component. The inlay may comprise a wood or wood-containing layer and a backer layer. The backer layer may comprise the same or a different wood or wood-containing layer, or a non-woven fiber material.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a transaction card, comprising: softening a first wood layer and a second wood layer; thinning the first and second wood layers; joining the thinned and softened first wood layer, and the thinned and softened second wood layer to form a laminated layer, the laminated layer having a thickness of between 1/24 and 1/16 of an inch; forming a wood inlay from the laminated layer; and joining the wood inlay and a housing component of the card via a surface of the wood inlay and a surface of the housing component, the housing component being configured to receive the wood inlay. 2. The method of claim 1 , further comprising: disposing a data storage component between the wood inlay and the housing component. 3. The method of claim 1 , further comprising: forming a first wood grain pattern on the first wood layer. 4. The method of claim 3 , further comprising: forming a second wood grain pattern on the second wood layer. 5. The method of claim 4 , wherein forming the laminated layer comprises orienting the first wood layer with respect to the second wood layer such that a wood grain direction of the first wood layer is non-parallel with a wood grain direction of the second wood layer. 6. The method of claim 1 , further comprising: coating a surface of the wood inlay with a protective layer. 7. The method of claim 6 , wherein the protective layer comprises at least one of lacquer, shellac, urethane, polyurethane, or acrylic. 8. The method of claim 1 , further comprising: adding card information to a surface of the housing component. 9. The method of claim 8 , wherein the housing component is formed of a material that is clear after manufacturing is complete, the card information being visible through the housing component. 10. The method of claim 9 , wherein the housing component comprises a thermoplastic elastomer (TPE). 11. The method of claim 10 , wherein the TPE comprises at least one of a polyester elastomer, a block copolymer, a thermoplastic olefin, an elastomeric alloy, a thermoplastic polyurethane, a thermoplastic copolyester, or a thermoplastic polyamide. 12. The method of claim 1 , wherein the housing component comprises an opaque material. 13. The method of claim 1 , wherein the housing component comprises at least one of Polyvinyl Chloride (PVC) or Polycarbonate (PC). 14. The method of claim 1 , wherein the first wood layer comprises a composite material. 15. The method of claim 1 , wherein the first wood layer comprises a medium-density fiberboard. 16. The method of claim 1 , wherein the first wood layer comprises a natural wood. 17. The method of claim 1 , wherein the wood inlay comprises a visual blocker layer between the thinned first and second wood layers. 18. The method of claim 17 , wherein the visual blocker layer comprises an opaque material. 19. A method of manufacturing a transaction card, comprising: softening a first wood layer and a second wood layer, a material of the first wood layer being different from a material of the second wood layer; thinning the first and second wood layers; joining the thinned and softened first wood layer, and the thinned and softened second wood layer to form a laminated layer, the laminated layer having a thickness of between 1/24 and 1/16 of an inch; forming a wood inlay from the laminated layer; and joining the wood inlay and a housing component of the card via a surface of the wood inlay and a surface of the housing component, the housing component being configured to receive the wood inlay. 20. A method of manufacturing a transaction card, comprising: softening a first wood layer and a second wood layer, a material of the first and second wood layers being the same material; thinning the first and second wood layers; joining the thinned and softened first wood layer, and the thinned and softened second wood layer to form a laminated layer, the laminated layer having a thickness of between 1/24 and 1/16 of an inch; forming a wood inlay from the laminated layer; and joining the wood inlay and a housing component of the card via a surface of the wood inlay and a surface of the housing component, the housing component being configured to receive the wood inlay.

Assignees

Inventors

Classifications

  • Record carriers for use with machines and with at least a part designed to carry digital markings · CPC title

  • Cards, e.g. identity cards, credit cards · CPC title

  • Constructional details · CPC title

  • of wood (B32B21/13 takes precedence) · CPC title

  • the record carrier being at least partially made by a molding process (molding in general B29C45/14) · CPC title

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What does patent US10832115B2 cover?
A transaction card construction and a method for making a transaction card are provided for improving card performance. The transaction card construction comprises an inlay component comprising wood and a housing component. The inlay may comprise a wood or wood-containing layer and a backer layer. The backer layer may comprise the same or a different wood or wood-containing layer, or a non-wove…
Who is the assignee on this patent?
Capital One Services Llc
What technology area does this patent fall under?
Primary CPC classification G06K19/07724. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Nov 10 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).