Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device

Patent metadata

Field	Value
Publication number	US-10829670-B2
Application number	US-201815875792-A
Country	US
Kind code	B2
Filing date	Jan 19, 2018
Priority date	Jul 21, 2015
Publication date	Nov 10, 2020
Grant date	Nov 10, 2020

Abstract

A curable and hygroscopic resin composition for sealing electronic devices, comprising: a radically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a photo-radical polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition.

wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of —O—, —S—, —CO—, and —NH—, between a carbon-carbon bond of the above-described hydrocarbon group; M designates a boron or aluminum atom; n is an integer of 2 to 20; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.

First claim

The invention claimed is:

1. A curable and hygroscopic resin composition for sealing electronic devices, comprising:
a radically polymerizable compound (a);
a hygroscopic compound (b) containing a structure represented by Formula (1); and
a photo-radical polymerization initiator (c):

wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of —O—, —S—, —CO—, and —NH—, between a carbon-carbon bond of the above-described hydrocarbon group; provided that, a part of hydrogen atoms, which the forgoing groups (i), (ii) and (iii) each have, may be substituted with a hydroxyl group, a halogen atom or a cyano group; M designates a boron atom or an aluminum atom; n is an integer of 2 to 20; plural Ws and M's may be the same or different from each other, respectively; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.

2. The curable and hygroscopic resin composition for sealing electronic devices described in claim 1 , wherein the radically polymerizable compound (a) is a (meth)acrylate compound.

3. The curable and hygroscopic resin composition for sealing electronic devices described in claim 1 , wherein the radically polymerizable compound (a) has one or more alicyclic skeletons.

4. The curable and hygroscopic resin composition for sealing electronic devices described in claim 3 , wherein the alicyclic skeleton is at least one of a tricyclodecane skeleton and a hydrogenated bisphenol A skeleton.

5. The curable and hygroscopic resin composition for sealing electronic devices described in claim 1 , comprising a solvent (d), wherein the boiling point of the solvent (d) is 100° C. or more.

6. The curable and hygroscopic resin composition for sealing electronic devices described in claim 5 , wherein the boiling point of the solvent (d) is 160° C. or more.

7. The curable and hygroscopic resin composition for sealing electronic devices described in claim 5 , wherein the boiling point of the solvent (d) is 240° C. or more.

8. The curable and hygroscopic resin composition for sealing electronic devices described in claim 5 , wherein the solvent (d) is a naphthene-series solvent or an isoparaffin-series solvent.

9. The curable and hygroscopic resin composition for sealing electronic devices described in claim 5 , wherein the ratio d/b of the content of the solvent (d) to the content of the hygroscopic compound (b) is 2 or less.

10. The curable and hygroscopic resin composition for sealing electronic devices described in claim 1 , wherein the hygroscopic compound (b) is represented by Formula (2):

wherein, in Formula (2), R 1 has the same meaning as R in Formula (1).

11. The curable and hygroscopic resin composition for sealing electronic devices described in claim 1 , wherein the hygroscopic compound (b) is contained in an amount of 0.1 mass % or more and 50 mass % or less, in 100 mass % of the curable and hygroscopic resin composition.

12. The curable and hygroscopic resin composition for sealing electronic devices described in claim 2 , wherein the radically polymerizable compound (a) has one or more alicyclic skeletons.

Assignees

• Furukawa Electric Co Ltd

Inventors

• Mieda Tetsuya

Classifications

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W76/40

  Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10K50/846

  comprising getter material or desiccants · CPC title