Sensor skin

Patent metadata

Field	Value
Publication number	US-10830736-B2
Application number	US-201715610567-A
Country	US
Kind code	B2
Filing date	May 31, 2017
Priority date	Jun 13, 2016
Publication date	Nov 10, 2020
Grant date	Nov 10, 2020

Abstract

The disclosure herein relates to a measuring system for determining damage to components including at least one fiber-reinforced plastics material, comprising sensors that can be or are arranged on a component to be mutually spaced, the sensors distributed over a curved surface of the component in the use position. In order provide a measuring system by which it is possible to obtain fiber-reinforced plastics components economically and with reasonable outlay, and by which process parameters and/or state variables can be reliably obtained during production and operation of the component, it is proposed to provide the component with a substrate that is different from the component and on which the sensors can be or are arranged, the substrate being flexible, and for the sensors arranged on the flexible substrate to form a measuring device.

First claim

The invention claimed is:

1. A system for measuring damage to a fiber-reinforced plastics component, the system comprising:
a flexible substrate attached on the fiber-reinforced plastics component, the flexible substrate being in a form of a film made from a thermoplastic high-performance polymer that forms a material-uniting connection with a matrix of the fiber-reinforced plastics component when the fiber-reinforced plastics component is cured;
one or more interposer structures on the flexible substrate before the fiber-reinforced plastics component is cured;
a plurality of sensors attached to the interposer structures after the fiber-reinforced plastics component has been cured to form a sensor arrangement such that the interposer structures are equipped with the plurality of sensors only after the fiber-reinforced plastics component has been cured;
wherein the sensors are in a form of one or more electronic chips and the interposer structures are configured such that the one or more electronic chips are pinned thereon and the interposer structures protect the sensors from high temperature;
wherein the plurality of sensors, placed on the flexible substrate, are distributed over a curved surface of the fiber-reinforced plastics component, to which the flexible substrate is attached, in a use position,
wherein the plurality of sensors on the flexible substrate form a measuring device.

2. The system of claim 1 , wherein the measuring device is configured to monitor production of the component and/or operation of the component by the plurality of sensors.

3. The system of claim 1 , wherein the plurality of sensors of the measuring device is formed on the flexible substrate as an ultrasonic transducer.

4. The system of claim 3 , wherein the ultrasonic transducer is formed as a micromachined capacitive ultrasonic transducer or as a piezoelectric thin film.

5. The system of claim 1 , wherein the measuring device is configured to perform a pulse-echo method.

6. The system of claim 1 , wherein the measuring device is configured to perform a capacitive measurement by the sensors.

7. The system of claim 1 , wherein the measuring device forms, on the substrate in both planar extension directions thereof, a matrix of sensors that are evenly spaced in both planar extension directions, in particular sensors having identical spacing in the directions.

8. The system of claim 1 , wherein conductive tracks, multiplexers, or other electronic devices are applied to and integrated in the flexible substrate.

9. The system of claim 1 , wherein the flexible substrate can be or is connected to the component by a co-bonding or co-curing process.

10. The system of claim 1 , wherein the thermoplastic high-performance polymer is made of at least one of a polyimide, polyetherimide, a polysulfone, or a polyethersulfone.

11. A method of measuring damage to a fiber-reinforced plastics component having a curved surface, the method comprising:
attaching a flexible substrate on the fiber-reinforced plastics component, the flexible substrate being in a form of a film made from a thermoplastic high-performance polymer that forms a material-uniting connection with a matrix of the fiber-reinforced plastics component when the fiber-reinforced plastics component is cured;
arranging one or more interposer structures on the flexible substrate before the fiber-reinforced plastics component is cured;
attaching a plurality of sensors to the interposer structures after the fiber-reinforced plastics component has been cured to form a sensor arrangement, such that the interposer structures are equipped with the plurality of sensors only after the fiber-reinforced plastics component has been cured;
wherein the sensors are in a form of one or more electronic chips and the interposer structures are configured such that the one or more electronic chips are pinned thereon and the interposer structures protect the sensors from high temperature;
monitoring production of the fiber-reinforced plastics component; and
detecting damage to the fiber-reinforced plastics component during operation thereof.

12. The system of claim 1 , wherein the flexible substrate is formed as liquid-crystal polymer (LCP).

Assignees

• Airbus Defence & Space Gmbh

Inventors

• Friedberger Alois
• Helwig Andreas
• Buderath Matthias

Classifications

• G01N29/043 Primary

  in the interior, e.g. by shear waves · CPC title

• G01N2291/2694

  Wings or other aircraft parts · CPC title

• G01N2291/0231

  Composite or layered materials · CPC title

• G01N2291/106

  one or more transducer arrays · CPC title

• B32B27/281

  comprising polyimides · CPC title